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RISS 인기검색어
- 검색키워드
- 저자 : Helen Siu (검색결과 5 건)
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History in China's Urban Post-Modern
Helen F. Siu 고려대학교 민족문화연구원 2011 Cross-Currents Vol.- No.1
Building upon decades of global market flows, population migrations, digital technology, and accelerated inter-connectedness, the twenty-first century is facing remarkable urban transformations (Harvey 1990, 2005; Sassen 2001; Holston 1999; Brenner 2004). In 1800, 3 percent of the world’s population lived in cities. In 2008, that figure reached over 50 percent (PRB 2011). Such processes are most evident in the emerging nodes of an inter-referencing urban Asian renaissance (Roy and Ong 2011). Eight of the world’s ten megacities (those with populations over ten million) are in Asia. In postreform China, which is conscious of its rising power and eager to catch up with worldly pursuits, city building has reached the scale, intensity, and audacity of a revolution (Campanella 2008; Ren 2011). What characterizes this dramatic urban transformation in China? Who are its major players and winners, and who is marginalized or excluded? What cultural meanings and lifestyles are visibly forged? How are these processes intertwined with nationalistic aspirations, social divisions, and political contestations? What analytical insights and theoretical reflections can we gain at this historical juncture from an urban postmodern linking China, Asia, and the rest of the globe? These are some of the issues in the minds of Asian scholars across the disciplines. I hope this review will provide an opening for us to engage in multiple conversations, hence my citing the works of many colleagues.
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Or, Siu Wing,Chan, Helen Lai Wa,Liu, Peter Chou Kee Techno-Press 2005 Smart Structures and Systems, An International Jou Vol.1 No.1
A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.
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Design optimization of vibration isolation system through minimization of vibration power flow
Shilin Xie,Siu Wing Or,Helen Lai Wa Chan,Ping Kong Choy,Peter Chou Kee Liu 국제구조공학회 2008 Structural Engineering and Mechanics, An Int'l Jou Vol.28 No.6
A vibration power minimization model is developed, based on the mobility matrix method, for a vibration isolation system consisting of a vibrating source placed on an elastic support structure through multiple resilient mounts. This model is applied to investigate the design optimization of an X-Y motion stage-based vibration isolation system used in semiconductor wire-bonding equipment. By varying the stiffness coefficients of the resilient mounts while constraining the dynamic displacement amplitudes of the X-Y motion stage, the total power flow from the X-Y motion stage (the vibrating source) to the equipment table (the elastic support structure) is minimized at each frequency interval in the concerned frequency range for different stiffnesses of the equipment table. The results show that when the equipment table is relatively flexible, the optimal design based on the proposed vibration power inimization model gives significantly little power flow than that obtained using a conventional vibration force minimization model at some critical frequencies. When the equipment table is rigid enough, both models provide almost the same predictions on the total power flow.
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Design optimization of vibration isolation system through minimization of vibration power flow
Xie, Shilin,Or, Siu Wing,Chan, Helen Lai Wa,Choy, Ping Kong,Liu, Peter Chou Kee Techno-Press 2008 Structural Engineering and Mechanics, An Int'l Jou Vol.28 No.6
A vibration power minimization model is developed, based on the mobility matrix method, for a vibration isolation system consisting of a vibrating source placed on an elastic support structure through multiple resilient mounts. This model is applied to investigate the design optimization of an X-Y motion stage-based vibration isolation system used in semiconductor wire-bonding equipment. By varying the stiffness coefficients of the resilient mounts while constraining the dynamic displacement amplitudes of the X-Y motion stage, the total power flow from the X-Y motion stage (the vibrating source) to the equipment table (the elastic support structure) is minimized at each frequency interval in the concerned frequency range for different stiffnesses of the equipment table. The results show that when the equipment table is relatively flexible, the optimal design based on the proposed vibration power inimization model gives significantly little power flow than that obtained using a conventional vibration force minimization model at some critical frequencies. When the equipment table is rigid enough, both models provide almost the same predictions on the total power flow.
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