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      • KCI등재

        Interleukin-20 targets podocytes and is upregulated in experimental murine diabetic nephropathy

        Yu-Hsiang Hsu,Hsing-Hui Li,Junne-Ming Sung,Wei-Yu Chen,Ya-Chin Hou,Yun-Han Weng,Wei-Ting Lai,Chih-Hsing Wu,Ming-Shi Chang 생화학분자생물학회 2017 Experimental and molecular medicine Vol.49 No.-

        Interleukin (IL)-20, a proinflammatory cytokine of the IL-10 family, is involved in acute and chronic renal failure. The aim of this study was to elucidate the role of IL-20 during diabetic nephropathy development. We found that IL-20 and its receptor IL-20R1 were upregulated in the kidneys of mice and rats with STZ-induced diabetes. In vitro, IL-20 induced MMP-9, MCP-1, TGF-β1 and VEGF expression in podocytes. IL-20 was upregulated by hydrogen peroxide, high-dose glucose and TGF-β1. In addition, IL-20 induced apoptosis in podocytes by activating caspase-8. In STZ-induced early diabetic nephropathy, IL-20R1-deficient mice had lower blood glucose and serum BUN levels and a smaller glomerular area than did wild-type controls. Anti-IL-20 monoclonal antibody (7E) treatment reduced blood glucose and the glomerular area and improved renal functions in mice in the early stage of STZ-induced diabetic nephropathy. ELISA showed that the serum IL-20 level was higher in patients with diabetes mellitus than in healthy controls. The findings of this study suggest that IL-20 induces cell apoptosis of podocytes and plays a role in the pathogenesis of early diabetic nephropathy.

      • KCI등재

        Abrupt Decline in Estimated Glomerular Filtration Rate after Initiating Sodium-Glucose Cotransporter 2 Inhibitors Predicts Clinical Outcomes: A Systematic Review and Meta-Analysis

        Min-Hsiang Chuang,Yu-Shuo Tang,Jui-Yi Chen,Heng-Chih Pan,Hung-Wei Liao,Wen-Kai Chu,Chung-Yi Cheng,Vin-Cent Wu,Michael Heung 대한당뇨병학회 2024 Diabetes and Metabolism Journal Vol.48 No.2

        Background: The initiation of sodium-glucose cotransporter-2 inhibitors (SGLT2i) typically leads to a reversible initial dip in estimated glomerular filtration rate (eGFR). The implications of this phenomenon on clinical outcomes are not well-defined.Methods: We searched MEDLINE, Embase, and Cochrane Library from inception to March 23, 2023 to identify randomized controlled trials and cohort studies comparing kidney and cardiovascular outcomes in patients with and without initial eGFR dip after initiating SGLT2i. Pooled estimates were calculated using random-effect meta-analysis.Results: We included seven studies in our analysis, which revealed that an initial eGFR dip following the initiation of SGLT2i was associated with less annual eGFR decline (mean difference, 0.64; 95% confidence interval [CI], 0.437 to 0.843) regardless of baseline eGFR. The risk of major adverse kidney events was similar between the non-dipping and dipping groups but reduced in patients with a ≤10% eGFR dip (hazard ratio [HR], 0.915; 95% CI, 0.865 to 0.967). No significant differences were observed in the composite of hospitalized heart failure and cardiovascular death (HR, 0.824; 95% CI, 0.633 to 1.074), hospitalized heart failure (HR, 1.059; 95% CI, 0.574 to 1.952), or all-cause mortality (HR, 0.83; 95% CI, 0.589 to 1.170). The risk of serious adverse events (AEs), discontinuation of SGLT2i due to AEs, kidney-related AEs, and volume depletion were similar between the two groups. Patients with >10% eGFR dip had increased risk of hyperkalemia compared to the non-dipping group.Conclusion: Initial eGFR dip after initiating SGLT2i might be associated with less annual eGFR decline. There were no significant disparities in the risks of adverse cardiovascular outcomes between the dipping and non-dipping groups.

      • SCIESCOPUSKCI등재

        New Single-Phase Power Converter Topology for Frequency Changing of AC Voltage

        Jou, Hurng-Liahng,Wu, Jinn-Chang,Wu, Kuen-Der,Huang, Ting-Feng,Wei, Szu-Hsiang The Korean Institute of Power Electronics 2018 JOURNAL OF POWER ELECTRONICS Vol.18 No.3

        This paper proposes a new single-phase power converter topology for changing the frequency of AC voltage. The proposed single-phase frequency converter (SFC) includes a T-type multi-level power converter (TMPC), a frequency decoupling transformer (FDT) and a digital signal processor (DSP). The TMPC can convert a 60 Hz AC voltage to a DC voltage and then convert the DC voltage to a 50 Hz AC voltage. Therefore, the output currents of the two T-type power switch arms have 50 Hz and 60 Hz components. The FDT is used to decouple the 50 Hz and 60 Hz components. The salient feature of the proposed SFC is that only one power electronic converter stage is used since the functions of the AC-DC and DC-AC power conversions are integrated into the TMPC. Therefore, the proposed SFC can simplify both the power circuit and the control circuit. In order to verify the functions of the proposed SFC, a hardware prototype is established. Experimental results verify that the performance of the proposed SFC is as expected.

      • Shear Mode Piezoelectric Ceramic Printhead Array Design

        ( Shih Wun Huang ),( Yeoung Jen Wu ),( Wei Hsiang Lai ) 한국액체미립화학회 2005 한국액체미립화학회 학술강연회 논문집 Vol.2005 No.-

        This paper starts with an overview of different kind of piezoelectric drop-on-demand inkjet printhead, then focus on particular Xaar-type piezoelectric shear mode inkjet printhead which have higher density of print channel than other piezoelectric printhead types. Detail fabrication processes are described and the simulation of the operation condition is also carried out. The ink channels formed by MEMS wafer-cutting technology and the electrodes are coated on both upper half side of the actuator walls. Finite element analysis software ANSYS is used to simulate the strain, stress dispersion under different boundary condition when the external voltage is applied. The results show that there is a linear relationship between the applied voltage and the wall cross section area changes. In the simulation of the relationship between electrodes cover length and the cross section area change of ink channel, it is found that the quantity of ink channel cross section area change increases significantly as the electrode cover length is over 55%-60% height of actuator wall.

      • KCI등재

        New Single-Phase Power Converter Topology for Frequency Changing of AC Voltage

        Hurng-Liahng Jou,Jinn-Chang Wu,Kuen-Der Wu,Ting-Feng Huang,Szu-Hsiang Wei 전력전자학회 2018 JOURNAL OF POWER ELECTRONICS Vol.18 No.3

        This paper proposes a new single-phase power converter topology for changing the frequency of AC voltage. The proposed single-phase frequency converter (SFC) includes a T-type multi-level power converter (TMPC), a frequency decoupling transformer (FDT) and a digital signal processor (DSP). The TMPC can convert a 60 Hz AC voltage to a DC voltage and then convert the DC voltage to a 50 Hz AC voltage. Therefore, the output currents of the two T-type power switch arms have 50 Hz and 60 Hz components. The FDT is used to decouple the 50 Hz and 60 Hz components. The salient feature of the proposed SFC is that only one power electronic converter stage is used since the functions of the AC-DC and DC-AC power conversions are integrated into the TMPC. Therefore, the proposed SFC can simplify both the power circuit and the control circuit. In order to verify the functions of the proposed SFC, a hardware prototype is established. Experimental results verify that the performance of the proposed SFC is as expected.

      • KCI등재후보

        Inhibiting the Growth of Cu3Sn and Kirkendall Voids in the Cu/Sn-Ag-Cu System by Minor Pd Alloying

        Cheng En Ho,,Tsai Tung Kuo,Chun Chien Wang,Wei Hsiang Wu 대한금속·재료학회 2012 ELECTRONIC MATERIALS LETTERS Vol.8 No.5

        In this study, the metallurgical reaction between Cu substrates (electrolytic type) and a Sn3Ag0.5Cu-xPd alloy at 180°C was examined using a scanning electron microscope (SEM), electron probe microanalyzer (EPMA),focused ion beam (FIB) microscope, and transmission electron microscope (TEM). The results showed that the growth of Cu3Sn in the Cu/Sn-Ag-Cu solder joints was substantially suppressed by doping with a minor quantity of Pd (0.1-0.7 wt. %) in the solder alloy. The sluggish growth of Cu3Sn reduced the formation of Kirkendall voids at the Cu/Cu3Sn interface and significantly improved the mechanical reliability of the joint interface. It was argued that a minor addition of Pd into the solder stabilized the Cu6Sn5 phase and enlarged the interdiffusion coefficient of Cu6Sn5 but diminished that of the neighboring phase (Cu3Sn), thereby decreasing the Kirkendall effect in the Cu/Sn-Ag-Cu reactive system.

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