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발효 애기똥풀 주정추출물의 항균 및 항산화활성에 있어 발효 균주의 효과
Ham Young-Joo,Shin Young-Keun,Choi Nag-Jin,Kang Sang-Mo 한국유기농업학회 2013 韓國有機農業學會誌 Vol.21 No.3
This study was conducted to investigate the effect of fermentation on biological activity of Chelidonium majus var asiaticum and to screen effective starter culture strains. Antibacterial activity against to Staphylococcus aureus, Listeria monocytogenes and Salmonella gallinarum and antioxidant activity as free radical scavenging activity by using DPPH were tested. Total six starter culture strains, two of Lactobacillus brevis, one of Lactobacillus plantarum and three of Saccharomyces cerevisiae were used. Plant extract was prepared after fermentation by using ethanol. All strains showed normal growth in viable cell counts of fermented cultures and L. plantarum showed the highest cell growth significantly (p
함선영,송창규,박세희,김진우,조경모 大韓齒科保存學會 2009 Restorative Dentistry & Endodontics Vol.34 No.4
구강점막은 흡입되거나 압력을 받아, 병적이진 않으나 임상적으로 뚜렷한 변화를 일으키는 수많은 상황에 놓이게 된다. 협점막과 혀는 치아가 상실되었거나 여분의 공간이 존재하는 부위에서 돌기가 형성될 수 있다. 점막이 여분의 공간으로 압력을 받거나 흡입되어 섬유성 과증식이 발생하게 되는 것이다. 이번 증례보고에서는 구강점막의 섬유성 과증식의 처치에 대해 기술하고자 한다. 섬유성 과증식은 구강점막에 가해진 습관성 압력이나 흡입에 의해 형성될 수 있다. 섬유성 과증식의 치료는 단순 절제술과 원인을 제거하는 것이다. 또한 습관 조절이 재발을 방지하기 위한 중요한 요소가 된다. There are a number of situations where the oral mucosa can be sucked or pressed to produce relatively banal but clinical distinctive changes. The labial and buccal mucosa and tongue may develop protuberances in areas where a tooth is missing or extra space is present. The mucosa is pressed and sucked into theses paces, thus leading to the development of a fibrous hyperplasia. This case report describes the management of fibrous hyperplasia in oral mucosa. Fibrous hyperplasia can be formed by habitual pressure or suction in oral mucosa. Treatment of fibrous hyperplasia consists of simple excision and, if feasible, elimination of the cause. And habit control is a important factor for preventing recurrence.
Resilon을 이용한 근관충전 시 레진계열의 근관실러와 자가-접착 레진시멘트에 따른 미세누출
함선영,김진우,신혜진,조경모,박세희 大韓齒科保存學會 2008 Restorative Dentistry & Endodontics Vol.33 No.3
The purpose of this study was to compare the apical microleakage in root canal filled with Resilon by methacrylate-based root canal sealer or 2 different self-adhesive resin cements. Seventy single-rooted extracted human teeth were sectioned at the CEJ perpendicular to the long axis of the roots with diamond disk. Canal preparation was performed with crown-down technique using Profile NiTi rotary instruments and GG drill. Each canal was prepared to ISO size 40, .04 taper and 1 ㎜ short from the apex. The prepared roots were randomly divided into 4 experimental groups of 15 roots each and 5 roots each for positive and negative control group. The root canals were filled by lateral condensation as follows. Group 1: Gutta-percha with AH-26, Group 2: Resilon with RealSeal primer & sealer, Group 3: Resilon with Rely-X Unicem, Group 4: Resilon with BisCem. After stored in 37℃, 100% humidity chamber for 7 days, the roots were coated with 2 layers of nail varnish except apical 3 ㎜. The roots were then immersed in 1% methylene blue dye for 7 days. Apical microleakage was measured by a maximum length of linear dye penetration after roots were separated longitudinally. One way ANOVA and Scheffe' s post-hoc test were performed for statistical analysis. Group 1 showed the least apical leakage and there was no statistical significance between Group 2, 3, 4. According to the results, the self adhesive resin cement is possible to use as sealer instead of primer & sealant when root canal filled by Resilon. 본 연구의 목적은 Resilon을 이용한 근관충전시 methacrylate-based root canal sealer와 자가-접착 레진시멘트의 사용에 따른 치근단 미세누출을 비교해 보는 것이다. 70개 단근치를 ProFile NiTi rotary instrument와 GG drill을 이용해 근관성형 하였다. 치근을 4개의 실험군 (n = 15)과 2개의 대조군 (n = 5)으로 분류하여 측방가압법으로 충전하였다. <1군: GP + AH-26, 2군: Resilon + RealSeal primer&sealant, 3군: Resilon + Rely-X Unicem 4군: Resilon + Biscem> 7일간 1% 메틸렌블루 용액에 침적 후 수직절단하여 치근첨부터 색소의 침투도를 측정하였다. 1군에서 가장 적은 미세누출값이 측정되었고, 2, 3, 4군 간의 통계적 유의성은 없었다. 이번 연구의 결과에 따르면, 자가-접착 레진시멘트는 Resilon을 이용한 근관충전시 sealer로 사용이 가능하리라 생각된다.
함은영(Ham, Eun-Young),김규용(Kim, Gyu-Yong),구경모(Koo, Kyung-Mo),김홍섭(Kim, Hong-Seop),이의배(Lee, Eui-Bae),유재강(Yoo, Jae-Kang) 대한건축학회 2013 大韓建築學會論文集 : 構造系 Vol.29 No.12
In this study, it was conducted to evaluate a wider range of properties of adiabatic temperature rise in placement temperature condition considering hot weather, and temperature rise and temperature rise rate focused on cement content excluding replacement ratio of mineral admixtures were evaluated and compared with binder content. In order to set clear standard of adiabatic temperature rise in the previous section of hydration heat prediction equation was set by using time constant t0 considering final setting time and compared with measured values . As a result, temperature rise, temperature rise rate increased as cement content increased and especially it was confirmed that placing temperature affects temperature rise rate dominantly. In addition, properties of adiabatic temperature rise analyzed focusing on cement content showed higher correlation than the one analyzed focusing on the binder content. It was also showed that t0 in the previous section of hydration heat was closely indicated with final setting time and the prediction equation.
전단펀치-크리프 시험에 의한 리플로우 시간별 Pb-free 솔더 합금 접합부에 대한 고온 크리프 물성 평가
함영필(Young Pil Ham),허우진(Woo Jin Heo),유효선(Hyo Sun Yu),양성모(Sung Mo Yang) 한국자동차공학회 2013 한국 자동차공학회논문집 Vol.21 No.1
In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environmentfriendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.