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${Cu_6}{Sn_5}$ 및 Cu 분산에 따른 Sn-Pb 솔더합금의 미세구조와 기계적 성질
이광응,최진원,이용호,오태성,Lee, Gwang-Eung,Choe, Jin-Won,Lee, Yong-Ho,O, Tae-Seong 한국재료학회 2000 한국재료학회지 Vol.10 No.11
기계적 합금화 공정으로 제조한 $1{\mu\textrm{m}}$ 이하 크기의 $Cu_6Sn_5$를 63Sn-37Pb 솔더합금에 첨가하여, $Cu_6Sn_5$ 첨가분율에 따른 미세구조와 기계적 성질을 Cu를 첨가한 솔더합금과 비교하였다. $Cu_6Sn_5$를 첨가한 솔더합금에 비해 Cu를 첨가한 솔더합금에서 첨가분율에 따른 $Cu_6Sn_5$ 함량의 증가와 크기 성장의 정도가 더욱 현저하게 발생하였다. Cu를 첨가한 솔더합금에 비해 $Cu_6Sn_5$를 첨가한 솔더합금에서 항복강도의 향상 정도는 저하하였으나, 더 높은 최대인장강도를 얻을 수 있었다. 1~9 vol%의 $Cu_6Sn_5$를 첨가함에 따란 63Sn-37Pb 솔더합금의 항복강도가 23 MPa에서 36MPa 정도로 증가하였으며, 1~9vol%의 Cu 첨가시에는 항복강도가 40 MPa로 향상되었다. 각기 5 vol%의 $Cu_6Sn_5$와 Cu를 첨가함에 따라 63Sn-37Pb 솔더합금의 인장강도가 34.7 MPa에서 45.3MPa and to 43.1 MPa로 향상되었다. Microstructure and mechanical properties of the $Cu_6Sn_5$-dispersed 63Sn-37Pb solder alloy, for which $Cu_6Sn_5$ powders less than $1{\mu\textrm{m}}$ size were fabricated by mechanical alloying, were characterizde and compared with those of the Cu-dispersed solder alloy. Compared to the $Cu_6Sn_5$-dispersed solder alloy, large amount of $Cu_6Sn_5$ and fast growth of $Cu_6Sn_5$ were observed in the Cu-dispersed alloy. The $Cu_6Sn_5$-dispersed solder alloy exhibited lower yield strength, but higher ultimate tensile strength than those of the Cu-dispersed alloy. With dispersion of 1~9 vol% $Cu_6Sn_5$ and Cu, the yield strength increased from 23 MPa and to 40 MPa, respectively. The ultimate tensile strength increased from 34.7 MPa to 45.3 MPa and to 43.1 MPa with dispersion of 5 vol% $Cu_6Sn_5$ and Cu, respectively.
${Cu_6}{Sn_5}$를 분산시켜 스크린 프린팅법으로 제조한 Sn-Pb 솔더범프의 전단강도
최진원,이광응,차호섭,오태성,Choe, Jin-Won,Lee, Gwang-Eung,Cha, Ho-Seop,O, Tae-Seong 한국재료학회 2000 한국재료학회지 Vol.10 No.12
63Sn-37Pb에 Cu$_{6}$Sn$_{5}$를 분산시킨 760$\mu\textrm{m}$크기의 솔더범프를 Au(0.5$\mu\textrm{m}$)/Ni(5$\mu\textrm{m}$)/Cu(27$\pm$20$\mu\textrm{m}$) BGA 기판에 스크린)/Ni(5im)/Cu(27:201m) B3GA 기판에 스크린 프린팅법으로 제조하여, 리플로우 피크온도 유지시간, 15$0^{\circ}C$ 시효처리 시간에 따른 전단강도를 분석하였다. Cu$_{6}$Sn$_{5}$를 첨가한 솔더범프는 피크온도에서 30초간 유지시에는 63Sn-37Pb 솔더범프보다 높은 전단강도를 나타내었으나, 피크온도 유지시간을 60초 이상으로 증가시킴에 따라 전단강도가 63Sn-37Pb 솔더범프보다 저하하였다. 전단시험 후 솔더범프의 파단면은 초기에 전단 균열의 점진적인 전파에 의해 발생된 파괴부위와 점진적 균열전파에 의한 면적 감소로 솔더범프가 급격히 떨어져 나가면서 발생한 파괴부위로 구분할 수 있었다 피크온도 유지시간, 15$0^{\circ}C$ 시효처리 시간 및 Cu$_{6}$Sn$_{5}$ 첨가량에 무관하게 점진적 파괴모드에 의한 균열 전파길이가 증가할수록 솔더범프의 전단강도가 감소하였다.감소하였다. Cu$_{6}$Sn$_{5}$-dispersed 63Sn-37Pb solder bumps of 760$\mu\textrm{m}$ size were fabricated on Au(0.5$\mu\textrm{m}$)/Ni(5$\mu\textrm{m}$)/Cu(27$\pm$20$\mu\textrm{m}$) BGA substrates by screen printing process, and their shear strength were characterized with variations of dwell time at reflow peak temperature and aging time at 15$0^{\circ}C$ . With dwell time of 30 seconds at reflow peak temperature, the solder bumps with Cu$_{6}$Sn$_{5}$ dispersion exhibited higher shear strength than the value of the 63Sn-37Pb solder bump. With increasing the dwell time longer than 60 seconds, however the shear strength of the Cu$_{6}$Sn$_{5}$-dispersed solder bumps became lower than that the 63Sn-37Pb solder bumps. The failure surface of the solder bumps could be divided into two legions of slow crack propagation and critical crack propagation. The shear strength of the solder bumps was inversely proportional to the slow crack propagation length, regardless of the dwell time at peak temperature, aging time at 150 $^{\circ}C$ and the volume fraction of Cu$_{6}$Sn$_{5}$ dispersion.> 5/ dispersion.
기계적 합금화 공정으로 제조한($Pb_{1-x}Sn_x$)Te 가압소결체의 열전특성
이준수,최재식,이광응,현도빈,이희웅,오태성,Lee, Jun-Su,Choe, Jae-Sik,Lee, Gwang-Eung,Hyeon, Do-Bin,Lee, Hui-Ung,O, Tae-Seong 한국재료학회 1998 한국재료학회지 Vol.8 No.11
기계적 합금화 공정과 가압소결법으로 ($Pb_{1-x}Sn_x$)Te($0\leq{x}\leq{0.4}$)합금을 제조하여 SnTe 함량에 따른 열전특성을 분석하였다. PbTe와 ($Pb_{0.9}Sn_{0.1}$)Te 가압소결체는 각기 $200^{\circ}C$와 $300^{\circ}C$에서 p형에서 n형으로 천이되었으나, SnTe를 0.2몰 이상 함유한 가압소결체는 $450^{\circ}C$까지의 온도범위에서 p형 전도를 나타내었다. Extrinsic 전도영역에서 SnTe 함량이 증가함에 따라 ($Pb_{1-x}Sn_x$)Te 가압소결체의 Seebeck 계수와 전기비저항이 감소하였다. SnTe 함량이 증가함에 따라 (Pb1-xSnx)Te 가압소결체의 최대성능지수를 나타내는 온도가 고온으로 이동하였으며, ($Pb_{0.7}Sn_{0.3}$)Te 가압소결체는 $200^{\circ}C$에서 $0.68\times10_{-3}/K$의 최대성능지수를 나타내었다. Thermoelectric properties of ($Pb_{1-x}Sn_x$)Te ($0\leq{x}\leq{0.4}$) alloys, fabricated by mechanical alloying and hot pressing, were investigated with variation of the SnTe content. For the hot-pressed PbTe and ($Pb_{0.9}Sn_{0.1}$)Te. transition from p-type to n-type occurred at $200^{\circ}C$ and $300^{\circ}C$, respectively. However, the specimens containing SnTe more than 0.2mole exhibited p-type conduction up to 450'C. In extrinsic conduction region, the Seebeck coefficient and electrical resistivity of the hot-pressed ($Pb_{1-x}Sn_x$)Te decreased with increasing the SnTe content. The temperature at which the hot-pressed (Pbl-,Sn,)Te exhibited a maximum figure-of-merit was shifted to higher temperature with increasing the SnTe content The hot-pressed (Pbo ,Sno dTe exhibited a maximum figure-of-merit of $0.68\times10_{-3}/K$ at $200^{\circ}C$.
Na2Te 첨가량에 따른 (Pb0.7Sn0.3) Te 가압소결체의 열전특성
이희웅,현도빈,오태성,이준수,이선경,이광응 대한금속재료학회(대한금속학회) 1999 대한금속·재료학회지 Vol.37 No.3
Thermoelectric properties of (Pb_(0.7)Sn_(0.3))Te alloy, fabricated by mechanical alloying and hot pressing, were investigated with addition of Na₂Te up to 1.5 at% as acceptor dopant. A transition from p-type to n-type occurred at 425℃ for the undoped (Pb_(0.7)Sn_(0.3))Te. With doping Na₂ Te more than 0.1 at%, however, the hot-pressed (Pb_(0.7)Sn_(0.3))Te exhibited ptype conduction up to 450℃. Electrical resistivity of the hot-pressed (Pb_(0.7)Sn_(0.3)) Te increased by reduction treatment of the powders in hydrogen atmosphere before hot pressing, which was due to the fact that oxide layer on the powder surface was removed by reduction treatment. Figure-of-merit of the hot-pressed (Pb_(0.7)Sn_(0.3))Te was optimized to be 0.83×10^(-3)/K at 200℃ with doping 0.5 at% Na₂Te.
리블로스 1,5 - 이인산 탄산화효소 유전자의 분리 및 특성 규명
박성순(Sung Soon Park),김희진(Hee Jin Kim),김정호(Chung Ho Kim),김한집(Han Jip Kim),이종섭(Jong Seob Lee),이광응(Kwang Woong Lee),최양도(Yang Do Choi) 한국응용생명화학회 1994 Applied Biological Chemistry (Appl Biol Chem) Vol.37 No.5
To study the light-induced expression mechanism and protein transport into the chloroplast, a rice genomic clone (GrbcS) for the small subunit of ribulose 1,5-bisphosphate carboxylase (rbcS) was isolated and its nucleotide sequence was determined. Nucleotide sequence analysis of GrbcS revealed that the gene consists of two exons interrupted by an intron, encoding a protein of 175 amino acids including a transit peptide of 47 amino acids. These structural features of GrbcS are consistent with those of other rbcS genes from monocot species. Genomic Southern blot analysis suggested that the rbcS genes are present as a relatively small multigene family in the rice genome. Comparison of the nucleotide and deduced amino acid sequences to other rice rbcSs shows close sequence similaritiy. Conserved DNA sequences present in other light-responsive genes are also found in the 5′ upstream region of GrbcS such as G-box, 3AF1-binding site and GATA site. The possible function of these putative regulatory elements are discussed.