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Chulsoon Hwang,Jaemin Kim,Eakhwan Song,Yujeong Shim,Joungho Kim IEEE 2011 IEEE transactions on electromagnetic compatibility Vol.53 No.1
<P>A wideband and compact partial electromagnetic bandgap (PEBG) structure and a corresponding stopband-estimation model are proposed for the suppression of simultaneous switching noise (SSN) coupling in a multilayer printed circuit board. The proposed PEBG structure achieves a wide stopband with a compact size by adopting a geometric arrangement of patches that allows for a periodic narrow via pitch (NVP). In addition, the lumped capacitance model of the previously reported effective phase constant equation is replaced with the resonant cavity model to obtain the precise impedance of the patch in high frequency. Finally, it was successfully verified that, by applying the NVP-PEBG structure, wideband suppression of SSN coupling to the signal via is achieved with a bandwidth of 11.2 GHz below -40 dB. The proposed estimation model was validated through experimental measurements.</P>
Chulsoon Hwang,Jingook Kim,Achkir, B.,Jun Fan IEEE 2013 IEEE transactions on components, packaging, and ma Vol.3 No.1
<P>The transfer functions relating supply voltage fluctuations to jitter are analytically derived in closed form expressions for a single-ended buffer. The analytic transfer functions are derived from a linear differential equation obtained from asymptotic linear inverter I-V curves. The transfer functions are validated by comparison with HSPICE simulations. The estimated jitter is compared with the simulated jitter using eye diagrams with single-frequency and multitone supply voltage fluctuations.</P>
An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor
Chulsoon Hwang,Yujeong Shim,Kyoungchoul Koo,Myunghoi Kim,Jun So Pak,Joungho Kim IEEE 2011 IEEE microwave and wireless components letters Vol.21 No.8
<P>An on-chip electromagnetic bandgap (EBG) structure using a CMOS process is proposed. The proposed structure is the first EBG structure devised to suppress simultaneous switching noise coupling in an on-chip power distribution network (PDN). The on-chip EBG structure utilizes an on-chip inductor and a MOS capacitor to generate a stopband with a range of several GHz in an extremely small size; thus, the EBG structure can be embedded in on-chip PDNs. The proposed on-chip EBG structure was fabricated using a MagnaChip 0.18 μm CMOS process, and we successfully verified a 9.24 GHz stopband, from 1.26 to 10.5 GHz, with an isolation level of 50 dB.</P>
Modeling of an On-Chip Power/Ground Meshed Plane Using Frequency Dependent Parameters
Chulsoon Hwang,Kiyeong Kim,Jun So Pak,Joungho Kim 한국전자파학회JEES 2011 Journal of Electromagnetic Engineering and Science Vol.11 No.3
This paper proposes a new modeling method for estimating the impedance of an on-chip power/ground meshed plane. Frequency dependent R, L, and C parameters are extracted based on the proposed method so that the model can be applied from DC to high frequencies. The meshed plane model is composed of two parts: coplanar multi strip (CMS) and conductor-backed CMS. The conformal mapping technique and the scaled conductivity concept are used for accurate modeling of the CMS. The developed microstrip approach is applied to model the conductor-backed CMS. The proposed modeling method has been successfully verified by comparing the impedance of RLC circuit based on extracted parameters and the simulated impedance using a 3D-field solver.
Mode Matching Analysis of Via-Plate Capacitance in Multilayer Structures With Finite Plate Thickness
Hyun Ho Park,Chulsoon Hwang,Kyung-Young Jung,Yong Bae Park [Institute of Electrical and Electronics Engineers 2015 IEEE transactions on electromagnetic compatibility Vol.57 No.5
<P>In this paper, an analytical method for evaluation of via-plate capacitance including finite plate thickness in multilayer structures is proposed. An electrostatic boundary-value problem associated with a via in parallel plates is solved based on the Hankel transform and mode matching method, and thereby a fast-converging series-form expression for the via-plate capacitance is derived. The effect of finite plate thickness is taken into account by adopting the mode matching method instead of imposing an artificial perfect magnetic conductor boundary as in the previous works. We perform some computations to show the behaviors of the capacitance in terms of the via geometry, and they are validated through comparison with a static/quasi-static simulation, full-wave electromagnetic simulation, and the previous analytical solutions of via capacitance.</P>
Myunghoi Kim,Kyoungchoul Koo,Chulsoon Hwang,Yujeong Shim,Joungho Kim,Jonghoon Kim IEEE 2012 IEEE transactions on electromagnetic compatibility Vol.54 No.3
<P>In this paper, we propose a compact and wideband electromagnetic bandgap (EBG) structure using a defected ground structure (DGS) to significantly enhance the wideband suppression of power/ground noise coupling in multilayer packages and printed circuit boards. The proposed EBG structure is implemented simply by adding a rectangular-shaped DGS which is etched periodically onto the ground plane without changing any other geometrical parameter from a mushroom-type EBG structure. The DGS effects on the f<SUB>L</SUB> and f<SUB>U</SUB> are thoroughly analyzed using the dispersion characteristics. We experimentally verified that the proposed EBG structure achieved the wideband power/ground noise suppression (below -40 dB) between 2.5 and 16.2 GHz. In addition, we demonstrated the considerable reduction in f<SUB>L</SUB> from 3.4 to 2.5 GHz and a significant increase in f<SUB>U</SUB> from 9.1 to 16.2 GHz when compared with the mushroom-type EBG structure.</P>
Jingook Kim,Junho Lee,Sunki Cho,Chulsoon Hwang,Changwook Yoon,Jun Fan IEEE 2014 IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS PART 1 R Vol.61 No.7
<P>An analytical methodology to calculate the probability density functions (PDFs) for the step pulse response of a single-ended buffer with arbitrary power-supply voltage fluctuations is proposed. To validate the theory, a silicon IC with noise-aggressing buffers and a victim buffer was designed, fabricated, and assembled in a printed circuit board (PCB). The overall power distribution network (PDN) of the IC and PCB was modeled from impedance measurements. The PDFs of the step pulse response of the victim buffer with power-supply voltage fluctuations were calculated and validated by comparisons with HSPICE and experimental results. The obtained PDFs due to power-supply voltage fluctuations could be combined with the statistical link simulation methods for quick estimation of bit error rate (BER).</P>
LTCC bandpass filter using 3D coupled helical inductors
Choi, SeungChul,Youm, JungEun,Heo, Keun,Lim, JuHwan,Park, ChulSoon,Hwang, SungWoo Wiley Subscription Services, Inc., A Wiley Company 2007 MICROWAVE AND OPTICAL TECHNOLOGY LETTERS Vol.49 No.5
<P>A new low-temperature co-fired ceramic (LTCC) bandpass filter using three-dimensionally coupled helical inductors is presented. The resonator is a via-connected multilayer helical inductor and the filter uses mixed coupling between face-to-face inductors. The fabricated filter exhibits the center frequency of 5.8 GHz, 3-dB bandwidth of 800 MHz, and the insertion loss of 1.9 dB. The size of the active region is 1.7 × 2.3 × 0.8 mm<SUP>3</SUP>. The measured results are consistent with the three-dimensional electromagnetic simulation and the equivalent circuit modeling. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 1146–1147, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI.10.1002/mop.22366</P>