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광 스캐닝 홀로그래피에서 복소 홀로그램의 실시간 복원 알고리즘
이문섭(Munseob Lee),이병탁(Byung Tak Lee),민기현(Gihyeon Min),김낙우(Nacwoo Kim),송제호(Je-Ho Song) 한국산학기술학회 2014 한국산학기술학회 학술대회 Vol.- No.-
본 논문에서는 광 스캐닝 홀로그래피에서 초점영역에서의 이미지의 실시간 복원을 위해서 위상천이 측정방법 (Phase Shift Continuous Wave)을 이용한 알고리즘을 제안하고 실험적으로 보였다. 임의의 거리에 떨어진 복소 홀로그램에 제안된 알고리즘을 적용함으로써 거리정보 42.6cm를 구하고, 이를 적용함으로써 10.5x10.5mm의 복소 홀로그램을 복원하였다.
광스캐닝 홀로그래피에서 푸리에방법을 통한 홀로그램 취득 및 특성 비교
이문섭(Munseob Lee),이병탁(Byung Tak Lee),민기현(Gihyeon Min),김낙우(Nacwoo Kim),송제호(Je-Ho Song) 한국산학기술학회 2015 한국산학기술학회 학술대회 Vol.2015 No.1
In this paper, propose the new hologram acquisition method based on the time resolved analysis in optical scanning holography. By applying the Fourier transform algorithm, we can obtain complex hologram without reference clocking. And, we compare this algorithm with conventional method.
A Single-Chip 2.5-Gb/s Burst-Mode Optical Receiver With Wide Dynamic Range
Sang-Heung Lee,Jongdeog Kim,Quan Le,Munseob Lee,Haecheon Kim,Chang-Su Park IEEE 2011 IEEE photonics technology letters Vol.23 No.2
<P>In this letter, a new burst-mode optical receiver with burst detection function is proposed and a single-chip 2.5-Gb/s burst-mode optical receiver has been fabricated using 0.25-μm SiGe bipolar complementary metal-oxide-semiconductor (BiCMOS) technology. The single-chip optical receiver has high sensitivity and wide dynamic range for various classes of power budges required in 10-Gigabit-capable passive optical network (XG-PON1) (2.5-Gb/s upstream and 10-Gb/s downstream data rates). For the 2.5-Gb/s burst-mode data streams, sensitivity and overload were -32 and -4 dBm at a bit-error rate of 10<SUP>-10</SUP> , respectively, resulting in a dynamic range of 28 dB.</P>
Pattern-projected schlieren imaging method using a diffractive optics element
Min, Gihyeon,Lee, Byung-Tak,Kim, Nac Woo,Lee, Munseob IOP Pub 2018 Measurement science & technology Vol.29 No.4
<P>We propose a novel schlieren imaging method by projecting a random dot pattern, which is generated in a light source module that includes a diffractive optical element. All apparatuses are located in the source side, which leads to one-body sensor applications. This pattern is distorted by the deflections of schlieren objects such that the displacement vectors of random dots in the pixels can be obtained using the particle image velocity algorithm. The air turbulences induced by a burning candle, boiling pot, heater, and gas torch were successfully imaged, and it was shown that imaging up to a size of 0.7 m × 0.57 m is possible. An algorithm to correct the non-uniform sensitivity according to the position of a schlieren object was analytically derived. This algorithm was applied to schlieren images of lenses. Comparing the corrected versions to the original schlieren images, we showed a corrected uniform sensitivity of 14.15 times on average.</P>
Compact 2.5 Gb/s Burst-Mode Receiver with Optimum APD Gain for XG-PON1 and GPON Applications
Jongdeog Kim,Quan Le,Munseob Lee,Hark Yoo,Dong-Soo Lee,박창수 한국전자통신연구원 2009 ETRI Journal Vol.31 No.5
This letter presents a compact 2.5 Gb/s burst-mode receiver using the first reported monolithic amplifier IC developed with 0.25 μm SiGe BiCMOS technology. With optimum avalanche photodiode gain, the receiver module can obtain a fast response, high sensitivity and wide dynamic range, satisfying the overhead timing and various power specifications for a 2.5 Gb/s next-generation passive optical network (PON), as well as a legacy 1.25 Gb/s PON in the upstream.
Light field microscope target with low power, low pressure reactive ion etching process
Kim Chihoon,Kim Sang Yun,Lee Munseob 한국물리학회 2023 Current Applied Physics Vol.50 No.-
This study relates to the manufacturing process of 3-dimensional resolution target for light field microscope that can obtain 3-dimensional image information. Based on the optical specifications of the micro-lens array, 3- dimensional resolution target was designed to simultaneously measure resolution of lateral, axial and field of view. The width of each block gradually decreases from 24 μm, and 5 μm is the minimum width. These blocks are arranged in a square shape of 0.46 × 0.46 mm2. We also fabricated 3-dimensional resolution target based on reactive ion etching process with photolithography to produce silicon microstructure. To remove the recessed shape of the silicon etched corners and stepping of the sidewalls, we combined CF4 (66%), SF6 (16%) and O2 (16%) gases while maintaining low power (30 Watt) and pressure (15 mTorr) to obtain a smooth surface and distinct anisotropic etch characteristics. The fabricated samples showed uniform surface and height characteristics. Based on manufactured 3-dimensional target, a 3-dimensional perspective view image was shown using a light field microscope.