http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
SnBiAg 전도성 페이스트를 이용한 Shingled 결정질 태양광 모듈의 전기적 특성 분석
윤희상,송형준,강민구,조현수,고석환,주영철,장효식,강기환,Yoon, Hee-Sang,Song, Hyung-Jun,Kang, Min Gu,Cho, Hyeon Soo,Go, Seok-Whan,Ju, Young-Chul,Chang, Hyo Sik,Kang, Gi-Hwan 한국재료학회 2018 한국재료학회지 Vol.28 No.9
In recent years, solar cells based on crystalline silicon(c-Si) have accounted for much of the photovoltaic industry. The recent studies have focused on fabricating c-Si solar modules with low cost and improved efficiency. Among many suggested methods, a photovoltaic module with a shingled structure that is connected to a small cut cell in series is a recent strong candidate for low-cost, high efficiency energy harvesting systems. The shingled structure increases the efficiency compared to the module with 6 inch full cells by minimizing optical and electrical losses. In this study, we propoese a new Conductive Paste (CP) to interconnect cells in a shingled module and compare it with the Electrical Conductive Adhesives (ECA) in the conventional module. Since the CP consists of a compound of tin and bismuth, the module is more economical than the module with ECA, which contains silver. Moreover, the melting point of CP is below $150^{\circ}C$, so the cells can be integrated with decreased thermal-mechanical stress. The output of the shingled PV module connected by CP is the same as that of the module with ECA. In addition, electroluminescence (EL) analysis indicates that the introduction of CP does not provoke additional cracks. Furthermore, the CP soldering connects cells without increasing ohmic losses. Thus, this study confirms that interconnection with CP can integrate cells with reduced cost in shingled c-Si PV modules.
박형 태양전지모듈 제작을 위한 저온 CP 공정 최적화에 관한 연구
진가언(Jin Ga-Eon),송형준(Song Hyung-Jun),고석환(Go Seok-Whan),주영철(Ju Young-Chul),송희은(Song Hee-eun),장효식(Chang Hyo-Sik),강기환(Kang Gi-Hwan) 한국태양에너지학회 2017 한국태양에너지학회 논문집 Vol.37 No.2
Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> 250°C), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and 175°C). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at 120°C decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at 150°C, 175°C. The peel test indicates that the unstable performance of sample laminated at 120°C is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is 150°C, considering stability and energy consumption during the fabrication.
전도성 페이스트를 이용한 무연 리본계 PV 모듈의 출력 특성 분석
윤희상(Yoon Hee-Sang),송형준(Song Hyung-Jun),고석환(Go Seok-Whan),주영철(Ju Young-Chul),장효식(Chang Hyo Sik),강기환(Kang Gi-Hwan) 한국태양에너지학회 2018 한국태양에너지학회 논문집 Vol.38 No.1
Environmentally benign lead-free solder coated ribbon (e. g. SnCu, SnZn, SnBi…) has been intensively studied to interconnect cells without lead mixed ribbon (e. g. SnPb) in the crystalline silicon(c-Si) photovoltaic modules. However, high melting point (> 200°C) of non-lead based solder provokes increased thermo-mechanical stress during its soldering process, which causes early degradation of PV module with it. Hence, we proposed low-temperature conductive paste (CP) based tabbing method for lead-free ribbon. Modules, interconnected by the lead-free solder (SnCu) employing CP approach, exhibits similar output without increased resistivity losses at initial condition, in comparison with traditional high temperature soldering method. Moreover, 400 cycles (2,000 hour) of thermal cycle test reveals that the module integrated by CP approach withstands thermo-mechanical stress. Furthermore, this approach guarantees strong mechanical adhesion (peel strength of ~ 2 N) between cell and lead-free ribbons. Therefore, the CP based tabbing process for lead free ribbons enables to interconnect cells in c-Si PV module, without deteriorating its performance.