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유기첨가제 및 전류밀도에 의한 Sn 솔더 범프의 미세조직 형성 연구
김상혁,김성진,신한균,허철호,문성재,이효종,Kim, Sang-Hyeok,Kim, Seong-Jin,Shin, Han-Kyun,Heo, Cheol-Ho,Moon, Seongjae,Lee, Hyo-Jong 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.1
미세화 되고 있는 PCB 솔더 범프 접합을 위해 종래 마이크로 볼에 의한 PCB 솔더 범프의 제조를 대신하여 주석 전기도금을 통한 패턴을 제작하기 위한 도금액을 제작하고 도금공정 조건을 찾는 실험을 진행하였다. SR 패터닝 후에 Cu 씨드층을 형성하고, 다시 DFR 패터닝을 통해 PCB 기판상에 선택성장이 가능한 패턴을 제작하였다. 도금액은 메탄술폰산을 기본액으로 하는 주석도금액을 사용하였으며, 2가의 주석이온의 산화를 방지하기 위해 hydroquinone을 첨가하였다. 표면활성제로는 Triton X-100를 사용하고, 결정립 미세화를 위해 gelatin을 첨가하여 시료를 제작하였다. 전기화학적 분극곡선을 측정함으로써, Triton X-100 및 gelatin 첨가제의 작용 특성을 비교하였으며, gelatin이 -0.7 V vs. NHE까지 수소발생을 억제하는 것에 비해 Triton X-100을 첨가하게 되면 -1 V vs. NHE까지 수소발생이 억제되는 것을 확인할 수 있었다. 결정립의 크기는 전류밀도가 증가하면서 미세화되는 일반적 경향을 나타내었으며, gelatin을 첨가하는 경우에 보다 더 미세해지는 것이 관찰되었다. For the bonding of smaller PCB solder bumps of less than 100 microns, an experiment was performed to make up a tin plating solution and find plating conditions in order to produce a bump pattern through tin electroplating, replacing the previous PCB solder bumps process by microballs. After SR patterning, a Cu seed layer was formed, and then, through DFR patterning, a pattern in which Sn can be selectively plated only within the SR pattern was formed on the PCB substrate. The tin plating solution was made based on methanesulfonic acid, and hydroquinone was used as an antioxidant to prevent oxidation of divalent tin ions. Triton X-100 was used as a surfactant, and gelatin was used as a grain refiner. By measuring the electrochemical polarization curve, the characteristics of organic additives in Triton X-100 and gelatin were compared. It was confirmed that the addition of Triton X-100 suppressed hydrogen generation up to -1 V vs. NHE, whereas gelatin inhibited hydrogen generation up to -0.7 V vs. NHE. As the current density increased, there was a general tendency that the grain size became finer, and it was observed that it became finer when gelatin was added.
금속/그래핀 이중 구조 와이어의 합성 및 전기적 특성 연구
정민희,김동영,노호균,신한균,이효종,이상현,Jeong, Minhee,Kim, Dongyeong,Rho, Hokyun,Shin, Han-Kyun,Lee, Hyo-Jong,Lee, Sang Hyun 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.1
본 연구에서는 금속 와이어를 촉매로 화학기상증착법을 이용하여 그래핀을 합성하고 구조 및 전기적 특성 변화를 분석하였다. 구리와 니켈의 탄소에 대한 용해도 차이로 인해 구리와이어에서는 단층 그래핀이 성장하였고, 니켈와이어의 표면에는 다층 그래핀이 성장되었다. 또한. 고온의 그래핀 성장 조건에서 구리와 니켈의 재결정화를 통해 결정립의 크기가 증가한 것을 확인하였다. 표면에 그래핀이 합성된 구리와이어의 경우, 최대전류허용치는 1.91×105 A/㎠으로 합성 전 구리와이어에 비해 약 27% 향상되었다. 이와 유사하게, 다층 그래핀이 합성된 니켈와이어의 경우에도 최대전류 허용치는 순수한 니켈와이어 대비 약 36% 향상된 4.41×104 A/㎠으로 측정되었다. 이러한 그래핀/금속 복합소재의 우수한 전기적 특성은 고전류를 요구하는 소자 및 부품에서 안정적인 전기적 흐름을 공급하는데 기여할 수 있을 것이다. In this study, graphene layer was grown on metal microwire using chemical vapor deposition. The difference of carbon solubility between copper and nickel resulted in the formation of mono-layer and multi-layer graphene were formed on the surfaces of copper and nickel microwires, respectively. During the growth of graphene at high temperature, copper and nickel were recrytallized and the grain size increased. The ampacity of graphene/copper microwire was improved by approximately 27%, 1.91×105 A/㎠, compared to pristine copper microwire. Similar to this behavior, the ampacity of multilayer graphene/nickel microwire was 4.41×104 A/㎠ which is about about 36% improved compared to the pure nickel microwire. The excellent electrical properties of graphene/metal composites are beneficial for supplying the electrical energy to the high-power electronic devices and equipment.
Cu 필라 솔더 범프의 리플로우 전후 형상변화 및 모델링
김상혁 ( Sang Hyuk Kim ),신한균 ( Han Kyun Shin ),박채민 ( Chae Min Park ),김동욱 ( Dong Uk Kim ),차필령 ( Pil Ryung Cha ),이의형 ( Ui Hyoung Lee ),이효종 ( Hyo Jong Lee ) 대한금속재료학회(구 대한금속학회) 2015 대한금속·재료학회지 Vol.53 No.7
A Cu pillar bump was fabricated by consecutive plating of Cu and Sn. Here, we investigated the change in shape of Sn, and the formation of intermetallic compound during the reflow process. At first, we made a cylindrical shape of Sn in various thickness and then, the Sn was changed into a truncated sphere (Sn bump) on a Cu pillar through the reflow process. When the Sn thickness was a third of the Cu pillar diameter, the reflowed bump radius had a minimum value and the bump-height change at that time had a maximum value. Such results were well understood based on the truncated sphere model.
미세먼지 유도 기도염증에 대한 배암차즈기 추출물의 호흡기 보호 효과
송형우,지건영,김복규,양원경,한창균,신한재,박양춘,황지숙,강형식,김승형,Song, Hyeongwoo,Ji, Kon Young,Kim, Bok Kyu,Yang, Won Kyung,Han, Chang Kyun,Shin, Han Jae,Park, Yang Chun,Hwang, Ji Sook,Kang, Hyung Sik,Kim, Seung Hyung 한국약용작물학회 2017 한국약용작물학회지 Vol.25 No.5
Background: Small particles increase airway inflammation upon reaching the alveoli. Here, we investigated the protective or therapeutic effects of Salvia plebeia R. Br. (SP_R) extracts on airway inflammation. Methods and Results: To investigate the anti-inflammatory activity of SP_R extracts, we measured their inhibitory effect on the production of reactive oxygen species (ROS) expression of inflammatory mediators, and immune cell infiltration in MH-S alveolar macrophage cells and in the ambient particulate matter (APM)-exposed airway inflammation mice model. The SP_R extracts inhibited the production of ROS and expression of IL-4, IL-10, IL-15, and IL-17A mRNA in APM-stimulated MH-S cells. Oral administration of SP_R extracts suppressed APM-induced inflammatory symptoms, such as high alveolar wall thickness, excess collagen fibers, decreased mRNA expression of chemokines (Ccr9, Ccl5, Ccr3), inflammatory cytokines (IL-15, TNF-${\alpha}$), and IL-4 Th2 cytokine in the lung. The SP_R extracts also inhibited ROS production, granulocyte ($CD11b^+Gr-1^+$) infiltration, IL-17A, TNF-${\alpha}$, macrophage inflammatory protein (Mip-2), and chemokine (C-X-C motif) ligand 1 (Cxcl-1) production in the airway. The specific compounds in the SR-R extracts that mediate the anti-inflammatory effects were identified. Conclusions: In this study, SP_R extracts effectively inhibited airway inflammatory responses, such as ROS production and granulocyte infiltration into the airway, by regulating the expression of chemokines and inflammatory cytokines.