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광센서를 위한 ZnO:Al 투명도전막의 제조 및 특성연구
박기철,이형기,심호섭 경북대학교 센서기술연구소 1995 연차보고서 Vol.1995 No.-
RF 마그네트론 스퍼터링법으로 AZO(ZnO:Al)막을 증착시켰다. 타겟내의 Al_2O_3의 첨가량, 기판온도, 분위기압, RF출력 등의 증착조건의 변화에 따라 제조된 AZO막의 조성, Al 도핑양, 구조적 특성 등을 XRD, SEM, EDS 및 RBS로 조사하였다. 이와 함께 전기적 및 광학적 특성을 Hall 효과 및 광투과도 특성을 통하여 조사하였다. 증착된 AZO막은 육방정의 wurtzite 구조였으며 모든 증착조건에서 기판에 수직으로 성장하는 (002)면 방향을 가지는 c-축배향성을 나타내었다. 증착된 AZO막내의 AB 도핑량은 타겟내의 무게비에 비례하였으며 Zn : O의 조성비토 1 : 1로 거의 일정하였다. 투명도전막으로서의 최적조건은 3wt%의 Al_2O_3이 첨가된 타겟으로 기판온도가 150℃, 분위기압이 2mTorr, RF출력이 150W로 증착한 경우였으며 이 때 비저항은 4.7×10 exp (4)Ω㎝, 캐리어 농도는 7.5×10 exp (20)㎝^-3이었다. 또 두께가 1500Å인 막의 경우 550㎚에서 광투고도가 90%이상이었으며 광학적 밴드갭은 3.53eV였다. Aluminium doped zinc oxide(AZO)films were prepared by RF magnetron sputtering method. The chemical compositions, doping concentrations, and the structural char-acteristics of the AzO films were studied in accordance with various deposition parameters, such as Al_2O_3 amount, substrate temperature and working pressure, by XRD, EDS, SEM and RBS. And The electrical and optical properties of AZO films were characterized by Hall effect and optical transmittance measurements. AZO films had were hexagonal wurtzite structure and dominent c-axis orientation. The Al doping concentration in the films were monotonically increased. The atomic ration of Zn : O were 1 : 1. The substrate, working pressure and rf power for optimum condition to fabricate the transparet conductive films using a target containing 3wt% Al_2O_3 were 150 ℃, 2mTorr and 150W, respectively. The resistivity and the carrier density of the AZO film prepared under this condition were 4.7 × 10 exp (-4) Ω㎝ and 7.5 × 10 exp (20) ㎝^-3, respectively. The optical transmittance of 1500 Å thick films at 550㎚ is ∼90% and optical energy band gap was 3.53eV.
Hyeong-Gi Lee,Kyung-Wook Paik IEEE 2015 IEEE transactions on components, packaging, and ma Vol.5 No.4
<P>Epoxy/BaTiO<SUB>3</SUB> composite embedded capacitor films (ECFs) were fabricated using dicyandiamide (DICY) as a curing agent and 3-(4-chlorophenyl)-1,1-dimethylurea as a curing accelerator to investigate the curing behavior and material properties of the ECFs with different curing systems and curing temperatures. The curing behaviors of the ECFs with three different curing systems were identified using differential scanning calorimeter analysis. The chemical structure changes of the ECFs were analyzed using Fourier transform infrared (FT-IR) spectroscopy. The intensity changes of a carbonyl peak in the FT-IR with different curing temperatures indicated that cyclization and hydrolysis reactions increased as curing temperature increased. In addition, the effect of this chemical structure change according to curing temperature was investigated in terms of glass transition temperature (T<SUB>g</SUB>), peel adhesion strength, and coefficients of thermal expansion. In the case of the ECF with low DICY content, the degree of cure increased as curing temperature increased and the improvement in the material properties of the ECF with low DICY content resulted mainly from the increase in the degree of cure. The material properties of the ECF with curing accelerator improved after the degree of cure reached 100% due to the low DICY amount and the addition of curing accelerator. However, the material properties of the ECF with high DICY content did not show improvement as curing temperature increased, because the dominance of the two primary amines of the DICY to cure promoted the cyclization and hydrolysis.</P>
Hyeong Gi Lee,Ji-Won Shin,Yong-Won Choi,Kyung-Wook Paik IEEE 2017 IEEE transactions on components, packaging, and ma Vol.7 No.3
<P>In this paper, wafer-level preapplied nonconductive films (NCFs) were used to interconnect the Cu pillar/Sn-Ag microbumps for 3-D through silicon via vertical interconnection. Thermocompression bonding is a common method to interconnect chips to substrates using NCFs, and thermocompression bonding time should be reduced to increase the bonding productivity. Therefore, isothermal bonding method without heating and cooling process in bonding profile was introduced to reduce the bonding time. Solder joints bonded by an isothermal bonding method were compared to those joints bonded by a conventional ramp-up bonding method that was consist of heating, bonding, and cooling process. Final joint gap was decreased using an isothermal bonding method due to higher heating rate, and solder joint morphology was also changed according to the final solder joint gap. Furthermore, solder joint should have enough contact area to substrate metal pads without solder wetting on the Cu pillar sidewall to avoid reliability problems by Sn consumption at the solder joint. Effects of isothermal bonding parameters were investigated in terms of the bonding pressure, temperature, and time to optimize the isothermal bonding parameters for good solder joint. As bonding pressure and bonding temperature increased, solder joint gap decreased because final joint gap was determined by bonding pressures and dynamic viscosity of NCFs. Isothermal bonding times can be reduced to 10 s, because the degree-of-cure of NCFs could be over 90% after 2.2 s. As a summary, solder joint bonded with NCFs using optimized isothermal bonding parameters showed excellent bump joint resistances and solder wetting on substrate metal pads.</P>
Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection
Hyeong-Gi Lee,Yong-Won Choi,Ji-Won Shin,Kyung-Wook Paik IEEE 2015 IEEE transactions on components, packaging, and ma Vol.5 No.11
<P>The 3-D stacking technologies have been developed, because higher packaging density demands to populate more circuits or chips on smaller substrate areas. Among 3-D packaging technologies, the through silicon via (TSV) technology that uses Cu pillar/Sn-Ag microbumps to vertically interconnect between chips is the most advanced state-of-the-art packaging method. However, the conventional reflow process with flux and underfill for bonding using Cu pillar/Sn-Ag microbumps has problems, such as process complexity, flux residues entrapment, and voids trapping. In this paper, the B-stage nonconductive films (NCFs) have been introduced to simplify the bonding processes and avoid flux residues entrapment and voids trapping. In addition, wafer-level packages (WLPs) using NCFs for the 3-D-TSV microbump interconnection have also been investigated. At first, the wafer-level NCFs lamination was conducted without voids and bubbles formation on a wafer. And the effect of epoxy resin types on the adhesion and elongation properties of NCFs laminated on a wafer was also investigated to optimize the wafer dicing process using laminated NCFs. After NCF-laminated Cu/Sn-Ag bumped wafer was diced into a single chip, singulated chips were bonded on substrate chips using a flip chip bonder. The electrical properties and reliabilities of the WLP packages using NCFs were evaluated and compared with the conventional single flip chip packages. As a result, the WLPs using the B-stage NCFs showed the same electrical interconnection properties as those of the conventional single flip chip packages.</P>
이국원 ( Lee Gug Won ),이동형 ( Lee Dong Hyeong ),신병섭 ( Sin Byeong Seob ),김기형 ( Kim Gi Hyeong ),윤만수 ( Yun Man Su ) 대한산부인과학회 2003 Obstetrics & Gynecology Science Vol.46 No.10
46,XY pure gonadal dysgenesis, also known as Swyer syndrome, is a disorder of sexual differentiation. Its characteristics include a female phenotype without the somatic stigmata of Turner`s syndrome, primary amenorrhea, sexual infatilism and bilateral str
백서 천식에서 면역 증강성 CpG 올리고 뉴클레오티드 투여의 효과
이신형 ( Lee Sin Hyeong ),김제형 ( Kim Je Hyeong ),정혜철 ( Jeong Hye Cheol ),김경규 ( Kim Gyeong Gyu ),정기환 ( Jeong Gi Hwan ),김병규 ( Kim Byeong Gyu ),이승헌 ( Lee Seung Heon ),박상면 ( Park Sang Myeon ),신철 ( Sin Cheol ) 대한결핵 및 호흡기학회 2001 Tuberculosis and Respiratory Diseases Vol.50 No.1
Two newly recorded species of Pyraustine moths (Lepidoptera: Crambidae) in Korea
Tak-Gi Lee,Dong-June Lee,Ulziijargal Bayarsaikhan,Hyeong-Kyu Kim,Yeong-Bin Cha,Sol-Moon Na,Young-Min Shin,Bo-Sun Park,Yang-Seop Bae 한국응용곤충학회 2018 한국응용곤충학회 학술대회논문집 Vol.2018 No.10
The Pyraustinae is one of the large subfamily in Crambidae. In Korea, more than 60 species in 20 genera of the Pyraustinae have been reported. Recently, Demobotys pervulgalis (Hampson, 1913) and Ecpyrrhorrhoe dissimilis (Yamanaka, 1958) were recorded by Choi et al. (2015). Among of the Pyraustinae, the genera Callibotys and Sinibotys were established by Munroe and Mutuura (1969). In this study, we report two species of genera Callibotys and Sinibotys from Korea for the first time, with a newly recorded genus Callibotys. Illustrations of adults, male and female genitalia, description are provided.