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박선희,오태성,Park, Sun-Hee,Oh, Tae-Sung 한국마이크로전자및패키징학회 2008 마이크로전자 및 패키징학회지 Vol.15 No.3
전기도금법으로 Cu 머쉬룸 범프를 형성하고 Sn 기판 패드에 플립칩 본딩하여 Cu 머쉬룸 범프 접속부를 형성하였으며, 이의 접속저항을 Sn planar 범프 접속부와 비교하였다. $19.1\sim95.2$ MPa 범위의 본딩응력으로 형성한 Cu머쉬룸 범프 접속부는 $15m\Omega$/bump의 평균 접속저항을 나타내었다. Cu머쉬룸 범프 접속부는 Sn planar범프 접속부에 비해 더 우수한 접속저항 특성을 나타내었다. 캡 표면에 $1{\sim}w4{\mu}m$ 두께의 Sn 코팅층을 전기도금한 Cu 머쉬룸 범프 접속부의 접속저항은 Sn 코팅층의 두께에 무관하였으나 캡 표면의 Sn코팅층을 리플로우 처리한 Cu머쉬룸 범프 접속부에서는 접속저항이 Sn 코팅층의 두께와 리플로우 시간에 크게 의존하였다. Cu mushroom bumps were formed by electrodeposition and flip-chip bonded to Sn substrate pads. Contact resistances of the Cu-mushroom-bump joints were measured and compared with those of the Sn-planar-bump joints. The Cu-mushroom-bump joints, processed at bonding stresses ranging from 19.1 to 95.2 MPa, exhibited contact resistances near $15m\Omega$/bump. Superior contact-resistance characteristics to those of the Sn-planar-bump joints were obtained with the Cu-mushroom-bump joints. Contact resistance of the Cu-mushroom-bump joints was not dependent upon the thickness of the as-elecroplated Sn-capcoating layer ranging from $1{\mu}m$ to $4{\mu}m$. When the Sn-cap-coating layer was reflowed, however, the contact resistance was greatly affected by the thickness and the reflow time of the Sn-cap-coating layer.
박선희,이승기,박종상 ( Sun Hee Park,Seung Ki Lee,Jong Sang Park ) 생화학분자생물학회 1992 BMB Reports Vol.25 No.1
K-ras gene expression in the regenerating liver of the patial hepatectomy was tested by using dot hybridization. The K-ras gene transcription after the patial hepatectomy is amplified and its RNA splicing patern is changed. In normal liver exon 4a is spliced out and only K-ras proteins containing exon 4b are produced. In regenerating liver exon 4b is spliced out and K-ras proteins containing exon 4a might be produced at least 1000% more than in the normal liver.
박선희,Park, Sun-Hee 한국주거학회 2011 한국주거학회 논문집 Vol.22 No.3
The aim of this study was to determine the basic perception of Kleingarten house planning of Jeonbuk area. The survey method was used for data collection. The major finding were as follows: 1) Almost all respondents have a very positive attitude the participant of Kleingarten. Many respondents wanted the cheapest price for the Kleingarten rental fee and for the travel time between their home and Kleingarten to be under an hour. 2) Two different size of 45 and 66 $m^2$ were preferable for the house floor plans. The most preferable floor plan type chosen by the respondents was a house design with a terrace and the elderly householders especially preferred a house floor plan with an LDK design. 54.3 per cent respondents liked the log house and 93.3 per cent respondents liked the eco-friendly building materials such as wood, earth (Korean natural earth: whangto), and adobe bricks etc. 3) There were more needs for useful facilities such as a pergola, a grassy lawn, small ponds, a playground for the childrens, patio table settings, etc.
문장음성인식을 위한 VCCV 기반의 언어모델과 Smoothing 기법 평가
박선희,노용완,홍광석,Park, Seon-Hee,Roh, Yong-Wan,Hong, Kwang-Seok 한국정보처리학회 2004 정보처리학회논문지B Vol.11 No.2
본 논문에서는 언어모델의 언어처리 단위로 VCCV(vowel consonant consonant vowel) 단위를 제안하구 기존의 언어처리 단위인 어적 형태소 단위와 비교한다. 어절과 형태소는 어휘수가 많고 높은 복잡도를 가진다. 그러나 VCCV 단위는 작은 사전과 제한된 어휘를 가지므로 복잡도가 적다. 언어모델 구성에 smoothing은 반드시 필요하다. smoothing 기법은 정확한 확률 예측이 불확실한 데이터가 있을 때 더 나은 확률 예측을 위해 사용된다. 본 논문에서는 형태소, 어절, VCCV 단위에 대해 언어모델을 구성하여 복잡도를 계산하였다. 그 결과 VCCV 단위의 복잡도가 형태소나 어절보다 적게 나오는 것을 볼 수 있었다. 복잡도가 적게 나온 VCCV를 기반으로 N-gram을 구성하고 Katz. Witten-Bell, absolute, modified Kneser-Ney smoothing 등의 방법을 이용한 언어 모델에 대해 평가하였다. 그 결과 VCCV 단위의 언어모델에 적합한 smoothing 기법은 modified Kneser-Ney 방법으로 평가되었다. In this paper, we propose VCCV units as a processing unit of language model and compare them with clauses and morphemes of existing processing units. Clauses and morphemes have many vocabulary and high perplexity. But VCCV units have low perplexity because of the small lexicon and the limited vocabulary. The construction of language models needs an issue of the smoothing. The smoothing technique used to better estimate probabilities when there is an insufficient data to estimate probabilities accurately. This paper made a language model of morphemes, clauses and VCCV units and calculated their perplexity. The perplexity of VCCV units is lower than morphemes and clauses units. We constructed the N-grams of VCCV units with low perplexity and tested the language model using Katz, absolute, modified Kneser-Ney smoothing and so on. In the experiment results, the modified Kneser-Ney smoothing is tested proper smoothing technique for VCCV units.
짧은 혈관경을 가진 부분 족지 전이술을 이용한 수지첨부의 즉시 재건
박선희,김학수,김성언,Park, Sun-Hee,Kim, Hak-Soo,Kim, Seong-Eon 대한미세수술학회 2012 Archives of reconstructive microsurgery Vol.21 No.1
We studied the results of the immediate microsurgical reconstruction of the distal digit injury with short vascular pedicled partial toe transfer. Thirteen patients with amputation or crush injury of the distal digit who underwent partial toe transfer at the authors' institute over 8-year period were reviewed. Delay between initial injury and reconstruction ranged from 1 to 9 days. All flaps were harvested on a short vascular pedicle, with anastomoses performed at a proximal interphalangeal joint level on the fingers and metacarpophalangeal joint level on the thumbs. Good to excellent cosmetic and functional results were obtained in all cases, with nearly normal-looking fingertip. The mean static two point discrimination was 10 mm. Immediate reconstruction with short vascular pedicled partial toe transfer is an excellent option for the reconstruction of the compostie defect of the distal digit.
박선희,Park, Sun-Hee 한국건축역사학회 1994 건축역사연구 Vol.3 No.2
The major characteristics of warrior houses in Edo period were as follows: (1)The disposition, size, and facilities of warrior houses was to be settled strictly according to the social position. (2)The spatial characteristics of warrior houses has conceptual o-rganization of dual structure, such as entertainment/daily life, high/low, outside/inside.
Under Bump Metallurgy의 종류와 리플로우 시간에 따른 Sn 솔더 계면반응
박선희,오태성,Park, Sun-Hee,Oh, Tae-Sung,Englemann, G. 한국마이크로전자및패키징학회 2007 마이크로전자 및 패키징학회지 Vol.14 No.3
웨이퍼 레벨 솔더범핑시 under bump metallurgy (UBM)의 종류와 리플로우 시간에 따른 Sn 솔더범프의 평균 금속간화합물 층의 두께와 UBM의 소모속도를 분석하였다. Cu UBM의 경우에는 리플로우 이전에 $0.6\;{\mu}m$ 두께의 금속간화합물 층이 형성되어 있었으며, $250^{\circ}C$에서 450초 동안 리플로우함에 따라 금속간화합물 층의 두께가 $4\;{\mu}m$으로 급격히 증가하였다. 이에 반해 Ni UBM에서는 리플로우 이전에 $0.2\;{\mu}m$ 두께의 금속간화합물 층이 형성되었으며, 450초 리플로우에 의해 금속간화합물의 두께가 $1.7\;{\mu}m$으로 증가하였다. Cu UBM의 소모속도는 15초 리플로우시에는 100 nm/sec, 450초 리플로우시에는 4.5 nm/sec이었으나, Ni UBM에서는 소모속도가 15초 리플로우시에는 28.7 nm/sec, 450초 리플로우시에는 1.82 nm/sec로 감소하였다. Thickness of intermetallic compounds and consumption rates of under bump metallurgies (UBMs) were investigated in wafer-level solder bumping with variations of UBM materials and reflow times. In the case of Cu UBM, $0.6\;{\mu}m-thick$ intermetallic compound layer was formed before reflow of Sn solder, and the average thickness of the intermetallic compound layer increased to $4\;{\mu}m$ by reflowing at $250^{\circ}C$ for 450 sec. On the contrary, the intermetallic layer had a thickness of $0.2\;{\mu}m$ on Ni UBM before reflow and it grew to $1.7\;{\mu}m$ thickness with reflowing for 450 sec. While the consumption rates of Cu UBM were 100nm/sec fur 15-sec reflow and 4.50-sec for 450-sec reflow, those of Ni UBM decreased to 28.7 nm/sec for 15-sec reflow and 1.82 nm/sec for 450-sec reflow.