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고정밀 공작기계의 열적효과 측정 및 불확도 추정에 관한 연구
손덕수(Deok-Soo Son),김상화(Sang-Hwa Kim),박일환(Il-Hwan Park) 한국기계가공학회 2013 한국기계가공학회지 Vol.12 No.2
When the main spindle of high precision machine tools are run many hours, heat is generated in bearing parts of the inside of the spindle. Also, headstock is appeared distortion by inside and outside temperature difference of a machine. This paper studies method to measure behavior of machine tool about these thermal effects. In addition, it estimates measurement uncertainty factors which can be appeared in thermal effects measurement. Finding the factor of thermal affect measurement is important for estimation of measurement uncertainty. This paper measures thermal effects of high precision machine tools and evaluates the important factors of uncertainty.
정밀 공작기계의 회전 영역별 진동 및 불평형량 감소에 따른 가공 정밀도 영향에 관한 연구
손덕수(Deok-Soo Son),김상화(Sang-Hwa Kim),박일환(Il-Hwan Park) 한국기계가공학회 2013 한국기계가공학회지 Vol.12 No.2
Precision machine tools for high dignity cutting are needed for efforts to improve machining accuracy. However, there are many factors to improve machining accuracy. This study investigated how machining accuracy changes when variation and unbalance amount in rotational speed domain is decreased. Machining accuracy of initial machine tools depends on manufacturing and assembly of parts such as bearing. And then, vibration and noise vary with volume of unbalance amount when it is rotation, so it effects unbalance amount. Also vibration and noise increased by unbalance shorten spindle"s life and it especially makes worse boring accuracy. Therefore, this study studied the change of roundness and cylindricity of workpiece when it decreases variation and unbalance in rotational speed domain.
열전소자를 이용한 반도체 검사용 자동 온도제어 모듈 개발
손덕수(Deuk-soo Son),동선희(Seon-Hee Dong),이우영(Woo-Young Lee) 한국생산제조학회 2021 한국생산제조학회지 Vol.30 No.1
In semiconductor manufacturing processes, the final inspection is a crucial last test stage for screening defective parts before delivery to customers. Since traditional convection-based temperature control has limitations and requires time for a solution, this study focuses on the development and verification of an automatic temperature control technology using conduction-based thermoelectric modules. From the performance tests, it is found that the module operates in the temperature range of –40℃ to 120℃, and all channels achieve temperature transitions at each step within 6 min. The temperature module shows accuracy variations of –0.8℃ to 1.9℃ over the entire stage, which fulfills the semiconductor industry requirement of within ±2℃ for inspection equipment.