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UV Laser Rayleigh Scattering을 이용한 가스 성분의 농도 및 온도 분포 계측에 관한 실험적 연구
진성호(S.H.Jin),남기중(G.J.Nam),김희산(H.S.Kim),장래각(N.K.Chang),박승한(S.H.Park),깅웅(U.Kim),박경석(K.S.Park),김경수(G.S.Kim) 한국자동차공학회 1995 한국자동차공학회 춘 추계 학술대회 논문집 Vol.1995 No.11_2
Rayleigh Scattering Cross Sections(σ_i) of various gases and the temperature distributions of premixed Propane/O₂ flame are measured by high power KrF(248nm) Excimer laser and ICCD camera. Results show that σ_i of O₂ and Propane(C₃H_8) gases agree well in the 5% error range. but σ_i of H₂ has the more or less difference from the calculated value by other groups. This is attributed to the low RS signal of H₂ to noise level(SIN ratio).<br/> The temperature distributions of flame range out between 300K in the air and about 2000K in the burned area. In this temperature range, our system has the about 250K temperature resolution. Because low RS signals in the reaction area with high temperature are affected highly by noises, temperature uncertainty of this area is relatively high to another part of flame.<br/> Experimental results show that UV Rayleigh Scattering can be used for the measurement of mixing ratios of mixed gases and the temperature distributions of flame. Especially. this technique can be applied for the measurement of the mixing ratios of air/fuel before the ignition and the flame structure after the ignition inside the Engine.<br/>
다이오드레이저를 이용한 디스플레이 모듈 내 이방성 전도 필름(ACF) 접합 기술에 관한 연구
류광현(K. H. Ryu),서명희(M. H. Seo),남기중(G. J. Nam),곽노홍(N. H. Kwak) 한국레이저가공학회 2005 한국레이저가공학회지 Vol.8 No.3
A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.