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Two step lithography와 나노 실리카 코팅을 이용한 초발수 필름 제작
유채린,이동원 한국센서학회 2019 센서학회지 Vol.28 No.4
We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the con- ventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating thesilicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patternscannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS)film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer wasselectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Resultsshowed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. Inaddition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.
유채린,Hemasundar Alavilli,송기환 한국육종학회 2022 Plant Breeding and Biotechnology Vol.10 No.2
Pumpkin (Cucurbita moschata) has been increasingly used as bloomless rootstock for cucumber (Cucumis sativus), butit is sensitive to low-temperature, which is the major bottleneck for winter cultivation. Hence, to develop low-temperature tolerantrootstock varieties, it is needed to identify tolerant germplasm from a wide range of genetic resources. For this, we developed a selectioncriterion for a quick assessment of low-temperature tolerance in pumpkin germplasms from different geographical origins. Weconsidered various indexes for the fast evaluation of low-temperature tolerance, including seedling developmental stage, type ofseedling (excised or non-excised), growth space, etc. Under the testing condition (17℃/7℃, 8 hours light/16 hours dark, 150 μmol m-2s-1light intensity), we found a correlation (r=0.71*) in root growth between 3 weeks-cultured excised seedlings and 6 weeks-culturednon-excised seedlings. Therefore, we extrapolate that excised cotyledonary stage seedling treated for 3 weeks is sufficient todifferentiate the tolerant germplasms. Using this screening method, we identified the “S81015” could prevail low-temperature stress. Further, we tested grafting compatibility and growth of grafted cucumbers under the low-temperature condition to assess the effect ofrootstock and identify low-temperature tolerant and grafting-compatible rootstock germplasm. Upon grafting, we found a highcorrelation (r=0.97**) between the root fresh weight of 6 weeks-cultured non-excised seedlings and the shoot fresh weight of thegrafted cucumbers. In summary, we could identify the low-temperature tolerant pumpkin germplasms by screening at the earlydevelopmental stage. Further, as a rootstock, the tolerant pumpkins also fortified the low-temperature tolerance of grafted cucumbers.