http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
고현준(Hyun-Jun Ko),박균명(Gyun-Myoung Park),김옥래(Ok-Rae Kim),송춘삼(Chun-Sam Song),김준현(Joon-Hyun Kim),김종형(Jong-Hyeong Kim) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.4
This paper aimed at the air-pad design of non-contact transfer for wafer. It is focused on precise control for minimization of pneumatic loss, prevention of wafer secession, and reduction of wafer shock during holding the wafer. Analysis are performed at design parameters of path length for hand device injection port, inlet air size, and central out let hole of air pad. The results are analyzed with effective air flow field including lifting force. It is seen that this system adopting the Bernoulli principle can be applied to non-contact transfer line through the capacity results of air pad design and negative pressure distribution by swirl creating flow field.
공정시간 및 온도에 따른 웨이퍼레벨 패키지 접합 최적설계에 관한 연구
고현준(Hyun-Jun Ko),임승용(Seung-Yong Lim),김희태(Hee-Tea Kim),김종형(Jong-Hyeong Kim),김옥래(Ok-Rae Kim) 한국생산제조학회 2014 한국생산제조학회지 Vol.23 No.3
Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.
고현준(Hyun-Jun Ko),박균명(Gyun-Myoung Park),이상용(Sang-Yong Lee),이동현(Dong-Hyun Lee),김남열(Nam-Youl Kim),김영근(Young-Keun Kim) 한국생산제조학회 2011 한국생산제조시스템학회 학술발표대회 논문집 Vol.2011 No.4
recent years, mobile phone keypad human-friendly products are being developed. inter alia, of the number keypad, or even if you deleted a long time or it does not cause damage. Among them, a long time in the case of the keypad numbers defaced or damaged, even if it does not occur. Because Uses by UV Molding. Almost no pollution, human-friendly substances are harmless to humans. However, one may be able to product, it is mass production of several issues. In this paper, minimizing hand and automation systems designed for mass production.
고현준(Hyun-Jun Ko),이상철(Sang-Chul Lee),김옥래(Ok-Rae Kim),김성규(Sung-Gyu Kim),윤언경(Eon-Gyeong Yun) 한국생산제조학회 2011 한국생산제조시스템학회 학술발표대회 논문집 Vol.2011 No.4
Machine tool industry to influence the competitiveness of the manufacturing core of capital goods, industrial precision equipment industry, as Germany and Japan as well as developed countries to recognize the key industries of the country through cutting edge technology and striving for national competitiveness is the main area. In order to process the inside of those artifacts, such as a laser or grinding tool with a processing device to processing inside to the workpiece. In this paper, solving the problem of processing devices and users inside the processing device can be machined into the desired shape is intended to design.
프로산하 유소년축구클럽 선수와 일반중학교 축구선수의 자기관리와 스포츠자신감 및 선수생활만족도 차이분석
고현준(Ko, Hyun-Jun),박영환(Park, Young-Hwan),최옥진(Choi, Ok-Jin) 한국체육과학회 2017 한국체육과학회지 Vol.26 No.4
The purpose of this study was to analyze the difference of self - management, self - confidence of athletes, life satisfaction of athletes between youth soccer club players under professional teams and general middle school soccer athletes. First, the interpersonal management, mental management, and training management as the sub - factors in the self - management showed higher in the youth soccer club players. It was a statistically significant difference. However there was no statistically significant difference in body management. Second, the coach leadership, physical and mental preparation, ability demonstration and social support as the sub - factors in the athletic self - confidence showed the higher level in the youth soccer players, but there was no statistically significant difference. Third, social satisfaction, athletic satisfaction, and environmental satisfaction as the sub - factors in the athletic life satisfaction were higher in youth soccer club players and statistically significant differences were also found.
고현준(Hyun-Jun Ko),송춘삼(Chun-sam Song),김종형(Jong-Hyung Kim) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.5
This paper introduces an working robot. four leg Walking type robot most of the existing problems at the walk, move the center of weight due to instability of posture. To compensate for these drawbacks, the structure of the leg design to rotate the joints and the joints, walking a straight line and at the same time, move the robot joints, linear joints and rotation changes in weight by almost do not occur, the body with balance and walking. Because of this, one side of the leg to be damaged, three leg is safety walking.
고현준(Hyun-Jun Ko),박균명(Gyun-Myoung Park),이상용(Sang-Yong Lee),이상철(Sang-Chul Lee),김영근(Young-keun Kim) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.11
semiconductor devices are transferred to a transport system, according to the present invention consists of multiple stages of the sub-stage (stage) of a plane parked on the semiconductor device between multiple. semiconductor devices to control the gap between the number of 1 tray (tray) above the transfer device to the stage as part of the Stage 1 and above the device spaced above the stage in a number of minor remind them of the semiconductor device tray and transferred to Stage 2.
고현준(Hyun-Jun KO),이동헌(Dong-Heon LEE),김종형(Jong-Hyung KIM) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
A study of semiconductor manufacturing equipment and with the fact that regarding a wafer transfer system, when in the study it follows in order to load one funeral wafer with horizontality the load department which is prepared In order to do transportation direction of the minute description wafer steering the steering department which is prepared, The minute description wafer is transported, in order to do the drive the drive department which is prepared And minute description load it will call on top and it will load and the minute description steering department will be prepared to a lower part, the minute description drive it will call and attaches and the base frame department which it supports The technique it will be able to improve the civil official efficiency of the wafer transfer which is smooth in order to include and wafer transfer system.