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요양급여적정성 평가자료를 이용한 예방적 항생제 사용과 수술부위 감염 발생의 관련성 연구
김경훈,박춘선,장진희,김남순,이진서,최보람,이병란,이규덕,김선민,염선아,Kim, Kyoung-Hoon,Park, Choon-Seon,Chang, Jin-Hee,Kim, Nam-Soon,Lee, Jin-Seo,Choi, Bo-Ram,Lee, Byung-Ran,Lee, Kyoo-Duck,Kim, Sun-Min,Yeom, Seon-A 대한예방의학회 2010 예방의학회지 Vol.43 No.3
Objectives: To examine the prophylactic antibiotic use in reducing surgical site infection. Methods: This was a retrospective study for patients aged 18 years and older who underwent gastrectomy, cholecystectomy, colectomy, cesarean section and hysterectomy. The data source was quality assessment data of the Health Insurance Review & Assessment Service gathered from medical records of 302 national hospitals. Prophylactic antibiotic use was defined as: timely antibiotic administration or inappropriate antibiotic selection. We performed hierarchical logistic regression to examine the association between prophylactic antibiotic use and surgical site infection with adjustment for covariates. Results: The study population consisted of 16 348 patients (1588 gastrectomies, 2327 cholecystectomies, 1,384 colectomies, 3977 hysterectomies and 7072 cesarean sections) and surgical site infection was identified in 351 (2.1%) patients. The rates of timely antibiotic administration and inappropriate antibiotic selection varied according to procedures. Cholecystectomy patients who received timely prophylactic antibiotic had a significantly reduced risk of surgical site infection compared with those who did not receive a timely prophylactic antibiotics (OR 0.64, 95% CI=0.50-0.83), but no significant reduction was observed for other procedures. When inappropriate prophylactic antibiotics were given, the risk of surgical site infection significantly increased: 8.26-fold (95% CI=4.34-15.7) for gastrectomy, 4.73-fold (95% CI=2.09-10.7) for colectomy, 2.34-fold (95% CI=1.14-4.80) for cesarean section, 4.03-fold (95% CI=1.93-8.42) for hysterectomy. Conclusions: This study examines the association among timely antibiotic administration, inappropriate antibiotic selection and surgical site infection. Patients who received timely and appropriate antibiotics had a decreased risk of surgical site infection. Efforts to improve the timing of antibiotic administration and use of appropriate antibiotic are needed to lower the risk of surgical site infection.
신뢰도를 요구하는 임베디드 시스템에서의 저전력 태스크 스케쥴링
김경훈,김유나,김종,Kim, Kyong Hoon,Kim, Yuna,Kim, Jong 대한임베디드공학회 2008 대한임베디드공학회논문지 Vol.3 No.1
In this paper, we provide an adaptive power-aware checkpointing scheme for fixed priority-based DVS scheduling in dependable real-time systems. In the provided scheme, we analyze the minimum number of tolerable faults of a task and the optimal checkpointing interval in order to meet the deadline and guarantee its specified reliability. The energy-efficient voltage level at a fault arrival is also analyzed and used in the recovery of the faulty task.
Sol-Gel 법을 이용한 칼슘-알루미네이트계 전자화물 박막의 제조와 특성
김경훈,박주석,채재홍,서원선,소성민,김태관,김형순,이병하,Kim, K.H.,Park, J.S.,Chae, J.H.,Seo, W.S.,So, S.M.,Kim, T.K.,Kim, H.S.,Lee, B.H. 한국결정성장학회 2010 한국결정성장학회지 Vol.20 No.6
Sol-gel법을 적용하여 $12CaO{\cdot}7Al_2O_3$(C12A7) 전자화물 박막을 제조하기 위해 CaO-$Al_2O_3$ sol을 제조하여 dip 코팅법을 적용하여 quartz 기판에 박막을 형성하였으며 열처리를 통해 C12A7의 박막을 제조하였다. C12A7 상의 형성 $800^{\circ}C$에서 시작되었고 $1,200^{\circ}C$ 온도에서 1시간 열처리를 통해 치밀화된 박막을 제조할 수 있었다. 제조된 C12A7 박막은 부도체였지만 수소 환원 분위기 열처리를 통해 전기전도도를 나타내기 시작했으며 $1,200^{\circ}C$ 48시간 열처리 시 120 S/cm의 전기전도도를 나타내었다. The Calcium-aluminate electride thin films on the quartz substrates was coated by sol-gel process. The crystallization of the C12A7 thin film was observed at $800^{\circ}C$ and high density C12A7 thin film was achieved on heat treatment at $1,200^{\circ}C$ for 1 hour. The reduction heat treatment of C12A7 thin film could be converted from insulator to conductor and the electrical conductivity was 120 S/cm in the C12A7 thin film heat treated at $1,200^{\circ}C$ with $H_2$ gas for 48 hours.
12-몰리브도 인산 동염 촉매상에 서 아크롤레인의 선택 산화반응
김경훈,나석은,박대원 ( Kyung Hoon Kim,Suk Eun Na,Dae Won Park ) 한국공업화학회 1993 공업화학 Vol.4 No.4
Cu_xH_3-2_xPMo_(12)O_(40)·_nH_20에서 구리의 치환양 x를 변화시켜 여러 가지의 헤테로폴리산 동염 촉매를 제조하고, 열분석, X-선 회절분석, 적외선 분광분석, 비표면적 측정, 전자현미경 분석, 암모니아의 승온탈착법 등으로 촉매의 특성을 조사하였다. 아크롤레인의 산화반응에 대한 이 촉매계의 반응특성은 고정층 연속반응기에서 조사하였다. 이 촉매들은 200℃ 근처에서 결정수의 탈리가 일어났고 구리의 치환에 따른 구조수의 탈리는 300∼400℃ 사이에서 관찰되었다. 이들 촉매는 Keggin 구조를 가짐을 확인할 수 있었고, 구리의 치환양이 증가함에 따라 Keggin 음이온인 (PMo_(12)0(40))^(3-)의 분해 정도가 증가하였으며, 이때 분해 생성물로 소량의 MoO_3와 P_2O_5가 관찰되었다. X가 증가할수록 아크롤레인의 전화율이 감소하였는데 이것은 비표면적과 전체 산점의 양이 감소하였기 때문인 것으로 판단된다. 그러나 단위면적당 반응속도와 아크릴산의 선택도는 x=1.0에서 가장 높게 나타났으며 이 촉매는 독특한 산점분포를 나타내었다. Various catalysts of Cu_kH_3-(2x)PMo_(12)O_(40)·nH_2O with different x-values have been prepared and characterized by thermal analysis, X-ray powder diffraction, infrared spectroscopy, BET surface-area measurement, electron micros-copy, and temperature programmed desorption of ammonia. The properties of these catalysts in acrolein oxidation have been investigated in a continuous-flow fixed-bed reactor. The catalysts lost their water of crystallization at about 200℃ and their constitutional water between 300 and 400℃. The Keggin structure of the catalysts was identified by infrared spectroscopy. The decomposition of Keggin anion, (PMo_(12)O(40))^(3-), was increased with the increase of substituted copper content and identifiable MoO_3 and P_2O_5 as decomposition products were observed. The conversion of acrolein decreased with the increase of x probably due to the decrease of specific surface area and of total amount of acid sites. But specific reaction rate and selectivity to acrylic acid were maximized at x= 1.0, and it showed specific acid site distributions.
방전 플라즈마 소결법을 이용한 CoSb<sub>3</sub>계 열전재료의 전극 접합 및 특성
김경훈,박주석,안종필,Kim, K.H.,Park, J.S.,Ahn, J.P. 한국결정성장학회 2010 韓國結晶成長學會誌 Vol.20 No.1
중고온용 열전 소재로 우수한 특성을 나타내는 $CoSb_3$계 소재의 열전 소자 제조를 위해 방전플라즈마 소결법을 이용하여 소결 및 Cu-Mo 전극 소재와의 접합을 동시에 실시하였다. $CoSb_3$ 내부로의 Cu 확산을 방지하기 위해 Ti을 중간층으로 삽입하였으며 열팽창계수의 조절을 위해 Cu : Mo = 3 : 7 부피비 조성을 선택하였다. 삽입된 Ti과 $CoSb_3$는 $TiSb_2$ 이 차상을 형성하면서 접합이 진행되었지만 접합 온도 및 접합 시간의 증가에 따라 TiSb 및 TiCoSb 등의 상의 형성에 의해 접합 계면에서 균열이 발생되어 접합 특성을 악화시키는 것으로 밝혀졌다. $CoSb_3$-based skutterudite compounds are promising candidates as thermoelectric (TE) materials used in intermediate temperature region. In this study, sintering of $CoSb_3$ powder and joining of $CoSb_3$ to copper-molybdenum electrode have been simultaneously performed by spark plasma sintering technique. The Ti foil was used for preventing the diffusion of copper into $CoSb_3$ and the Cu : Mo = 3 : 7 Vol. ratio composition was selected by the consideration of thermal expansion coefficients. The insertion of Ti interlayer between Cu-Mo and $CoSb_3$ was effective to join $CoSb_3$ to Cu-Mo by forming an intermediate layer of $TiSb_2$ at the Ti-$CoSb_3$ boundary. However, the formation of TiSb and TiCoSb intermediate layers deteriorated the joining properties by the generation of cracks in the interface of intermediate layer/$CoSb_3$ and intermediate/intermediate layers.
고속 웹 이송속도 및 복잡한 롤 패턴 형상을 고려한 R2R공정에서의 잉크전달 특성 해석
김경훈,김소희,나양,Kim, Kyung-Hun,Kim, So-Hee,Na, Yang 한국반도체디스플레이기술학회 2010 반도체디스플레이기술학회지 Vol.9 No.2
Ink transfer process from the printing roll to the moving web was investigated using a CFD technique for the application in R2R printed electronics. In line with the requirement that the web handling speed needs to be increased further for the cost competitiveness, the effects of web moving velocity with relatively complex roll patterns were analyzed. To make the present analysis more realistic, the numerical geometry and the ink properties were selected to match those of the real printing production system. Our numerical results showed that both web handling speed and complex printing-roll patterns influenced the shape of the transferred ink. As the web moving speed approaches towards 30mpm, a significant distortion of the shape of the transferred ink occurred. In the range of pattern width smaller than 100 microns, a phase distortion was also found to occur in all the printing-roll patterns considered in the present work but the ratio of the phase distortion to the line width gets smaller as the width becomes smaller. Thus, the web handling speed and the shape of printing-roll pattern will be important elements for the better printing quality under 100 micron line width range.