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신봉호 ( Bong-ho Shin ),조명우 ( Myung-woo Cho ) 한국재정학회 2016 재정학연구 Vol.9 No.2
이 논문은 근로시간과 산업재해율의 관계를 설명한다. 근로시간이 산재율의 결정 요인임을 보이기 위해 최적 산재율이 산재율 통제의 한계비용과 한계혜택에 의해 결정되는 단순 정태 모형(static model)을 고려한다. 산재가 발생했을 때 기업이 인식하는 생산중단비용과 산재예방투자의 결정요인, 특히 근로시간을 모형 내에서 명시적으로 고려한다. 논문의 결론은 다음과 같다. 첫째, 근로시간이 길어질수록 최적 산재율이 높아진다. 둘째, 고용규모가 커지면 최적 산재율은 낮아진다. 셋째, 기업의 비정규직 비중이 높아질수록 최적 산재율은 높아진다. 넷째, 산재 기업과 공급업체와의 협력지수가 증가하면 최적 산재율은 떨어진다. 실증분석에서는 근로시간이 길어지면 산재율이 높아진다는 명제를 확인하였다. This paper analyzes a relationship between Working Hours and Occupational Injury and illness incidence rates (hereafter, injury and illness rates). It considers a working place in which the equilibrium level of injury and illness rates is determined by the marginal cost and benefits of injury rates. It tries to identify the determinants of production disruption costs with the firm``s safety expenditures. It shows that the equilibrium level of injury and illness rates is determined by the determinants of production disruption costs with the safety expenditures. According to the results of the model, the equilibrium level of injury and illness rates is higher: the longer is the working time, the larger the size of the labor of the working place, the higher the proportion of irregular workers, the lower the cooperation index between the firm and suppliers The empirical results confirms the proposition that the working time raises the level of injury rates.
MR fluid를 이용한 알루미늄 표면의 초정밀 연마 방법
임동욱,김병찬,홍광표,조명우,Lim, Dong-Wook,Kim, Byung-Chan,Hong, Kwang-Pyo,Cho, Myung-Woo 한국금형공학회 2017 한국금형공학회지 Vol.11 No.2
Recent industrial developments are constantly advancing, and rapid technological development is demanding high technology level in related fields. The need for polishing is increasing even more to improve quality. In order to improve the surface quality, the final finishing process or polishing process is a very important part. Research on super precise polishing method using MR fluid is actively being carried out in domestic and foreign countries. Fine magnetic abrasive grains are aligned in the direction of a magnetic force line formed by a magnetic field and serve as a brush to polish a metal surface. This method has the advantage that the shape of the tool is not fixed and is not affected by the shape of the workpiece or the machining area. We will design the electromagnets for the MR polish polishing system and apply the magnetic field analysis using the magnetic field analysis program (ANSYS). The data obtained through this process suggests an efficient method to increase the magnetic flux density important for polishing. We will investigate the influence of the Al6061-T6 specimen on the surface of the MR polishing machine based on the optimized design.
머신비전에 의한 LED Chip Package 형광물질 토출형상 측정
하석재(Ha, Seok-Jae),김종수(Kim, Jong-Soo),조명우(Cho, Meyong-Woo),최종명(Choi, Jong-Myung) 한국산학기술학회 2013 한국산학기술학회논문지 Vol.14 No.5
본 연구는, LED 칩 패키지에 있는 토출된 형광체 수지의 모양을 인라인 측정을 통해 개발된 검사 시스템을 기초로 한 효율적인 머신 비전에 관한 연구이다. 형광체의 반투명 특성 때문에 조사된 빛이 칩의 표면뿐만 아니라 하 단 부에서도 반사된다. 이러한 현상이 LED 칩 검사의 신뢰성을 저하시키기 때문에 적절한 조명 광학계를 결정하기 위해 백색광 LED 와 635nm의 레이저 슬릿 빛을 이용하여 검사하였다. 또한, 광 삼각측정법을 이용해 정반사와 분산 반사법으로 검사를 수행하였다. 실험 결과 백색 슬릿 광과 정반사 반사법의 조합이 가장 좋은 검사 결과를 낸다는 것 을 확인할 수 있었다. Catmull-Rom 스플라인 보간법을 이용하여 측정된 데이터를 부드러운 표면 형상으로 나타내었 다. 측정 결과를 통해 개발된 시스템이 LED 칩 패키징 공정에 인라인 검사에 성공적으로 적용될 수 있다는 결론을 내릴 수 있다. In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.
허영무(Young Moo Heo),장성호(Sung Ho Chang),신광호(Kwang Ho Shin),조명우(Myung Woo Cho),제태진(Tae Jin Je) 한국생산제조학회 2011 한국생산제조시스템학회 학술발표대회 논문집 Vol.2011 No.4
In this paper, for manufacturing of a micro metallic gear(outer diameter 800㎛, module 0.1, number of teeth 8), a wire-cutting technology was applied to make 2 cores with small radii for the powder injection molding process. The core fabricated by wire-cut EDM process with wire dia. 50㎛ and 2 cavity mold assembled for PIM process. The stainless steel powders(17-4PH 3F/15F) are used in the powder injection molding process. This process is implemented with the mold fabricated using the injection molding machine(ENGEL). The green parts are de-binded and sintered to get the metal micro gear parts. A little incomplete filling behavior is occurred at the end filling area.