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조현민(Hyunmin Cho),권진형(Jinhyeong Kwon),정진욱(Jinwook Jung),김현석(Hyeonseok Kim),김동관(Dongkwan Kim),정성민(Seongmin Jeong),홍석준(Sukjoon Hong),여준엽(Junyob Yeo),고승환(Seung Hwan Ko) 대한기계학회 2015 대한기계학회 춘추학술대회 Vol.2015 No.11
ZnO/Ag hierarchical nanostructure is fabricated by solution-based photoreduction process to demonstrate a photoelectrochimical (PEC) cell charging supercapacitor. The photoreduction process ensures rapid and simple route for employing of Ag nanoparticles onto the surface of ZnO nanorod with well-dispersed and clear crystallization structure. The fabricated ZnO/Ag hierarchical nanostructure showed improved optical and photoelectrochemical properties. Subsequently, the ZnO/Ag hierarchical nanostructure is used as photoanode for PEC cell with enhanced output photocurrent and stability. Furthermore, the PEC cell was connected to lab-made supercapacitors to turn on a light emitting diode. The photoreduction-processed ZnO/Ag hierarchical nanostructures provide a promising and simple production method for energy source in water splitting applications.
Kyun Kyu Kim(김권규),Jinhyeong Kwon(권진형),Hyun Min Cho(조현민),Seung Hwan Ko(고승환) 대한기계학회 2016 대한기계학회 춘추학술대회 Vol.2016 No.12
Copper nanomaterials suffer from severe oxidation problem despite the huge cost effectiveness. The effect of two different processes for conventional tube furnace heating and selective laser sintering on copper nanoparticle paste is compared in the aspects of chemical, electrical and surface morphology. The thermal behavior of the copper thin films by furnace and laser is compared by SEM, XRD, FT-IR and XPS analysis. The selective laser sintering process ensures low annealing temperature, fast processing speed with remarkable oxidation suppression even in air environment while conventional tube furnace heating experiences moderate oxidation even in Ar environment. Moreover, the laser-sintered copper nanoparticle thin film shows good electrical property and reduced oxidation than conventional thermal heating process. Consequently, the proposed selective laser sintering process can be compatible with plastic substrate for copper based flexible electronics applications.