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Glass Ionomer시멘트에 의한 상아질구조변화에 관한 주사전자현미경적 연구
박성규,우이형,최대균,최부병,박남수,Park, S.K.,Woo, Y.H.,Choi, D.K.,Choi, B.B.,Park, N.S. 대한치과보철학회 1987 대한치과보철학회지 Vol.25 No.1
This study was designed to investigate the pulpal effects of the glass ionomer cement. (Lining cement, G-C Co. Japan) For this purpose, 10 cats were selected, and Class V cavities were prepared on canines of the cats. One experimental group was filled with glass ionomer cement and the other group was filled with zinc phosphate cement . (G-C Co, Japan) The animals of the experimental and control group were sacrificed at 1,2,3,4,6, weeks after the experiment. For comparison of reparative dentin formation pattern in direction of the pulpal and fractured lateral surface, each of them was observed with scanning electron microscope. The findings led to the following conclusions; 1. Reparative dentin of the glass ionomer cement and zinc phosphate cement filling groups were formed on the internal surface of dentin as the shape of hemispherical and spherical with a rough surface. 2. Some of reparative dentin of the glass ionomer cement filling group was started to form at 1 week after experiment, and at 6 weeks after experiment, it had been increased gradually in number and size. 3. Reparative dentin of zinc phosphate cement filling group was formed vigorously, however, gradually was decreased in number and size, and disappeared at 6 weeks after experiment. 4. During the formation of reparative dentin, peritubular dentins were indistinguishable. 5. The diameter of dentinal tubules of reparative dentin has been decreased, during the reparative dentin formed, and it became very irregularly at 6 weeks after experiment.
박성규(S.-K. park),이종철(Jong-chul Lee),김윤제(Youn J.Kim) 대한기계학회 2003 대한기계학회 춘추학술대회 Vol.2003 No.11
In this paper we have studied the characteristics of temperature fields in a Molded Case Circuit Breaker (MCCB). A switch and a trip device are arranged in narrow space of the MCCB. Thus, thermal factors have been risen to important problem. The temperature rise means an energy loss and it becomes the reason of fatal fault in devices. Also, the temperature on the connection and the contact parts is rehulated up to 115℃ and 105℃, respectively. Therefore, a study for preventing the temperature rise should be investigated. A numerical analysis method that has confidence might be preceded for this purpose. In order to verify the confidence of temperature field analysis, the results of the numerial analysis are compared with those of experimental one for the same model. Comparison results show qualitatively good agreement within± 5% errors.