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장동영(Dong-Young Jang),반창우(Chang-Woo Ban),임영환(Young-Hwan Lim),홍석기(Suk-Ki Hong) 대한기계학회 2009 大韓機械學會論文集A Vol.33 No.9
In this paper, bonded wafer analysis system is proposed using laser beam transmission; while the transmission model is derived by simulation. Since the failure of bonded wafer stems in void existence, transmittance deviations caused by the thickness of the void are analyzed and variations of the intensity through the void or defect easily have been recognized then the testing power has been increased. In addition, large screen display on laser study has been done which resulted in acquiring a feasible technique for analysis of the whole bonding surface. In this regard, three approaches are demonstrated in which Halogen lamp, IR lamp and laser have been tested and subsequently by results comparison the optimized technique using laser has been derived.
반창우(Chang-Woo Ban),장동영(Dong-Young Jang) 한국생산제조학회 2012 한국생산제조학회지 Vol.21 No.3
Recently RFID(Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve productivity and reliability. This study is performed on FMEA, reliability at development level and analysis failure mode through environment and mechanical test. Robust design is applied to search the optimized condition of factor and RFID tag packaging should be satisfied with high MTTF.
김동환(Dong Hwan Kim),김영대(Young Dae Kim),박만진(Man Jin Park),장동영(Dong Young Chang) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
The electric part of thermal SEM consisting of high voltage generation, lens control, and image processing are considered to achieve high performance. By using a DSP(Digital Signal Processor), the system is efficiently operated. Noise issues degrading the system performance are investigated, and the corresponding solutions are addressed. Several Filter designs and safety circuits are included, resulting in highly enhanced image resolution.
기밀성 분석을 통한 RFID 태그 패키지 에폭시 몰딩 연구
반창우(Chang-Woo Ban),홍석기(Seok-Kee Hong),장동영(Dong-Young Jang) 한국생산제조학회 2012 한국생산제조학회지 Vol.21 No.2
Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.
장훈근(Hun-Keun Chang),김일해(Il Hae Kim),장동영(Dong Young Jang) 한국생산제조학회 2007 한국생산제조학회지 Vol.16 No.6
To improve productivity of a metal cutting process, it is required to monitor machining stability in real time. Since cutting environment is harsh against sensing conditions due to vibration, chip, and cutting fluid, etc., it is necessary to develop a robust and reliable sensing system for the practical application. In this work, a chatter monitoring system was developed and its effectiveness was proved. Spindle displacement caused by cutting was selected as a main monitoring parameter. A cylindrical capacitive displacement sensor was adopted. Chatter frequencies were identified through modal analysis. To quantify chatter vibrations, chatter correlation coefficient was introduced. The identification of the monitoring system showed a good agreement with the result of experiment.
장훈근(Hun-Keun Chang),김일해(Il Hae Kim),장동영(Dong Young Jang) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
To improve productivity of a metal cutting process, it is required to monitor machining stability in real time. Since cutting environment is harsh against sensing conditions due to vibration, chip, and cutting fluid, etc., it is necessary to develop a robust and reliable sensing system for the practical application. In this work, a chatter monitoring system was developed and its effectiveness was proved. Spindle displacement caused by cutting was selected as a main monitoring parameter. A cylindrical capacitive displacement sensor was adopted. Chatter frequencies were identified through modal analysis. To quantify chatter vibrations, chatter correlation coefficient was introduced. The identification of the monitoring system showed a good agreement with the result of experiment.
양시은(Si-Eun Yang),반창우(Chang-Woo Ban),장동영(Dong-Young Jang),홍석기(Seok-kee Hong) 한국생산제조학회 2010 한국공작기계학회 추계학술대회논문집 Vol.2010 No.-
In this paper, the hermetic packaging which has a huge share in packaging process cost has been defined by confidentiality, and the confidentiality of sealing using epoxy has been compared. The reliability depending on the humidity of electronic component has been stipulated as the confidentiality of the package, and the sealing process has been analyzed by the leak rate absorbed from the outside of the electronic component. The leak sensitivity of epoxy sealing measurement method using humidity sensor is proposed, by which it is possible to analyze the leak rate of the product in the development stage. In addition the decision on epoxy sealing packaging method is became possible.
반창우,홍석기,장동영 한국공작기계학회 2008 한국공작기계학회 추계학술대회논문집 Vol.2008 No.-
반도체, LCD, 휴대폰과 같이 제품 원가에 비해 고부가가치 제품 산업들은 급속한 발전과 새로운 서비스 요구로 인해 제품의 생산에 있어서 제조 스피드가 관건이다. 본 연구에서는 복잡하고 다양한 반도체 프로세스 중에서 Track - Aligner - Oxide Etcher - Asher - Sputter - Microscope 프로세스의 모델링을 통하여 평균 생산 시간과 처리량을 측정하여 처리량을 극대화 할 수 있는 생산 시간의 최적화에 대해 고찰하였다.