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Analysis on temperature dependent current mechanism of tunnel field-effect transistors
Lee, Junil,Kwon, Dae Woong,Kim, Hyun Woo,Kim, Jang Hyun,Park, Euyhwan,Park, Taehyung,Kim, Sihyun,Lee, Ryoongbin,Lee, Jong-Ho,Park, Byung-Gook IOP Publishing 2016 Japanese journal of applied physics Vol.55 No.6
<P>In this paper, the total drain current (I-D) of a tunnel FET (TFET) is decomposed into each current component with different origins to analyze the ID formation mechanisms of the TFET as a function of gate voltage (V-GS). Transfer characteristics are firstly extracted with fabricated Silicon channel TFETs (Si TFETs) and silicon germanium channel TFETs (SiGe TFETs) at various temperatures. The subthreshold swings (SS) of both Si TFETs and SiGe TFETs get degraded and the SSs of SiGe TFETs get degraded more as temperature becomes higher. Then, all the I(D)s measured at various temperatures are decomposed into each current component through technology computer aided design (TCAD) simulations with a good agreement with experimental data. As a result, it is revealed that Shockley-Read-Hall (SRH) recombination mainly contribute to the I-D of a TFET before band to band tunneling (BTBT) occurs. Furthermore, the SS degradation by high temperature is explained successfully by the SRH recombination with electric field dependence. (C) 2016 The Japan Society of Applied Physics</P>
Pete Sihyun Lee 한양대학교 세라믹연구소 2015 Journal of Ceramic Processing Research Vol.16 No.S1
Structural ceramics are brittle and sensitive to flaws. As a result, the structural integrity of ceramic component may be seriously affected. However some engineering ceramics have the ability to healing the crack that is considerable advantages can be expected. In this review, the structural ceramics and its structure, parts processing and physical properties in terms of commercial products that are using today. Crack-healing behavior and mechanism was investigated in different silicon carbide based materials; alumina, mullite, silicon nitride, aluminum nitride, and zirconium debride. To find self-healing conditions in economical way for commercial structural ceramics, self-healing parameters are reviewed based on silicon carbide composite ceramics; healing temperature, testing temperature, healing atmosphere, crack size, SiC volume fraction, applied healing and testing stress, threshold stress for crack-healing, and fatigue stress. It can be conclude that crack-healing is effective way to increase reliability and lifetime of ceramics, and cost can be dramatically reduced by reducing quality inspection cost and time. Enhancing the self-crack-healing ability is valuable way to expand the usage of SiC ceramics such as engineering parts in extremely hard conditions and advanced semiconductor parts for higher density of circuit.