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김종형(Jong Hyeong Kim),고경철(Kyung-chul Koh) 제어로봇시스템학회 2013 제어·로봇·시스템학회 논문지 Vol.19 No.12
A 3D visual sensing method using a laser structured beam is presented for robotic tracking applications in a simple and reliable manner. A cylindrical shaped laser structured beam is proposed to measure the pose and position of the target surface. When the proposed laser beam intersects on the surface along the target trajectory, an elliptic pattern is generated. Its ellipse parameters can be induced mathematically by the geometrical relationship of the sensor coordinate and target coordinate. The depth and orientation of the target surface are directly determined by the ellipse parameters. In particular, two discontinuous points on the ellipse pattern, induced by seam trajectory, indicate mathematically the 3D direction for robotic tracking. To investigate the performance of this method, experiments with a 6 axis robot system are conducted on two different types of seam trajectories. The results show that this method is very suitable for robot seam tracking applications due to its excellence in accuracy and efficiency.
김종형(Jong Hyeong Kim),Chanh D. Tr. Nguyen 제어로봇시스템학회 2013 제어·로봇·시스템학회 논문지 Vol.19 No.11
Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as“iso-slope contours” in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.
웨이퍼 레벨 패키지 공정의 웨이퍼 크기변화에 따른 최적화 설계
김종형(Kim, Jong Hyeong),고현준(Ko, Hyun Jun),임승용(Lim, Seung Yong) 한국전시산업융합연구원 2015 한국과학예술융합학회 Vol.19 No.-
최근 반도체 산업 동향은 생산 원가의 절감을 위해 12인치(300mm) 웨이퍼를 지나 18인치(450mm) 웨이퍼로 동향이 변하고 있는 추세이다. 때문에 치수 변화에 따른 웨이퍼 레벨 패키지 공정의 박막 증착을 위한 공정의 호환성 검증이 필요시 된다. 웨이퍼 레벨패키지 기술은 웨이퍼 표면상에 회로 패키지를 형성함으로 패키지의 크기를 최소화 할 수 있는 반도체기술이다. 이러한 패키징 공정에 있어 가장 중요한 요소는 휨과 깨짐 현상이다. 우리는 12인치와 18인치의 웨이퍼에 댐의 높이 및 열 분포에 따른 열적 특성을 유한요소해석 방식을 통해 최적화 공정을 설계하려 한다. 여기서 댐이란 웨이퍼 상의 이미지 센서의 균일한 부착 및 충전물질이 넘치는 것을 방지하는 역할을 한다. 때문에 본 연구에서는 유한요소 해석을 통해 댐의 형상이 패키지의 신뢰성 성능에 끼치는 영향성을 판단하고, 3D 모델링된 패키지 모델에 대한 열적 기계적 시뮬레이션을 통해 결과를 분석하였다. Recently the wafer size migration from 12" (300 mm) to 18" (450 mm) for the industry cost reduction can be achieved. Because it requires better thin film deposition property and the larger process compatibility. Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and crack are major concerns for semiconductor manufacturing. We optimized the 12” and 18” wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.