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고영배(Ko, Young-Bae),박형필(Park, Hyung-Pil),이정원(Lee, Jeong-Weon),차백순(Cha, Baeg-Soon) 한국산학기술학회 2014 한국산학기술학회논문지 Vol.15 No.4
본 액화 실리콘 고무는 내열성 및 내화학적 우수성으로 전자 제품 및 다양한 제품에서 활용되고 있다. 하지만 초탄성 재료는 일반 금속재료와 다른 특성을 보인다. 초탄성 재료는 하중과 변형이 비선형 관계를 보이는 대변형 범위에서도 탄성거 동을 나타내는 특성을 지니며, 비선형, 비압축성 및 대형의 특성을 지니고 있다. 이러한 특성 때문에 제품을 설계 및 생산 하기위해는 기능적 측면을 고려한 소재의 특성에 대한 물성 확보가 반드시 필요하기 때문에 현장에서 많은 어려움이 있다. 본 논문에서는 자동차용 방수커넥터 설계를 위해 소재의 인장, 압축 시험으로부터 구한 하중-변형관계를 이용하여 이를 유한 요소 해석에 적용한 결과를 비교하였으며, 해석결과와 제품의 성능 테스트 결과를 비교하여 방수커넥터용 씰의 경우 어떠한 소재특성을 적용할 경우 유용한 결과를 도출할 수 있는지를 확인하였으며, 이를 통해 제품 개발에 유용성을 확인하였다. Liquid silicone rubber(LSR) has been applied to various products such as electronic devices owing to its excellent thermal and chemical resistance. Hyperelastic materials, however, have properties distinguished from general metal materials. Hyperelastic materials show elastic behaviors in the range of large deformation in which load has the nonlinear relation with deformation. In addition, they have characteristics of nonlinearity, incompressibility, in large scale. On account of such characteristics, there are many difficulties in design and production using these materials. In this study, the load-deformation relation obtained from tension and compression tests was applied to finite element analysis in order to design waterproof connectors for automobiles. Furthermore, the effectiveness of the finite element analysis was confirmed by comparing the results of analysis with those of performance tests.
무선 센서 네트워크에서 에너지 효율성과 전송 지연 최소화를 동시에 고려한 MAC 프로토콜
송영미(Young-Mi Song),서창수(ChangSu Suh),고영배(Young-Bae Ko) 한국정보과학회 2005 한국정보과학회 학술발표논문집 Vol.32 No.1
지금까지 무선 센서 네트워크에서 에너지를 효율적으로 사용하기 위한 많은 라우팅 및 MAC 프로토콜들이 개발 되어 왔다. 특히 에너지 효율적 센서 MAC 프로토콜들 중 Sensor-MAC (S-MAC) 프로토콜은 listen 시간과 sleep 시간을 주기적으로 반복하여, 데이터 전송이 없을 경우 노드의 통신 모듈을 sleep시킴으로써 그 만큼의 에너지를 절약한다. 노드의 sleep시간이 길수록 더 많은 에너지를 절약할 수 있으나, 대신 sleep시간에 발생된 데이터는 다시 다음 주기의 listen시간이 시작될 때까지 지연되어야 한다는 단점이 있다. 이러한 데이터 전송 지연은 센서 네트워크에서 다양한 어플리케이션을 지원하기 위해 반드시 개선되어야 할 사항이다. 본 논문에서는 S-MAC의 listen/sleep 주기를 그대로 사용하여 에너지를 절약하면서도, 큰 오버헤드를 발생시키지 않고 데이터 전송시의 지연 시간을 최소화하는 기법에 대해 논의한다. 또한 시뮬레이션을 통해 기존의 S-MAC 및 Adaptive S-MAC 프로토콜과 지연시간 및 에너지 소비량을 비교하여, 제안된 기법이 지연시간을 감소시키면서도 기존 MAC 프로토콜들과 비슷한 에너지 소비량을 갖는다는 것을 증명하였다.
민인기,고영배,권창오,윤경환,Min, In Ki,Ko, Young Bae,Kwon, Chang Oh,Yoon, Kyung Hwan 한국금형공학회 2012 한국금형공학회지 Vol.6 No.1
Recently, injection molding process became more popular than ever to produce large quantities of high precision products. Extensive studies have been conducted for reducing the residual stresses and birefringence in injection-molded optical products. Flow-induced and thermally-induced stresses and birefringence have been found as two main sources during injection molding process. Generally, quantitative value of birefringence can be measured with polarizing microscope using the compensator. However, it is difficult to measure low order retardation with microscope, so developing a measurement system for low order optical path difference is in need. In the present paper, a system using Photo Elastic Modulator (PEM) is demonstrated to measure low phase retardation in injection-molded products.
이성희,고영배,이종원,김성규,양진석,허영무,Lee, Sung-Hee,Ko, Young-Bae,Lee, Jong-Won,Kim, Sung-Kyu,Yang, Jin-Suk,Heo, Young-Moo 한국금형공학회 2008 한국금형공학회지 Vol.2 No.5
A micro-injection mold for ultra-thin-walled plate was considered in this work. The proposed mold system is for the fabrication of ultra-thin walled plastic plate with micro features by injection molding. As the injection molding of thin-walled plastic, which has the thickness under $400{\mu}m$, itself is not easy, the injection molding of the micro-features in the thin-walled structure is more complicated and difficult. To investigate the basic phenomenon of the ultra-thin walled part during the injection molding process, design of the part and mold system were performed in the present study. The injection molding and structural analysis of the suggested part and mold system were also performed. Consequently, injection molding system for ultra-thin walled plate with micro features were manufactured and presented.
이성희,고영배,이종원,정해철,박재현,이옥성,Lee, Sung-Hee,Ko, Young-Bae,Lee, Jong-Won,Jung, Hae-Chul,Park, Jae-Hyun,Lee, Ok-Sung 한국금형공학회 2012 한국금형공학회지 Vol.6 No.2
A multi-cavity injection mold system of protein chip for point-of-care with cavity temperature and pressure sensors was proposed in this work. In advance of manufacturing for the multi-cavity injection mold system, a single cavity injection mold system to mold protein chip was considered. Injection molding analysis for the presented system was performed to optimize the process of the molding and suggest guides to design. On the basis of the results for the single cavity system, a multi-cavity injection mold system for protein chip was analyzed, designed and manufactured with cavity temperature and pressure sensors. Results of balanced filling for protein chip models were obtained from the presented mold system.
DSI 성형을 이용한 금속/플라스틱 복합 부품 제조에 관한 연구
하석재,차백순,고영배,Ha, Seok-Jae,Cha, Baeg-Soon,Ko, Young-Bae 한국금형공학회 2020 한국금형공학회지 Vol.14 No.4
Various manufacturing technologies, including over-molding and insert-injection molding, are used to produce hybrid plastics and metals. However, there are disadvantages to these technologies, as they require several steps in manufacturing and are limited to what can be reasonably achieved within the complexities of part geometry. This study aims to determine a practical approach for producing metal/plastic hybrid components by combining plastic injection molding and metal die casting to create a new hybrid metal/plastic molding process. The integrated metal/plastic hybrid injection molding process developed in this study uses the proven method of multi-component technology as a basis to combine plastic injection molding with metal die casting into one integrated process. In this study, the electrical conductivity and ampacity were verified to qualify the new process for the production of parts used in electronic devices. The electrical conductivity was measured, contacting both sides of the test sample with constant pressure, and the resistivity was measured using a micro ohmmeter. Also, the specific conductivity was subsequently calculated from the resistivity and contact surface of the conductor path. The ampacity defines the maximum amount of current a conductive path can carry before sustaining immediate or progressive deterioration. The manufactured hybrid multi-components were loaded with increasing currents, while the temperature was recorded with an infrared camera. To compare the measured infrared images, an electro-thermal simulation was conducted using commercial CAE software to predict the maximum temperature of the power loaded parts. Overall, during the injection molding process, it was demonstrated that multifunctional parts can be produced for electric and electronic applications.