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허영무,신광호,Heo, Young-Moo,Shin, Kwang-Ho 한국금형공학회 2016 한국금형공학회지 Vol.10 No.2
In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.
The Separation Behaviors from Assemble Conditions for Pitch 1.25mm Level Wire to Board Connector
허영무,윤길상,Heo, Young-Moo,Yoon, Gil-Sang Korean Society of Die Mold Engineering 2016 한국금형공학회지 Vol.10 No.1
In this study, the modification structure design of insulation displacement connector developed was considered for simplification of assembly process. The modified connector consisted terminal, wafer and fitting nails. The separation behavior under locking condition for pitch 1.25mm wire to board connector was measured and the apparatus for the test was made. The maximum restraining force was measured about 4.5kgf that was bigger value than the specification limit. And the pulling force of a wire was also indicated about 2.3kgf.
초정밀 박육 플라스틱 제품 성형기술- II. 냉간 절단 공정 활용 사이드 게이트 제거기술
허영무,신광호,최복석,권오근,Heo, Young-Moo,Shin, Kwang-Ho,Choi, Bok-Seok,Kwon, Oh-Keun 한국금형공학회 2016 한국금형공학회지 Vol.10 No.3
In the semiconductor industry the memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. After injection molding process the side gates were needed to remove for further assembly process. ln this study, the cold press cutting process was applied to remove the gates. For design of punch and die, the cold press cutting analysis was implemented by$DEFORM-2D^{TM}$ ln consideration of the simulation results, an adequate punch and die was designed and made for the cutting unit. In order to verify the performance of cutting process, the roughness of cutting section of the part was measured and was satisfied in requirement.
허영무(Young-Moo Heo),신광호(Kwang-Ho Shin),윤길상(Gil-Sang Yoon),장성호(Sung-Ho Chang),정우철(Woo-Chul Jung) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
In recent industry, according to pursuit the miniaturization and high-precision of machine part with development of new technology as IT, BT the development of mold manufacturing technology for mass production is accompanied. In this study, the spiral type injection mold with a 200 ㎛ thickness shape is made for investigation of influence for injection molding process variables and the flow length is measured through an experiment. Taguchi method is used in this experiment and the obtained data are analyzed using ANOVA method.
허영무(Young Moo Heo),장성호(Sung Ho Chang),신광호(Kwang Ho Shin),조명우(Myung Woo Cho),제태진(Tae Jin Je) 한국생산제조학회 2011 한국생산제조시스템학회 학술발표대회 논문집 Vol.2011 No.4
In this paper, for manufacturing of a micro metallic gear(outer diameter 800㎛, module 0.1, number of teeth 8), a wire-cutting technology was applied to make 2 cores with small radii for the powder injection molding process. The core fabricated by wire-cut EDM process with wire dia. 50㎛ and 2 cavity mold assembled for PIM process. The stainless steel powders(17-4PH 3F/15F) are used in the powder injection molding process. This process is implemented with the mold fabricated using the injection molding machine(ENGEL). The green parts are de-binded and sintered to get the metal micro gear parts. A little incomplete filling behavior is occurred at the end filling area.
장성호,허영무,신광호,Chang, Sung-Ho,Heo, Young-Moo,Shin, Gwang-Ho 한국금형공학회 2008 한국금형공학회지 Vol.2 No.3
Recently, mobile-phone with camera module has an absolute majority in the released mobile-phones. For this trend, High precision of the plastic subminiature barrel which is the core part is needed significantly because the camera module of mobile-phone must have high performance. Therefore, Structural stability of the injection mold for plastic subminiature barrel has to be guaranteed. In this paper, structural analysis of injection mold for plastic subminiature barrel is performed. Finally, the deformation trend and stability of injection mold core are analyzed.
인서트 코어 타입 Cap 성형용 대용량 금형 제작에 관한 연구
정우철,허영무,신광호,윤길상,이정원,Jung, Woo-Chul,Heo, Young-Moo,Shin, Gwang-Ho,Yoon, Gil-Sang,Lee, Jeong-Won 한국금형공학회 2008 한국금형공학회지 Vol.2 No.3
In recent, the demands of household cases and disposable products is increased significantly because a living standard of newly-emerging nations was risen. Therefore, multi-cavity mold and stack mold for the realization of high-productivity have been researched in forefront nations. In this paper, CAE analysis for minimizing the mold core deformation was performed. Finally, 64 cavities injection mold for molding cap which has the insert-type core was fabricated according to the result of CAE analysis.
GMP 공정용 3 cavity 유리 렌즈 금형의 열변형에 관한 연구
장성호,허영무,신광호,정태성,Chang, Sung-Ho,Heo, Young-Moo,Shin, Gwang-Ho,Jung, Tae-Sung 한국금형공학회 2008 한국금형공학회지 Vol.2 No.6
Recently, the demands of digital camera and miniature camera module for mobile-phone is increased significantly. Lenses which is the core component of optical products are made by the injection molding(plastic lens) or GMP(glass lens). Plastic lens is not enough to improve the resolution and performance of optic parts. Therefore, the requirement of glass lens is increased because it is possible to ensure the high performance and resolution. In this paper, the thermal stress analysis of 3 cavity GMP mold for molding glass lens was performed for estimating the thermal stress and amount of deformation. Finally, the modification plan based on the analysis results was deducted.