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Congestion Tracking Control for Wireless TCP/AQM Network Based on Adaptive Integral Backstepping
Lujuan Ma,Xiaoping Liu,Huanqing Wang,Yucheng Zhou 제어·로봇·시스템학회 2020 International Journal of Control, Automation, and Vol.18 No.9
This paper extends the backstepping control strategy to wireless Transmission Control Protocol (TCP) network to solve the Active Queue Management (AQM) problem. Different from the wired network, the uplink and downlink of the wireless network are asymmetric and the packet loss may be caused by congestion and may occurs during the transmission over wireless links. Inspired by the existing backstepping design idea for a wired network model, an adaptive tracking controller is proposed to deal with the congestion problem in wireless network. The uplink and downlink packet losses are estimated by adaptive update laws. The presented method provides satisfactory tracking performance in the network. Meanwhile, the packet loss is small. The simulation results show the feasibility of the proposed method.
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Congestion Control for Internet of Things Based on Priority
Lujuan Ma,Huanqing Wang,Yucheng Zhou,Xiaoping Deng,Xiaoping Liu 제어·로봇·시스템학회 2022 International Journal of Control, Automation, and Vol.20 No.4
5th generation mobile networks (5G) provides better support for Internet of Things (IoT). However, heavy IoT traffic flowing into the Internet causes network congestion, which significantly degrades network performance and quality of service (QoS). In this paper, the congestion problem in IoT is formulated as a control problem. And then adaptive backstepping is applied to resolve the congestion control problem and a new congestion control mechanism called Congestion Control Based on Priority (CCBP) is proposed. CCBP is aware of the packet loss ratios in the access network by estimation. Besides, priority parameters can be adjusted according to the priority of different applications to achieve different congestion control in CCBP. Simulation results clarify that the convergence time of CCBP is 5% of BARED and the packet loss ratio of CCBP is 4 orders of magnitude lower than BARED. And the throughput of CCBP is 4 times that of BARED. Different throughputs and queue packet loss ratios are achieved by adjusting parameters. Besides, when network parameters such as RTT and packet loss ratio in access network change, CCBP also has satisfactory performance.
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Huilin Liu,YuCheng Ma,Xushan Chen,Meng Zhou,Shiyou Chen 한국통신학회 2020 한국통신학회 APNOMS Vol.2020 No.09
The reliability of the power communication network is important to the stable operation of the power grid. Existing studies on the reliability evaluation of power communication networks rarely consider the factors of environmental changes. In fact, changes in the working environment of power service routing will affect the normal operation of the network. This paper studies the reliability evaluation method of power communication network based on environmental factors. The normal cloud model method is used to model the multiple environmental factors in the power communication network, and a controlled hybrid stochastic petri network is used to model and analyze the power transmission system with backup route. In simulation experiments, we compare our algorithm with the contrast algorithm that not considering the impact of environmental factors. The results show that our algorithm can well reflect the impact of changes in environmental factors on the reliability of the system, and more in line with the actual reliability changes of the power service transmission system.
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ZhiYong Wu,Zhiheng Huang,Yucheng Ma,Hua Xiong,Paul P. Conway 대한금속·재료학회 2014 ELECTRONIC MATERIALS LETTERS Vol.10 No.1
Through-silicon vias (TSVs) have been investigated extensively in recent years. However, the physical mechanisms behind some of the common problems associated with TSVs, such as the protrusion of Cu vias, are still unknown. In addition, since the dimensions of TSVs have been shrunk to microscopic levels, the sizes of the microstructural features of TSVs are no longer small compared to the dimensions of the vias. Therefore, the role and importance of the microstructural features of TSVs need to be studied to enable more accurate reliability predictions. This study focused on the effects the microstructural features of TSVs, i.e., the Cu grains and their [111] texture, grain size distribution, and morphology, have on the thermally induced linear elastic behavior of the vias. The results of the study indicate that stress distribution in the model that takes into account the Cu grains, whose Young’s moduli and Poisson’s ratios are set according to their crystallographic orientations, is more heterogeneous than that in a reference model in which the bulk properties of Cu are used. Stresses as high as 250 MPa are observed in the via of the model that takes into consideration the Cu grains, while stresses in the via of the reference model are all lower than 150 MPa. In addition, smaller Cu grains in the vias result in higher stresses; however, the variation in stress owning to changes in the grain size is within 20 MPa. The frequency of the stresses ranging from 80 MPa to 100 MPa was the highest in the stress distribution of the vias, depending on boundary conditions. The stress level in the vias decreases with the decrease in the number of grains with the [111] texture. Finally, the stress level is lower in the model in which the grain structure is generated using a phase field model and is closer to that of the microstructures present in real materials.
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Plastic Deformation Mechanism of Ductile Fe50Ni30P13C7 Metallic Glass
Kangkang Geng,Weiming Yang,Jinyong Mo,Haishun Liu,Feng Wei,Zhanguo Ma,Yucheng Zhao,Akihisa Inoue 대한금속·재료학회 2019 METALS AND MATERIALS International Vol.25 No.2
Shear band (SB) multiplication is considered as an essential characteristic of the plastic deformation in metallic glasses(MGs). In this work, the evolutionary characteristics of SBs and serrated behavior in ductile Fe50Ni30P13C7MGs werestudied by the finite element method simulation. The study demonstrated that the stress field would redistribute and becomeinhomogeneous during SB sliding, where the stress perpendicular to the original SB gradually accumulates until reachingthe magnitude of yielding strength and triggering new SBs. The results of simulation are in good agreement with the SBsintersection morphologies observed in SEM images and the serration flows on the stress–strain curves. Furthermore, severalfactors affecting stress field distribution in MGs, such as contact friction, aspect ratio, and boundary confinement, werealso analyzed and discussed. The overall results indicate that the ductility of Fe-based MGs could be achieved without anyinhomogeneous structure, and scientifically explicate the dependence of SB multiplication on both material properties andloading condition, which can provide us with a deeper understanding on plastic deformation mechanism of MGs.
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