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AlGaN/GaN 이종접합구조의 표면누설전류에 관한 연구
석오균,최영환,임지용,김영실,김민기,한민구,Seok, O-Gyun,Choi, Young-Hwan,Lim, Ji-Yong,Kim, Young-Shil,Kim, Min-Ki,Han, Min-Koo 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.8
For investigation of surface leakage currrent of AlGaN/GaN heterostructures through etched GaN buffer surface and mesa wall, three kind of surface-leakage-test-patterns were fabricated. and we measured the surface leakage current of each patterns. In result of our work, the surface leakage current of pattern of which Schottky contact is formed on etched mesa wall is the largest. the leakage current through schottky contact on etched mesa wall is predominant in AlGaN/GaN heterostructures.
누설전류를 줄이기 위한 원형 AlGaN/GaN 쇼트키 장벽 다이오드
김민기,임지용,최영환,김영실,석오균,한민구,Kim, Min-Ki,Lim, Ji-Yong,Choi, Young-Hwan,Kim, Young-Shil,Seok, O-Gyun,Han, Min-Koo 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.9
We proposed circular AlGaN/GaN schottky barrier diode, which has no mesa structure near the current path. Proposed device showed low leakage current of 10 nA/mm at -100 V while that of the rectangular device was 34 nA/mm at the same condition. Proposed circular AIGaN/GaN SBD showed high forward current of 88.61 mA at 3,5 V while that of the conventional device was 14.1 mA at the same condition.
Insulated Metal Substrate의 Top Metal과 Bottom Metal 두께 변화에 따른 전력 모듈 열 방출 특성 분석
박성효(Seong-Hyo Park),정봉민(Bong-Min Jeong),오애선(Ae-Seon Oh),김선애(Seon-Ae Kim),석오균(O-Gyun Seok),배현철(Hyun-Cheol Bae) 대한전자공학회 2023 대한전자공학회 학술대회 Vol.2023 No.6
Direct Bonded Copper (DBC) commonly used in Power Module can cause cracks due to the Coefficient of Thermal Expansion (CTE) mismatch between Cu and ceramic. Insulated metal substrate (IMS) are proposed to overcome these disadvantages of DBCs. Unlike the existing IMS Power module, it introduces the integrated structure of bottom metal and base plate. The dielectric of IMS has a lower heat dissipation capacity than the ceramic of DBC due to the low thermal conductivity of the dielectric, but to overcome this, the heat dissipation ability is improved by changing the thickness of the top metal and bottom metal. In this paper, thermal analysis simulation is conducted using COMSOL MULTIPHYSICS. Compared to DBC substrates using Al2O3 Ceramics, the top metal thickness of the IMS substrate is changed to 0.3mm to 2.5mm, and the heat dissipation ability is observed accordingly. In addition, the bottom metal thickness is changed to 3mm to 5mm and observed. The thicker the thickness of the top and bottom metal, the better the heat dissipation ability.