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- 저자 : Wei-Che Chuang (검색결과 4 건)
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Wei-Tsung Chuang,Rong-Hao Guo,Che-Min Chou,Chun-Chieh Wang,Ming-Jay Deng,Jhih-Min Lin,Chun-Yu Chen,Yao-Chang Lee 한국고분자학회 2021 한국고분자학회 학술대회 연구논문 초록집 Vol.46 No.2
To meet future demands for cutting-edge wearable electronics, flexible supercapacitors must possess many features, such as eco-friendly processing, aesthetic appeal and no health hazards, in addition to have lightweight, robust and excellent cycling stability. We proposed a biomimetic and scalable method to fabricate an all-solid-state flexible supercapacitor (assFSC) using bioinspired clay/polymer nanocomposites as electrode materials and a gel electrolyte. Experimental results from X-ray techniques (tomography, scattering and diffraction) showed that the electrode’s structure features a 3D ant-nest-like framework composed of 2D nacre-like clay nanosheets, i.e. hierarchical layers-within-networks structure. Accordingly, the structural electrodes exhibit high tensile strength of 62 MPa, Young’s modulus of 4.4 GPa, and torsional strength of 165 MPa. Under a large operating potential of 4.0 V, the assFSC exhibited ultrahigh energy density (233.3 W h kg<SUP>-1</SUP> at 2 kW kg<SUP>-1</SUP>), ultrahigh power density (125 kW kg<SUP>-1</SUP> at 55.5 W h kg<SUP>-1</SUP>), and outstanding static cyclability (less than 10% loss after 5,000 cycles). We also performed a cycle-life test under dynamic deformation and demonstrated that the assFSC had charging and discharging abilities during motion, according to particle applications of wearable electronics. Thus stable and superior electrochemical performance can be attributed to the biomimetic layers-within-networks structure, which not only provided robust framework but also induced 3D conducting networks with increasing ion channels and shortening charge transports. The shapeable electrodes made by a molding process could, therefore, be used to meet the demands for fashionable, wearable electronics.
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Jason J. Yao,Keh-Jeng Chang,Wei-Che Chuang,Jimmy S. Wang 대한전자공학회 2005 Journal of semiconductor technology and science Vol.5 No.4
With the advent of sub-90㎚ technologies, the system-on-chip (SoC) and system-in-package (SiP) are becoming the trend in delivering low-cost, lowpower, and small-form-factor consumer electronic systems running at multiple ㎓. The shortened transistor channel length reduces the transistor switching cycles to the range of several picoseconds, yet the time-of-flights of the critical on-chip and off-chip interconnects are in the range of 10 picoseconds for 1.5㎜-long wires and 100 picoseconds for 15㎜-long wires. Designers realize the bottleneck today often lies at chip-to-chip interconnects and the industry needs a good model to compute the inductance in these parts of circuits. In this paper we propose a new method for extracting accurate equivalent inductance circuit models for SPICE-level circuit simulations of systemon- chip (SoC) and system-in-package (SiP) designs. In our method, geometrical meshes are created and numerical methods are used to find the solutions for the electromagnetic fields over the fine meshes. In this way, multiple-㎓ SoC and SiP designers can use accurate inductance modeling and interconnect optimization to achieve high yields.
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Yao Jason J.,Chang Keh-Jeng,Chuang Wei-Che,Wang, Jimmy S. The Institute of Electronics and Information Engin 2005 Journal of semiconductor technology and science Vol.5 No.4
With the advent of sub-90nm technologies, the system-on-chip (SoC) and system-in-package (SiP) are becoming the trend in delivering low-cost, low-power, and small-form-factor consumer electronic systems running at multiple GHz. The shortened transistor channel length reduces the transistor switching cycles to the range of several picoseconds, yet the time-of-flights of the critical on-chip and off-chip interconnects are in the range of 10 picoseconds for 1.5mm-long wires and 100 picoseconds for 15mm-long wires. Designers realize the bottleneck today often lies at chip-to-chip interconnects and the industry needs a good model to compute the inductance in these parts of circuits. In this paper we propose a new method for extracting accurate equivalent inductance circuit models for SPICE-level circuit simulations of system-on-chip (SoC) and system-in-package (SiP) designs. In our method, geometrical meshes are created and numerical methods are used to find the solutions for the electromagnetic fields over the fine meshes. In this way, multiple-GHz SoC and SiP designers can use accurate inductance modeling and interconnect optimization to achieve high yields.
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Jyh-Ferng Yang,Cheng-Hong Yang,Hsueh-Wei Chang,Cheng-San Yang,Shao-Ming Wang,Ming-Che Hsieh,Li-Yeh Chuang 한국식품영양과학회 2010 Journal of medicinal food Vol.13 No.5
In recent years, human pathogenic microorganisms have developed multiple drug resistance and caused serious nosocomial infections. In this study, we identified four new antimicrobial compounds from the Chinese herbal medicine Illicium verum and assessed their antibacterial efficacies. The supercritical CO2 and ethanol extracts of Illicium verum showed substantial antibacterial activity against 67 clinical drug-resistant isolates, including 27 Acinetobacter baumannii, 20 Pseudomonas aeruginosa, and 20 methicillin-resistant Staphylococcus aureus. The diethyl ether (EE) fraction obtained from partition extraction and supercritical CO2 extracts revealed an antibacterial activity with a minimum inhibitory concentration value of 0.15–0.70mg/mL and 0.11mg/mL, respectively. The EE fraction of I. verum showed synergetic effects with some commercial antibiotics. The antimicrobial mechanism was investigated with killing curves and scanning electron microscopy observation. The chemical components of the extracts were analyzed by spectrophotometry; (E)-anethole, anisyl acetone, anisyl alcohol, and anisyl aldehyde exhibited antibacterial activity against different clinical isolates. These extracts from I. verum can be further developed into antibiotic medicines due to their proven antibacterial activity.
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