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김원종(Won-Jong Kim),이충석(Choong-Seok Lee),채승수(Seong-Su Chae),김택수(Teak-Su Kim),이상민(Sang-Min Lee),박휘근(Hwi-Keun Park),조성만(Sung-Man Jo),송덕재(Duck-Jae Song),이종찬(Jong-Chan Lee) 한국기계가공학회 2009 한국기계가공학회 춘추계학술대회 논문집 Vol.2009 No.6
A Structural analysis has been carried out for CNC Micro Center development. The main frame, turret base, and machine column have been modelled using Solid Edge Software and analyzed using ANSYS Program. The analytical results indicate that the designed CNC Micro Center is stable at 3000-3600 rpm of spindle, which is commonly used range of rpm in this machine. The structual deformation has been reduced from 74㎜ to 0.3㎛.
동일한 평면을 가진 전통목조건축물의 상시미동계측 기반 동적특성 비교 - 3간 팔작지붕 정자건축물을 대상으로 -
김원종(Kim, Won-Jong),신은미(Shin, Eun-Mi),하태욱(Ha, Tae-Uk),김형준(Kim, Hyung-Jun) 대한건축학회 2021 대한건축학회 학술발표대회 논문집 Vol.41 No.2
The purpose of this study is to confirm the dynamic properties of two traditional wooden buildings that are same-sized shape to each other through microtremor measurement. Microtremor measurement was performed each buildings in order to confirm modal natural frequency and mode shape and human excitation was also performed in order to confirm damping ratio.
Wire Bonding Head Horn 설계 및 유한요소해석
김원종(Won-Jong Kim),황은하(Eun-Ha Hwang) 한국산업융합학회 2012 한국산업융합학회 논문집 Vol.15 No.4
Ultrasonic meching technoloy has been developed over recent years for wire bonding.In this study, ultrasonic welding horn is analysed and designed with FEM, then manufactured based on it. The wire bonding mechine has been designed by conical horn model with very easy to come by and is readily accessible. The analysis is carried out by SoldEdge & Ansys software.
Chip Bonding Machine Base 구조해석에 관한 연구
김원종(Won-Jong Kim),황은하(Eun-Ha Hwang) 한국산업융합학회 2012 한국산업융합학회 논문집 Vol.15 No.2
This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.
Leadframe Feeder Heat Rail의 설계와 검증
김원종(Won-Jong Kim),황은하(Eun-Ha Hwang) 한국산업융합학회 2012 한국산업융합학회 논문집 Vol.15 No.1
Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.