http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Dishing and Erosion in Chemical Mechanical Polishing of Electroplated Copper
INHO YOON,SUM HUAN NG,ROBERT HIGHT,CHUNHONG ZHOU,C. FRED HIGGS,LILY YAO,STEVEN DANYLUK 한국트라이볼로지학회 2002 한국트라이볼로지학회 학술대회 Vol.2002 No.10
Polishing of copper, a process called copper chemical mechanical polishing, is a critical, intermediate step in the planarization of silicon wafers. During polishing, the electrodeposited copper films are removed by slurries; and the differential polishing rates between copper and the surrounding silicon dioxide leads to a greater removal of the copper. The differential polishing develops dimples and furrows; and the process is called dishing and erosion. In this work, we present the results of experiments on dishing and erosion of copper-CMP, using patterned silicon wafers. Results are analyzed for the pattern factors and properties of the copper layers. Three types of pads - plain, perforated, and grooved - were used for polishing. The effect of slurry chemistries and pad soaking is also reported.
A Review on 3D Printed Bioimplants
Chee Meng Benjamin Ho,Sum Huan Ng,윤용진 한국정밀공학회 2015 International Journal of Precision Engineering and Vol. No.
Additive manufacturing (AM) also known as 3D printing have been making inroads into medical applications such as surgical models and tools, tooling equipment, medical devices. One key area researchers are looking into is bioimplants. With the improvement and development of AM technologies, many different bioimplants can be made using 3D printing. Different biomaterials and various AM technologies can be used to create customized bioimplants to suit the individual needs. With the aid of 3D printing this could lead to new foam and design of bioimplants in the near further. Therefore, the purpose of this review articles is to (1) Describe the various AM technologies and process used to make bioimplants, (2) Different types of bioimplants printed with AM and (3) Discuss some of the challenges and future developments for 3D printed bioimplants.
Detection of Thiocholine Ions with Cobalt Phthalocyanine Mediated Screen Printed Electrode
Jie-Kai Er,윤용진,Sum Huan Ng,King Ho Holden Li,신충수,Pei-Chen Su,Nam Beng Tay,Wei Wang 한국정밀공학회 2014 International Journal of Precision Engineering and Vol. No.
Acetylcholine (ACh) is a neurotransmitter that is responsible for many of our bodily functions while acetylcholineesterase (AChE) isits enzyme. Certain nerve agents inhibit AChE to cause malfunctions of our body system. To detect those agents, the concentrationof AChE by-product, choline, is used as a detection marker. Using a screen printed electrode and acetylthiocholine (ATCh) as areplacement for ACh, amperometry is employed to detect the concentration of the AChE-ATCh reaction by-product, thiocholine. Results showed that 0.1 V is the optimum potential for thiocholine detection. Voltages of 0.2 V and 0.3 V also produced similar currentmagnitudes. From 0.225 mM to 0.9 mM of thiocholine, the amperometry current exhibits a linear relation with concentration. Thesensitivity electrode is around 2.53 μA/mM. A flow rate of 100 μL/min is chosen as it is close to the saturation oxidation rate of theelectrode and is useful in practical situations. Taking into account the errors met at 0.1 V, the sensitivity of the system is calculatedto a minimum of 0.04 mM.
Dependence of Dishing on Fluid Pressure during Chemical Mechanical Polishing
C. Fred Higgs,Sum Huan Ng,Chunhong Zhou,Inho Yoon,Robert Hight,Zhiping Zhou,LipKong Yap,Steven Danyluk 한국트라이볼로지학회 2002 한국트라이볼로지학회 학술대회 Vol.2002 No.10
Chemical mechanical polishing (CMP) is a manufacturing process that uses controlled wear to planarize dielectric and metallic layers on silicon wafers. CMP experiments revealed that a sub-ambient film pressure developed at the wafer/pad interface. Additionally, dishing occurs in CMP processes when the copper-in-trench lines are removed at a rate higher than the barrier layer. In order to study dishing across a stationary wafer during polishing, dishing maps were created. Since dishing is a function of the total contact pressure resulting from the applied load and the fluid pressure, the hydrodynamic pressure model was refined and used in an existing model to study copper dishing. Density maps, highlighting varying levels of dishing across the wafer face at different radial positions, were developed. This work will present the results.