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Ferrite-Bainite 기지를 갖는 구상흑연주철의 인장특성에 관하여
윤의박,전찬봉 대한금속재료학회(대한금속학회) 1983 대한금속·재료학회지 Vol.21 No.8
The purpose of this study is to improve the tensile properties of ductile cast iron with ferritebainite duplex matrix. Ferritic ductile cast iron was heat-treated to produce the following duplex matrixes of various proportions; ferrite-upper bainite, ferrite-lower bainite. To make the second phase, each specimen was austenitized at 880℃, and then heat-treated isothermally at 300℃ or 400℃. Tensile strength, 0.2 proof stress and hardness increased with volume fraction of the second phase without observing the law of mixture. Ductility (elongation, reduction of area) and static absorbed energy data showed a peak at 25-30% regardless of the kinds of the second phases, then reduced. The reason why ductility and static absorbed energy were improved at 25-30% of bainite, in view of measurements of martensite hardness test and strain hardening exponent, is considered to result from the reduction of soluble carbon content in bainite.
8빔 압저항형 가속도센서의 자기진단 기능을 위한 IC 칩 제조
박창현(Chang Hyun Park),전찬봉(Chan Bong Jun),강희석(Hee Suk Kang),김종집(Jong Jib Kim),이원태(Won Tae Lee),심준환(Jun Hwan Sim),김동권(Dong Kwon Kim),이종현(Jong Hyun Lee) 한국센서학회 1999 센서학회지 Vol.8 No.1
In this paper, we have constructed a self-diagnostic circuit which could detect erroneous signals in most cases that a eight-beam piezoresistive accelerometer were destroyed more than its one beam. To confirm the function of the circuit, PSPICE simulation was carried out. An IC chip was fabricated with a layout of KA 324 amplifier using a bipolar standard processing. After a package of the chip was sealed using a plastic package with 24 pins, the self-diagnostic characteristics were investigated. Then, the measured self-diagnostic characteristics of the circuit were compared with the PSPICE simulated result.
Hollow Structure에서의 희생층 평탄화 제작 공정
윤용섭,배기덕,최형,전찬봉,노광춘 대한전기학회 2004 전기학회논문지C Vol.53 No.10-C
Two fabrication approaches are proposed to planarize the sacrificial layer over hollow structures. One is the photoresist filling method that makes use of photolithography, thermal curing and plasma ashing. The other is the lamination method that is applying pressure and temperature to the organic film over the hollow structures. The fabrication results are compared with those of CMP process. Trenches and cavities with various dimensions have been made for the porposed process. Upon measuring the planarization levels, they are dependent on planarization methods and the geometrical size of hollow structures. The photoresist filling method is so strongly dependent on the width and depth of trenches that we have problems to use it for large dimensional trenches. To the contrary, the flatness of sacrificial layer over the trenches was found to be almost independent of trench dimensions for the lamination method. A CMP process shows the most excellent results, but the fabrication is complicated and the access to it is not so easy. It is important to choose the proper planarization method by considering the required flatness levels, materials to be planarized, and connection between the planarization step and the previous or the following process of it.
엑시머 레이저를 이용한 파이렉스 유리의 미세 구멍 가공
이철재(Chul-Jae Lee),김하나(Ha-Na Kim),정윤상(Yun-Sang Jeong),전찬봉(Chan-Bong Jun),박영철(Young-Chul Park),강정호(Jung-Ho Kang) 한국기계가공학회 2012 한국기계가공학회지 Vol.11 No.5
Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of 500㎛ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc`h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don"t influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.
IPMC의 기계적 특성향상을 위한 SWCNT/Nafion 복합체 개발
권희준(Hui-June Kwon),이헌상(Heon-Sang Lee),이정화(Jung-Hwa Lee),전찬봉(Chan-Bong Jun),강정호(Jung-Ho Kang) 한국기계가공학회 2011 한국기계가공학회지 Vol.10 No.1
From recent research, it has revealed that Electroacitve polymer(EAP) has a physical limitation. Carbon nanotube(CNT) is known as the promising material which has excellent electro-mechanical characteristics and is mostly defect-free. It is expected that a successful synthesis of CNT and Nafion known as a primary material for IPMC would make a great improvement on its electro-mechanic feature. In this paper, we suggest the method of synthesis of CNT with Nafion which improves electro-mechanical characteristic. Using mechanical dispersion with Nafion and Isopropyl Alcohol(IPA), we disperse Single-walled carbon nanotubes(SWCNT). For a uniformly layer of CNT, we used a spray gun on a hot plate by a simplified method. In the result, we fabricated a disperse SWCNT/Nafion composite uniformly.
MEMS 소자의 비아 홀에 대한 레이저 공정변수의 최적화
박시범(Si Beom Park),이철재(Chul Jae Lee),권희준(Hui June Kwon),전찬봉(Chan Bong Jun),강정호(Jung Ho Kang) 대한기계학회 2010 大韓機械學會論文集A Vol.34 No.11
MEMS 소자의 공정에서 가공된 비아 홀 품질은 소자의 성능에 가장 중요한 요소의 하나이다. Nd:YVO4 레이저로 가공한 비아 홀에 대한 레이저 미세가공의 일반적인 특징을 설명하고 그것의 측정에 대한 효율적인 최적화 방법을 소개한다. 본 논문의 최적화 방법은 직교다항식, 분산분석과 반응표면최적화는 최적 레이저 공정변수를 결정하고 주요 영향을 이해하는데 사용된다. 유의한 레이저 공정변수를 확인하고 이의 비아 홀 품질에 관한 영향을 고찰하였다. 레이저 공정변수의 최적 수준을 가지는 확인 실험은 최적화 방법의 유효성을 설명하기 위해 수행하였다. In the case of micro?electro-mechanical system (MEMS) devices, the quality of punched via hole is one of the most important factors governing the performance of the device. The common features that affect the laser micromachining of via holes drilled by using Nd:YVO4 laser are described, and efficient optimization methods to measure them are presented. The analysis methods involving an orthogonal array, analysis of variance (ANOVA), and response surface optimization are employed to determine the main effects and to determine the optimal laser process parameters. The significant laser process parameters were identified and their effects on the quality of via holes were studied. Finally, an experiment in which the optimal levels of the laser process parameters were used was carried out to demonstrate the effectiveness of the optimization method.