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Cu<SUB>47.5</SUB>Zr<SUB>47.5</SUB>Al₅ 벌크 비정질 합금의 고온 변형 및 성형 특성
이수은(S. E. Lee),이광석(K. S. Lee),전현준(H. J. Jun),장영원(Y. W. Chang) 한국소성가공학회 2010 한국소성가공학회 학술대회 논문집 Vol.2010 No.10
Plastic deformation of a CU47.5Zr47.5Al? ternary bulk metallic glass in the supercooled liquid region was investigated. The appropriate working temperature-strain rate combination for optimum solid-to-solid forming was deduced to be between (710 K, 3×10?⁴ s?¹) and (735 K, 3×10?² s?¹) by constructing a processing map superimposed with the time-temperature transformation curve indicating crystallization. Furthermore, the actual formability around this processing window was not only confirmed by overlapping the laboratory-scale extrusion deformability but also estimated by applying finite element analysis.
롤 본딩법으로 제조한 Al-Cu 하이브리드 판재의 압하율이 기계적 물성에 미치는 영향
이수은(S.E. Lee),이광석(K.S. Lee),김정수(J.S. Kim),성효경(H.K. Sung),이성학(S.H. Lee),장영원(Y.W. Chang),김민중(M.J. Kim),배동현(D.H. Bae),권용남(Y.N. Kwon) 한국소성가공학회 2012 한국소성가공학회 학술대회 논문집 Vol.2012 No.10
We present here the influence of reduction ratio during roll bonding on the microstructural evolution, mechanical properties and room-temperature formability of Al-Cu 2-ply clad metal. The effect of reduction ratio upon the evolution of interface microstructure is first analyzed by means of scanning electron microscope (SEM) and transmission electron microscope (TEM) attached with energy dispersive spectroscopy (EDS). Taking the difference of microstructure upon reduction ratio into account, mechanical properties of this composite were evaluated by uniaxial tensile and peel tests. Formability was also verified by applying Erichsen tests.
Al/Mg 이종금속 판재의 계면 연계 물성에 미치는 열처리 영향
이수은(S.E. Lee),이광석(K.S. Lee),김민중(M.J. Kim),권용남(Y.N. Kwon) 한국소성가공학회 2013 한국소성가공학회 학술대회 논문집 Vol.2013 No.10
We present here the influence of annealing treatment after roll bonding on the interface-correlated microstructural evolution and mechanical properties of an All050/ AZ31B clad plate. Interface microstructure was first analyzed by means of scanning electron microscope (SEM) attached with energy dispersive spectroscopy (EDS). Taking the difference of interface microstructure into account, mechanical properties of this composite were evaluated by uniaxial tensile and peel tests. Improvement of bonding strength between All050 and AZ31 seemed to be strongly related to the metallurgical bonding by diffusive intermetallic compound layer with the thickness around 1μm.
이광석(K.S. Lee),이수은(S.E. Lee),조유미(Y.M. Jo),권용남(Y.N. Kwon) 한국소성가공학회 2013 한국소성가공학회 학술대회 논문집 Vol.2013 No.5
The aim of this study is to elucidate the effect of reduction ratio during roll bonding on the microstructural evolution, mechanical properties and room-temperature formability of Al-Cu 2-ply clad metal. It was clearly confirmed that the bonding strength, elongation and tensile strength for Al-Cu 2-ply sheets were reduced by decreasing the reduction ratio during roll bonding process, which is directly correlated with the microstructural evolution at the interface. Moreover, the higher reduction ratio during the roll bonding, the more room temperature formability can be achieved for Al-Cu 2-ply sheet by applying three-point bending tests.
STS-Al-Mg 3-ply 이종금속소재 계면 미세 조직 및 변형 특성에 미치는 열처리의 영향
이광석(K.S. Lee),조유미(Y.M. Jo),윤동현(D.H. Yoon),이수은(S.E. Lee),허진희(J.H. Heo),강남현(N.H. Kang),권용남(Y.N. Kwon),이영선(Y.S. Lee) 한국소성가공학회 2012 한국소성가공학회 학술대회 논문집 Vol.2012 No.10
We present here an exploration of the relationship among post-roll bonding process variables, interfacial and overall mechanical properties of a 3-ply STS-Al-Mg laminated composite. The effect of post-annealing conditions upon the evolution of interface microstructure is first analyzed by means of optical microscope (OM), scanning electron microscope (SEM), transmission electron microscope (TEM) attached with energy dispersive spectroscopy (EDS). Taking the composition and thickness of each intermetallic compound layer into account, results devoted to the interfacial microstructure and overall mechanical properties are also given. Local mechanical properties for the generated diffusion layers were first determined by nanoindentation tests. The mechanism of improvement of interfacial bonding is then verified by means of uniaxial tensile and bending tests. Finally the competitions between two contradictory effects, viz., interface strengthening by the generation of IMCs and the corresponding loose of overall ductility due to the embrittlement, is discussed.
임동건(D. G. Lim),이수은(S. E. Lee),김홍우(H. W. Kim),이준신(J. Yi) 한국태양에너지학회 1998 한국태양에너지학회 학술대회논문집 Vol.- No.-
ITO 박막은 가시광 영역에 대해 광투과도가 크고, 전도도가 우수하기 때문에 태양전지 투명전도막이나 LCD, 투명열선, 센서등의 많은 분야에서 응용되고 있다. 본 논문은 다결정 규소 태양전지 투명전도막 응용을 위하여 ITO 박막을 조사하였다. ITO 박막은 RF magnetron sputtering 법으로 유리기판에 증착하였다. 높은 광투과율과 낮은 비저항을 얻기 위해 기판온도, 가스압력, 증착시간, 열처리온도 등의 다양한 증착조건을 조사하였다. 본 논문은 우수한 전기전도도와 투과도를 얻기위해서는 500℃의 기판온도와 산소분위기에서의 200℃ 열처리 공정을 권장한다. XRD 분석으로부터 ITO 박막은 (222) 방향이 우세하게 나타났다. 기판온도를 RT에서 500℃까지 증가함에 따라 (222) 방향의 peak도 증가였으며, 500℃에서는 가장 크게 나타났다. 본 논문은 최적의 조건에서 1.04×10-⁴Ω-㎝의 비저항과 가시광 영역에서 300㎚ 두께로 81.2%의 투과도를 가진 ITO 박막을 얻었다. Tin doped indium oxide(ITO) films are highly conductive and transparent in the visible region whose property leads to the applications in solar cell, liquid crystal display, thermal heater, and other sensors. This paper investigated ITO films as a transparent conducting films for application of poly-Si solar cells. ITO films were grown on glass substrate by RF magnetron sputtering method. To achieve high transmittance and low resistivity, we examined the various film deposition such as substrate temperature, gas pressure, annealing temperature, and deposition time. We recommend the substrate temperature of 500℃ and post annealing of 200℃ in O₂ atmosphere for good conductivity and transmittance. From XRD examination, ITO films showed a preferred (222) orientation. As substrate temperature increased from RT to 500℃, the intensity of the (222) peak increased. The highest peak intensity was observed at a substrate temperature of 500℃. With the optimum growth conditions, ITO films showed resistivity of 1.04×10-⁴Ω -㎝ and transmittance of 81.2% for a film 300㎚ thick in the wavelength range of the visible spectrum.