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통합절삭 시뮬레이션 시스템용 선삭표면조도 시뮬레이션 알고리즘의 설계
장동영(Dong Young Jang) 한국시뮬레이션학회 1999 한국시뮬레이션학회 논문지 Vol.8 No.1
The fundamental issues to evaluate machine tools performance through simulation pertain to the physical models of the machine tool itself and of process while the practical problems are related to the development of the modular software structure. It allows the composition of arbitrary machine/process models along with the development of programs to evaluate each state of machining process. Surface roughness is one of the fundamental factors to evaluate machining process and onnance of machine tool, but it is not easy to evaluate surface roughness due to its tribological complexity. This paper presents an algorithm to calculate surface roughness considering cutting geometry, cutting parameters, and contact dynamics of cutting between tool d wor ,iece as well as tool wear in turning process. This proposed algorithm could be used in the designed virtual machining system. The system can be used to evaluate the surface inte ity of a turned surface during the design and process planning phase for the design for manufacturability analysis of the concurrent engineering.
장동영(Jang Dong-Young),김동환(Kim Dong-Hwan),박만진(Park Man-Jin),양희남(Yang Hee-Nam) 한국생산제조학회 2005 한국공작기계학회 추계학술대회논문집 Vol.2005 No.-
The scanning electron microscope(SEM) is an important research and production tool extensively used in many phases of industry throughout the world. The popularity of the instrument results from the need to inspect and obtain information about samples with ever-decreasing structure. The SEM provides higher resolution analysis and inspection than that afforded by current techniques using the optical microscope. Furthermore, unlike the optical microscope, the SEM offers a wide variety of analytical modes, each contributing unique information regarding the physical, chemical, and electrical properties of a particular specimen, device, or circuit.
장동영(Dong-Young Jang),오은택(Eun-Tack Oh) 대한전자공학회 2007 대한전자공학회 학술대회 Vol.2007 No.7
본 논문에서는 인간의 시각 특성 중 특정 물체의 거리를 지각하는 메커니즘을 실시간 처리를 위해 하드웨어로 구현하였다. 본 논문에서 구현된 시스템은 크게 스테레오 영상 입ㆍ출력부는 ALTERA 사이 Excalibur을 기반으로 하여 Image Decoder, UART, SDRAM, SRAM, TFT-LCD등으로 구성된 Image Board로 스테레오 영상을 받아 처리할 수 있게 설계하였다. IP부분은 Image Decoder 내부 레지스터를 설정하기 위한 I2C 버스, IP 두 개의 Image Decoder를 통해 들어오는 스테레오 영상 입력 IP, 에러 보정을 위한 미디언 필터링 IP부, 에지 검출 IP, 거리를 검출하기 위한 스테레오 정합을 IP와 결과 영상을 보여주기 위한 TFT-LCD IP를 구현하였다.
장동영(Dong-Young Jang),반창우(Chang-Woo Ban),임영환(Young-Hwan Lim),홍석기(Suk-Ki Hong) 대한기계학회 2009 大韓機械學會論文集A Vol.33 No.9
In this paper, bonded wafer analysis system is proposed using laser beam transmission; while the transmission model is derived by simulation. Since the failure of bonded wafer stems in void existence, transmittance deviations caused by the thickness of the void are analyzed and variations of the intensity through the void or defect easily have been recognized then the testing power has been increased. In addition, large screen display on laser study has been done which resulted in acquiring a feasible technique for analysis of the whole bonding surface. In this regard, three approaches are demonstrated in which Halogen lamp, IR lamp and laser have been tested and subsequently by results comparison the optimized technique using laser has been derived.
장동영(D.Y Jang),권오성(O.S KWON),박만진(M.J Park),김승재(S.J KIM) Korean Society for Precision Engineering 2014 한국정밀공학회지 Vol.31 No.7
Sensor node means a device to include sensor, amplifier, and data acquisition (DAQ) equipment. The sensor converts physical signals to electric signals and weak signals from the sensor can be amplified through the amplifier. DAQ equipment converts analog signal to digital signal and collects converted digital signal. Since the sensor node is sensitive to the environment so that selection of mounting position and fixture design of sensor are applied differently depending on the characteristics of a target. This study is about designing and manufacturing sensor node to be used in a machine tool. The environment of machine tool is very severe due to noise, temperature fluctuation, and dust, etc. Hence, the sensor and amplifier must be designed and manufactured by considering the environmental issues. The designed and manufactured sensor node was tested for the reliability and effectiveness of the developed sensor nodes in the study.