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김종형(Jong Hyeong Kim),고경철(Kyung-chul Koh) 제어로봇시스템학회 2013 제어·로봇·시스템학회 논문지 Vol.19 No.12
A 3D visual sensing method using a laser structured beam is presented for robotic tracking applications in a simple and reliable manner. A cylindrical shaped laser structured beam is proposed to measure the pose and position of the target surface. When the proposed laser beam intersects on the surface along the target trajectory, an elliptic pattern is generated. Its ellipse parameters can be induced mathematically by the geometrical relationship of the sensor coordinate and target coordinate. The depth and orientation of the target surface are directly determined by the ellipse parameters. In particular, two discontinuous points on the ellipse pattern, induced by seam trajectory, indicate mathematically the 3D direction for robotic tracking. To investigate the performance of this method, experiments with a 6 axis robot system are conducted on two different types of seam trajectories. The results show that this method is very suitable for robot seam tracking applications due to its excellence in accuracy and efficiency.
김종형(Jong Hyeong Kim),Chanh D. Tr. Nguyen 제어로봇시스템학회 2013 제어·로봇·시스템학회 논문지 Vol.19 No.11
Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as“iso-slope contours” in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.
김종형(Jong Hyeong Kim),Chanh D. Tr. Nguyen 제어로봇시스템학회 2015 제어·로봇·시스템학회 논문지 Vol.21 No.12
Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as “iso-slope contours”. Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method.