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Conductivity Enhancement of Silicon Nanowires
고재우,박성주,Xianhong Li,백인복,이성재,장문규 한국물리학회 2012 THE JOURNAL OF THE KOREAN PHYSICAL SOCIETY Vol.61 No.12
Current-Voltage (I-V) characteristics for various silicon wires of different length-to-width ratios were numerically calculated by solving the Poisson equation and the current continuity equations for electrons and holes self-consistently. We found that, as the silicon wire becomes thinner or the length-to-width aspect ratio becomes higher, the I-V deviates more from the Ohmic relation: the current density at a certain bias voltage becomes larger. In the case of a 500 nm-long silicon wire with n-type doping of 1?0<SUP>16</SUP> cm<SUP>3</SUP>, for example, the current density of a silicon wire at a bias voltage 2 volts increases near three-fold as a length-to-width ratio of wires increases from 1 to 25. This behavior is attributed to an enhanced field at the source due to the strong stray field configuration near contacts at both ends of a wire as well as a large carrier build-up in the middle. Our result suggests that the classical treatment of nanowire transport with a proper account of the nonuniform field distribution along a wire may partly explain the conductivity enhancement phenomenon often observed in various nanowires and nanotubes.
A Flexible Skin Patch for Continuous Physiological Monitoring of Mental Disorders
장원익,이봉국,류진화,백인복,유한영,김승환 한국물리학회 2017 THE JOURNAL OF THE KOREAN PHYSICAL SOCIETY Vol.71 No.8
In this study, we have newly developed a flexible adhesive skin patch of electrocardiogram (ECG) device for continuous physiological monitoring of mental disorders. In addition, this flexible patch did not cause any damage to the skin even after 24 hours attachment. We have also suggested the possibility of novel interconnection for copper film on polyimide and polydimethylsiloxane (PDMS) layers of the flexible patch. Self-align and soldering of IC chips such as resistor between metal pads on flexible skin patch have also successfully fabricated for 5 min at 180 C in vacuum oven. Low temperature interconnection technology based on a Sn42/Bi58 solder was also developed for flexible ECG devices. As a result, we can monitor the mental health status through a comprehensive analysis of biological signals from flexible ECG devices.