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정해도(Hae-Do Jeong),이창석(Chang-Suk Lee),김지윤(Ji-Yoon Kim) 한국기계가공학회 2012 한국기계가공학회지 Vol.11 No.1
Chemical mechanical polishing(CMP) technology is faced with the challenge of processing new electronic materials. This paper focuses on the balance between chemical and mechanical reactions in the CMP process that is required to cope with a variety of electronic materials. The material properties were classified into the following categories: easy to abrade(ETA), difficult to abrade(DTA), easy to react(ETR) and difficult to react(DTR). The chemical and mechanical balance for the representative ETA-ETR, DTA-ETR, ETA-DTR and DTA-DTR materials was considered for defect-free surfaces. This paper suggests the suitable polishing methods and examples for each electronic material.
김범수,정해도,배원병,Kim, Beom-Su,Jeong, Hae-Do,Bae, Won-Byeong 대한기계학회 2000 大韓機械學會論文集A Vol.24 No.1
As dies and molds have become more and more complicated in the recent years, the demand for lower cost and shorter production time is also growing stronger. Rapid prototyping and Tooling technologies are expected to be used for more rapid and lower cost tool fabrication. However the rapid tooling methods have not yet reached the level of application to the manufacturing of metallic dies and molds which require high dimensional accuracy. As the rapid tooling technology, there are the slurry casting, the powder casting, the direct laser sintering, and so on. Generally, in the slurry casting, the alumina powder and the water soluble phenol were mainly used. However, the mechanical properties of the phenol were not good enough to apply to molds directly. In this study, pure epoxy and two types of aluminium powder reinforced resin are applied to the slurry casting. The mechanical and thermal properties are better than phenol because the epoxy is the thermosetting resin. And mechanical characteristics such as shrinkage rate, hardness, surface roughness are measured for the sake of comparison. Metal powder reinforced resin molds are better than the resin tool form the viewpoint of shrinkage rate and hardness. Finally, it has been shown that the application possibility of this process is high, because the manufacturing time and cost savings are significant.
실리콘 연마에서 패드 버핑 공정이 연마특성에 미치는 영향
박기현,정해도,박재홍,마사하루키노시타,Park, Ki-Hyun,Jeong, Hae-Do,Park, Jae-Hong,Kinoshita, Masaharu 한국전기전자재료학회 2007 전기전자재료학회논문지 Vol.20 No.4
This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.