http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Study on electrochemical mechanical polishing process of copper circuit on PCB
정찬화,Nadiia Kulyk,안창용,Jung Hoon Oh,조성민,Changsup Ryu,Young Kwan Ko 한국화학공학회 2010 Korean Journal of Chemical Engineering Vol.27 No.1
As an alternative to conventional chemical mechanical polishing (CMP) for the planarization of copper layers on electronic circuits, the electrochemical mechanical polishing (ECMP) process in alkali-based solution was investigated in this work. The influence of the polishing pad materials on the polishing process was studied, and the hard polyurethane polishing pad was shown to eliminate the “dishing effect”. The polishing conditions, such as the pad rotating speed, concentration of H2O2, and the amount of BTA additives were optimized to control the planarization performance. As a result, good planarization uniformity was obtained not only in small scale (30 μm) trenches but also in very large scale (a few mm) patterns with a single step ECMP process.
저압화학증착공정에서 미세선폭 도랑내의 박막 형성에 대한 전산 모사
정찬화,윤형진,박신종,문상흡 ( Chan Hwa Chung,Hyung Jin Yoon,Sin Chong Park,Sang Heup Moon ) 한국화학공학회 1991 Korean Chemical Engineering Research(HWAHAK KONGHA Vol.29 No.5
A few basic models have been suggested to simulate the film growth contour in narrow deep trench by low pressure chemical vapor deposition(LPCVD). Among them, the arrival-angle model assumes that the film growth rate depends on the collision frequency of reactant molecules with the substrate surface, and Knudsen-diffusion model assumes that the reactant diffuse into the trench volume by the Knudsen-diffusion mechanism. A third model combines the algorithm of the above two models in the computation process. For demonstration, these models have been applied for simulation of tungsten film deposition and the following results are obtained. The step coverage is poor when the aspect ratio of trench increases, but is improved when the H₂/WF_6 ratio decreases and the process temperature and pressure increase. The step coverage by tungsten film is improved when the trench is slightly tapered on both sides.
LTCC 를 소재로 하는 마이크로 리포머의 최적 설계에 관한 연구 : 일체형 Reformer/PROX 반응기의 설계 및 성능평가
정찬화(C. H Chung),오정훈(J. H. Oh),장주희(J. H. Jang),정명기(M. K. Jeong) 한국정밀공학회 2006 한국정밀공학회 학술발표대회 논문집 Vol.2006 No.10월
A micro-fuel processor system integrating steam reformer and partial oxidation reactor was manufactured using low temperature cofired ceramic (LTCC). A CuO/ZnO/Al₂O₃ catalyst and Pt-based catalyst prepared by wet impregnation were used for steam reforming and partial oxidation, respectively. The performance of the LTCC micro-fuel processor was measured at various operating conditions such as the effect of the feed flow rate, the ratio of H₂O/CH₃OH, and the operating temperature on the LTCC reformer and CO clean-up system. The catalyst layer was loaded with "Fill and Dry" coating for small volume. The product gas was composed of 70~75% hydrogen, 20~25% carbon dioxide, and 1~2% carbon monoxide at 250~300℃, respectively.
LTCC를 소재로 하는 마이크로 리포머의 최적 설계에 관한 연구 : 다양한 채널구조에 따른 성능변화 고찰
정찬화(Chan-Hwa Chung),오정훈(Jeong-Hoon Oh) 한국정밀공학회 2006 한국정밀공학회 학술발표대회 논문집 Vol.2006 No.5월
The miniature fuel cells have emerged as a promising power source for applications such as cellular phones, small digital devices, and autonomous sensors to embedded monitors or to micro-electro mechanical system(MEMS) devices. Several chemicals run candidate at a fuel in those systems, such as hydrogen, methanol, ethanol, acetic acid, and di-methyl ether(DME). Among them, hydrogen shows most efficient fuel performance. However, there are some difficulties in practical application for portable power sources. Therefore, more recently, there have been many efforts for development of micro-reformer to operate highly efficient micro fuel cells with liquid fuels such as methanol, ethanol, and DME In our experiments, we have integrated a micro-fuel processor system using low temperature co-fired ceramics(LTCC) materials. Out integrated micro-fuel processor system is containing embedded heaters, cavities, and 3D structures of micro-channels within LTCC layers for embedding catalysts(cf. Figs. 1 and 2). In the micro-channels of LTCC, we have loaded CuO/ZnO/Al₂O₃ catalysts using several different coating methods such as powder pacing or spraying, dipping, and washing of catalyst slurry.