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Coexistence in Europe: Lessons for East Asia?
( Ken Booth ) 한국국방연구원 1989 The Korean Journal of Defense Analysis Vol.1 No.2
The East-West cold war is now irrational. It is out of touch with a world of complex interdependence. Nevertheless, cold war attitudes are sustained by regressive mindsets and the centrality given to nuclear deterrence. In place of the static thinking that has characterized the past this article offers a forward looking theory and practice of coexistence. This approach involves defining a long-term goal and establishing appropriate intermediate steps toward its achievement. The intermediate steps identified are “constructive engagement’’ (10-15 years) and “a legitimate international order” (15-30 years). The final goal is “stable peace,” a condition in which war is unlikely not because of a balance of nuclear terror but because of mutual satisfaction with the prevailing political situation. Progress towards the goals indicated requires a “process utopian” approach. The latter is pragmatic yet reformist. It seeks to identify and pursue benign courses while leaving the end-point uncertain. What exactly the structure of European security will look like must be settled by future generations; in the meantime it is necessary to concentrate on benevolent processes such as nonprovocative defense, common security, denuclearization, and arms restraint. The prospects are mixed, but the trends have never been more favorable. Stable coexistence in Europe is not a real possibility. The article concludes by offering a series of ideas about the future of East Asian security based on the previous discussion of the European situation. Emphasis is given to the importance of taking a long-term perspective, diplomatic patience and persistence, movement to non-provocative tactics, sensitivity to the dynamics of the “security dilemma” in military planning and arms control policy, denuclearization, confidence-building measures, and the consideration of an East Asian “Helsinki.” The prospects for progress in East Asia are not presently as bright as in Europe, but change, when it comes, can be rapid.
Label-Free, Electrochemical Quantitation of Potassium Ions from Femtomolar Levels.
Zhu, Bicheng,Booth, Marsilea A,Woo, Han Young,Hodgkiss, Justin M,Travas-Sejdic, Jadranka Wiley-VCH 2015 Chemistry - An Asian Journal Vol.10 No.10
<P>In this communication, a label-free and sensitive electrochemical method to detect potassium ions is proposed. The conducting polymer polypyrrole was used as both an anchor for the probe and a transducer of the detection event. A K(+) -specific G-rich aptamer was applied as a recognition element, which folded into the G-quadruplex structure in the presence of K(+) , and this resulted in an increase in the electrode impedance. The combination of the K(+) -selective aptamer and the porous conducting polymer as a signal transducer afforded a successful sensor platform. The sensor responded approximately logarithmically over a wide dynamic range of K(+) concentrations from 20?fm to 1?mm, with a very low detection limit of 14.7?fm and excellent discrimination against other ions. Additionally, electrochemical impedance spectroscopy was used to study the kinetics of K(+) binding at the conducting polymer-immobilized aptamer surface, which indicated strong binding between the two. This work demonstrates a powerful approach for the sensitive, selective, and direct electrochemical detection of metal ions based on the switching conformation of G-rich aptamers attached to a porous conducting polymer surface. This assay scheme can be expanded to the detection of a wide range of targets by modifying the aptamer structure as a recognizing moiety.</P>
CO-FIRED MULTILAYER TAPE INTERCONNECT PACKAGING SYSTEM UTILIZING COPPER AND GOLD CONDUCTORS
Hu, Yung Haw,Booth, Charles L.,Snyder, Larry E. 대한전자공학회 1989 ICVC : International Conference on VLSI and CAD Vol.1 No.1
A cofired multilayer packaging system has been developed utilizing copper conductors. The multilayer interconnect is assembled from low fire tape having a dielectric constant of 7.9 and a coefficient of thermal expansion of 7.9 ppm/℃ or a tape with a dielectric constant of S and a thermal expansion of 4.5 ppm/℃. Fired layer thickness can vary between 3.5 to 4 mils. Material and processing are closely controlled to insure exceptional dimensional reproducibility. The functional surface of the package can have copper metallurgy for optimum conductivity and solderability with specially formulated thick film gold compositions strategically positioned for die and wire bonding and gold-tin sealing, if required. Data describing electrical and thermal performance will be presented. Microwave characteristics will be compared to conventional materials.