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윤정원,방정환,고용호,유세훈,김준기,이창우,Yoon, Jeong-Won,Bang, Jung-Hwan,Ko, Yong-Ho,Yoo, Se-Hoon,Kim, Jun-Ki,Lee, Chang-Woo 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.4
The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.
BALB/c 마우스에서 동종 지방유래 기질세포가 창상치유에 미치는 영향
윤정원,임진수,김정남,유결,Yoon, Jeong-Won,Lim, Jin-Soo,Kim, Jung-Nam,Yoo, Gyeol 대한성형외과학회 2010 Archives of Plastic Surgery Vol.37 No.4
Purpose: Adipose-derived stromal cells (ADSCs) are multipotent cells that have been found to promote wound healing through the process of angiogenesis and reepithelialization. Generally, it is well known that the antigenicity of ADSCs doesn't affect stem cell therapy. In this study, we investigated the effect of allogeneic ADSCs in the wound healing process by applying allogeneic ADSCs on the wound healing splint model of mice. Methods: Adipose tissue was harvested from the epididymal fat pads of BALB/c and C57BL/6 mice. Twenty four mice BALB/c were divided into three groups; control, isogeneic, and allogeneic groups. Two full thickness defects with 6 mm diameters were created on the back of BALB/c mice. $1{\times}10^6$ ADSCs from BALB/c mice were applied on the isogeneic group. In the allogeneic group, ADSCs from the C57BL/6 mice were applied. No cells were applied to the control group. The sizes of the wounds were evaluated in 3, 5, 7, 10, and 14 days after the wounds were applied, and tissues were harvested in 7 and 14 days for histological analysis. Results: Wound healing rates had showed significant increase in 10, and 14 days when the isogeneic group was compared to the control group, but the allogeneic group showed significantly decrease compared to the isogeneic group (p<0.05). Histological scores in the isogeneic group were significantly high, but significantly lower in the allogeneic group when compared to the isogeneic group in 2 weeks (p<0.05). In the isogeneic group, thick inflammatory cell infiltration with abundant capillaries were observed in 1 week, and thick epithelium with many large capillaries were observed in 2 weeks. Conclusion: When isogeneic ADSCs were applied to wounds, they presented a faster wound healing rate compared to controls and the allogeneic group. Unlike general stem cell therapy, these findings suggest that cell therapy targeted at enhancing wound healing may benefit from the use of ADSCs with identical antigenicity, as opposed to allogeneic or xenogenic ADSCs.
김옥희,최정은,윤정원,유화승,Kim, Ok-Hee,Choi, Jung-Eun,Yoon, Jeung-Won,Yoo, Hwa-Seung 대한암한의학회 2011 大韓癌韓醫學會誌 Vol.16 No.1
Objective : The study aims to investigate the effect of moxibustion treatments on autonomic nervous system function of cancer patients through the evaluation of heart rate variability (HRV) biofeedback testing. Materials and Methods : Six cancer patients from inpatient care unit of Dunsan Oriental Hospital, Daejeon University were given three moxibustion treatment sessions every other day over one week period on five Oriental Medicine meridian points CV4, CV6, CV12, KD1, and PC8. HRV biofeedback was conducted before and after each treatment sessions. Three areas of analyses were done from the test conducted; Time Domain Analysis, Frequency Domain Analysis and Autonomic Nervous System (ANS) balance analysis. Results : Time Domain Analysis has shown increased Standard Deviation of all Normal R-R Intervals (SDNN), and decreased Mean Heart Rate and Physical Stress Index (PSI) levels, with statistical significance (P<0.05). In Frequency Domain Analysis, series of moxa treatments have increased Total Power (TP), Very Low Frequency Oscillation Power (VLF), High Frequency Oscillation Power (HF), normalized HF values while decreasing Low Frequency Oscillation Power (LF), normalized LF and LF/HF ratio with statistical significance (P<0.05). The values of ANS activity, ANS balance, Stress resistance, Stress index, have also shown significant changes. For cardiac stability stroke volume power (SP) and Blood Vessel Tension (BVT) were followed, which were both increased after treatment. All changes were statistically significant (P<0.05). Conclusion : The results have shown a positive correlation between the moxibustion treatments and autonomic nervous system responses on cancer patients through the HRV biofeedback testing. This study suggests possible application of moxibustion treatments for managing ANS functions of cancer patients, although additional studies with larger population are necessary to confirm the data.
미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성
백종훈,이병석,유세훈,한덕곤,정승부,윤정원,Back, Jong-Hoon,Lee, Byung-Suk,Yoo, Sehoon,Han, Deok-Gon,Jung, Seung-Boo,Yoon, Jeong-Won 한국마이크로전자및패키징학회 2017 마이크로전자 및 패키징학회지 Vol.24 No.1
본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에 대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 $(Cu,Ni)_6Sn_5$ 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 $(Cu,Ni)_3Sn$ 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에 따라 취성 파괴율이 증가하였다. In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.
Sn-3.0Ag-0.5Cu 솔더 접합부의 계면반응과 취성파괴율에 미치는 Thin ENEPIG 도금두께의 영향
백종훈(Jong-Hoon Back),유세훈(Sehoon Yoo),한덕곤(Deok-Gon Han),정승부(Seung-Boo Jung),윤정원(Jeong-Won Yoon) 대한용접·접합학회 2018 대한용접·접합학회지 Vol.36 No.5
In this paper, we evaluated the interfacial reactions and brittle fracture behaviors of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layers with different Ni and Pd thicknesses for fine-pitch package applications. Firstly, the interfacial reactions and mechanical reliability of Sn-3.0Ag-0.5Cu (SAC305)/thin ENEPIG solder joints were evaluated. (Cu,Ni)6Sn5 intermetallic compound (IMC) was formed at all of the thin ENEPIG interfaces, and P-rich Ni layer was also observed at the joint interface of the Pd substrate with 0.3 ㎛ Ni thickness. The interfacial IMC thickness decreased with increasing Ni and Pd thicknesses. In addition, the IMC thickness was affected by the contents of the Pd plating layer. The IMC thickness for the Pd-P substrate was thicker than that for the Pd substrate. In the high-speed shear test, the brittle fracture rate decreased with increasing Ni and Pd thickness. Also, the brittle fracture rate was affected by the components of the Pd plating layer, and the brittle fracture rate for the Pd substrate was lower than that for the Pd-P substrate. The ENEPIG joint with thicker Ni plating layer had superior interfacial stability and mechanical reliability.
0.1 ㎛ Ni두께를 가지는 얇은 ENEPIG 층과 Sn-3.0Ag-0.5Cu 솔더와의 계면반응 및 접합강도
백종훈(Jong-Hoon Back),유세훈(Sehoon Yoo),한덕곤(Deok-Gon Han),정승부(Seung-Boo Jung),윤정원(Jeong-Won Yoon) 대한용접·접합학회 2017 대한용접·접합학회지 Vol.35 No.6
A new multilayer metallization, ENEPIG (electroless nickel electroless palladium immersion gold) with 0.1㎛ thin Ni(P) layer (thin-ENEPIG), was plated on a Cu PCB substrate for fine-pitch package applications. We evaluated interfacial reactions and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate during various reflow times. In the initial soldering reaction, (Au,Cu)Sn₄ intermetallic compound (IMC) formed at the SAC305/ENEPIG interface. After prolonged reflow reactions, the Pd and Ni layers were consumed, and (Cu,Ni)6Sn5 IMC formed on the Cu layer. As the reflow time increased, the Cu and Ni contents in (Cu,Ni)6Sn5 IMC increased and decreased, respectively, due to the limited Ni layer in the ENEPIG plating layer. In the low-speed shear test, all fractures occurred in the bulk solder regardless of reflow times. In the high-speed shear test, the fracture mode was changed from ductile to brittle with increasing reflow time, due to the formation of the thick interfacial IMC.