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오태식,김용배,리갑수,장봉기,이병국 순천향대학교 산업의학연구소 1998 순천향산업의학 Vol.4 No.1
In order to find out the situation of industrial accidents in area of Choongnam northwest and to obtain the basic materials for prevention of industrial accidents, 647 patient who had industrial accident were selected from five general hospital in Chunan Choognam. All industrial accident cases were analysed to draw characteristic patterns in relation to industrial type, time of industrial accident, age, work duration, site of accidents, degree of accidents. The period of this study was from June 1, 1996 to May 31, 1998. The results of the study were as follows. 1. Frequency rates of accident was 42.0% in manufacturing industries, the highest among industries and followed by 21.5% in construction industries, 14.5% in transport, storage & communications industries, 11.1% in other industries, 10.8% in electricity, gas & water supply industries. 3. while the highest frequency rate of accident by month was 24.4% in March and April, the lowest was 9,1% in November and December. 4. Frequency rate of accident by time was 22.7% in 10:00-11:00. the highest among time and followed by 10.7% in 14:00-15:00. 5. The highest frequency rate of accident by age group was 42.7% in older age group(above 40 years old). 6. While the highest frequency rate of accident by site was 30.9% in hands and feet, the lowest was 9.7% in upper limbs. 7. While the highest frequency rate of accident by duration of treatment was 73.49% in below 1 month, the lowest was 0.9% in above 6 months. 8. While the highest frequency rate of accident by duration of work was 59.4% in below 1 year, the lowest was 2.6% in above 10 years.
Experimental Study on the Operation of a Keyhole-Shaped Lens in a Microcolumn
오태식,Sang Won Jin,Sang Kuk Choi,김영철,김대욱,김호섭,안승준,Young Bok Lee 한국광학회 2011 Current Optics and Photonics Vol.15 No.4
An advanced microcolumn is proposed which adopts a modified einzel lens structure. The newly designed einzel lens is composed of four electrodes. The two center electrodes are specially designed electrostatic quadrupole (EQ) einzel lenses having keyhole instead of circular apertures. We constructed the advanced microcolumn with the EQ-einzel lenses, and operated the newly designed microcolumn in single lens mode and double-lens mode. The preliminary results show that the EQ-einzel lens can improve the performance of the micro-column for large sample applications.
오태식,김대욱,안승준,김호섭,장원권 한국물리학회 2013 THE JOURNAL OF THE KOREAN PHYSICAL SOCIETY Vol.63 No.6
An improved source lens structure for a microcolumn including a subsidiary control electrode isdesigned, and its current characteristics are analyzed. The effect of the control electrode, whichwas inserted between the extractor and the anode, shows improved characteristics, such as a higherprobe beam current, compared to a microcolumn with a conventional source lens structures. Thefield enhancement factor extracted through current measurement and simulation was 3.95, and thisvalue was applied to all column structures investigated in this work. The column with the newlydesignedsource lens structure showed a drastic increase in the probe beam current according tothe driving voltage applied to the control electrode. The design parameters of the newly-developedsource lens structure are provided with a simulation analysis.
Study on the recognition of the marks for low-energy microcolumn lithography
오태식,Ho Seob Kim,김호섭,박철근,안승준 한양대학교 세라믹연구소 2009 Journal of Ceramic Processing Research Vol.10 No.1
Electron beam lithography has been paid great attention as a future lithography technology for the patterning of extremely fine structures. Generally e-beam lithography means high-energy e-beam lithography where the kinetic energies of electrons are rather high(10-100 keV). Although high-energy e-beam technology is mature and being used in the semiconductor industry, low-energy microcolumn lithography(LEML) has many great advantages as a next-generation technology, which explains the active research on the subject these days. In this study, we developed a new method to recognize the registration marks in LEML. With this novel method, there is no need to supply a bias to the mark electrodes, which remarkably simplifies the fabrication process of IC devices.