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W-Cu 의 액상소결시 코발트 첨가에 의한 치밀화 촉진
주승기,이석운,인태형 대한금속재료학회(대한금속학회) 1993 대한금속·재료학회지 Vol.31 No.10
In order to obtain uniformly distributed tungsten-copper powder, the submicron tungsten powder was coated with copper by a newly developed process : fluidized bed reduction. Tungsten powder was initially coated with copper dichlorides and then reduced in fluidized beds by hydrogen gas flow. By the same method, cobalt was added to this binary alloy for the purpose of altering the chemical relations between tungsten and copper. In case of 75W-25Cu, full densification could not be attained even after the prolonged sintering of 4 hours at 1200 C because of a large wetting angle of copper on tungsten. The addition of cobalt of 0.5 weight percent, however, considerably enhanced the densification of 75W-24. 5Cu-0.5Co and high density above 95% was attainable within ramping-up to 1200℃. The enhancement of sintering by cobalt addition was revealed to result from the decrease of the wetting angle of liquid copper, which was due to the formation of an intermetallic compound between tungsten and cobalt dissolved in liquid copper.
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주승기,박영신 대한금속재료학회(대한금속학회) 2000 대한금속·재료학회지 Vol.38 No.3
All-solid-state rechargeable thin film batteries were fabricated with the cell structure of Li/Lipon/LiMn₂O₄ by using of sequential thin film deposition techniques. Planar type multi-microbatteries were realized by connecting eight cells in parallel and in series via planar metalization. In the parallel connected thin film batteries, the discharge capacity was increased linearly depending on the number of unit cell. From the investigation of discharge current density effects on discharge curves of thin film batteries connected in parallel, the rate capability was greatly improved due to the increase of lithium intercalations kinetics for charge transfer. In the serially-connected thin film batteries, the output voltage as high as approximately 32 V was obtained by the serial connection of eight unit cells.
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