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Zhiheng Huang,Chunchuan Gu,Jiajun Wen,Langlang Zhu 성균관대학교(자연과학캠퍼스) 성균나노과학기술원 2019 NANO Vol.14 No.1
In this paper, a new and one-pot electrodeposition method was expanded for the preparation of NiS nanoparticles-based electrochemical biosensor using metal-ion complexes as a precursor. Thioacetamide was used to control the production rate of NiS nanoparticles for the first time. The proposed electrochemical sensor was characterized by energy dispersive X-ray spectroscopy (EDX), field emission scanning electron microscope (FESEM), cyclic voltammograms (CV), and electrochemical impedance spectra (EIS). Experiment parameters were optimized. Under the optimized condition, the prepared NiS-based biosensor exhibited excellent electrocatalytic oxidation of H2O2 and glucose due to their small size. It provided fast and sensitive strategy for detecting H2O2 and glucose in the range of 1–5000 and 1–1000 μM. The detection limit of 0.257 and 0.3 μM was obtained for H2O2 and glucose. The mechanisms were also analyzed. The proposed biosensor exhibited excellent anti-interference and repeatability. Furthermore, it was applied in the actual sample analysis, such as human blood serum.
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Jiang, Zhiheng,Zhang, Victor,Huang, Yi-Jiun,Achkar, Joseph,Piester, Dirk,Lin, Shinn-Yan,Wu, Wenjun,Naumov, Andrey,Yang, Sung-hoon,Nawrocki, Jerzy,Sesia, Ilaria,Schlunegger, Christian,Yang, Zhiqiang,Fu BUREAU INTERNATIONAL DES POIDS ET MESURES 2018 METROLOGIA -BERLIN- Vol.55 No.5
<P>Two-way satellite time and frequency transfer (TWSTFT) is a primary technique for the generation of coordinated universal time (UTC). About 20 timing laboratories around the world continuously operate TWSTFT using satellite time and ranging equipment (SATRE<SUP>19</SUP>) modems for remote time and frequency comparisons in this context. The precision of the SATRE TWSTFT as observed today is limited by an apparent daily variation pattern (diurnal) in the TWSTFT results. The observed peak-to-peak variation have been found as high as 2 ns in some cases. Investigations into the origins of the diurnals have so far provided no complete understanding about the cause of the diurnals. One major contributor to the diurnals, however, could be related to properties of the receive part in the modem. In 2014 and 2015, it was demonstrated that bypassing the receive part and the use of software-defined radio (SDR) receivers in TWSTFT ground stations (SDR TWSTFT) instead could considerably reduce both the diurnals and the measurement noise.</P> <P>In 2016, the International Bureau of Weights and Measures (BIPM) and the Consultative Committee for Time and Frequency (CCTF) working group (WG) on TWSTFT launched a pilot study on the application of SDR receivers in the TWSTFT network for UTC computation.</P> <P>The first results of the pilot study were reported to the CCTF WG on TWSTFT annual meeting in May 2017, demonstrating that SDR TWSTFT shows superior performance compared to that of SATRE TWSTFT for practically all links between participating stations. In particular, for continental TWSTFT links, in which the strongest diurnals appear, the use of SDR TWSTFT results in a significant suppression of the diurnals by a factor of between two and three. For the very long inter-continental links, e.g. the Europe-to-USA links where the diurnals are less pronounced, SDR TWSTFT achieved a smaller but still significant gain of 30%. These findings are supported by an evaluation of some of the links with an alternate technique based on GPS signals (GPS IPPP) as reported in this paper.</P> <P>Stimulated by these results, the WG on TWSTFT prepared a recommendation for the 21st CCTF meeting, which proposed the introduction of SDR TWSTFT in UTC generation. With CCTF approval of the recommendation, a roadmap was developed for the implementation of SDR TWSTFT in UTC generation. In accordance with the roadmap, most of the stations that participated in the pilot study have updated the SDR TWSTFT settings to facilitate the use of SDR TWSTFT data in UTC generation. In addition, the BIPM conducted a final evaluation to validate the long-term stability of SDR TWSTFT links, made test runs using the BIPM standard software for the calculation of UTC, now including SDR TWSTFT data, and started to calculate SDR TWSTFT time links as backup from October 2017. The use of SDR TWSTFT in UTC generation will begin in 2018.</P>
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ZhiYong Wu,Zhiheng Huang,Yucheng Ma,Hua Xiong,Paul P. Conway 대한금속·재료학회 2014 ELECTRONIC MATERIALS LETTERS Vol.10 No.1
Through-silicon vias (TSVs) have been investigated extensively in recent years. However, the physical mechanisms behind some of the common problems associated with TSVs, such as the protrusion of Cu vias, are still unknown. In addition, since the dimensions of TSVs have been shrunk to microscopic levels, the sizes of the microstructural features of TSVs are no longer small compared to the dimensions of the vias. Therefore, the role and importance of the microstructural features of TSVs need to be studied to enable more accurate reliability predictions. This study focused on the effects the microstructural features of TSVs, i.e., the Cu grains and their [111] texture, grain size distribution, and morphology, have on the thermally induced linear elastic behavior of the vias. The results of the study indicate that stress distribution in the model that takes into account the Cu grains, whose Young’s moduli and Poisson’s ratios are set according to their crystallographic orientations, is more heterogeneous than that in a reference model in which the bulk properties of Cu are used. Stresses as high as 250 MPa are observed in the via of the model that takes into consideration the Cu grains, while stresses in the via of the reference model are all lower than 150 MPa. In addition, smaller Cu grains in the vias result in higher stresses; however, the variation in stress owning to changes in the grain size is within 20 MPa. The frequency of the stresses ranging from 80 MPa to 100 MPa was the highest in the stress distribution of the vias, depending on boundary conditions. The stress level in the vias decreases with the decrease in the number of grains with the [111] texture. Finally, the stress level is lower in the model in which the grain structure is generated using a phase field model and is closer to that of the microstructures present in real materials.
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