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유럽규격(EN 50206-1)에 따른 팬터그래프의 온도상승 평가시험에 대한 연구
김경준(Kyoung-Joon Kim),노주현(Joo-Hyun Rho),최진(Jin Choi),이정율(Joung-Yul Lee) 한국철도학회 2013 한국철도학회 학술발표대회논문집 Vol.2013 No.11
본 논문은 국내에 적용중인 고속차량용 팬터그래프의 온도상승 평가시험의 절차 및 방법에 대해 언급하고 있다. 온도상승 평가시험은 전차선과의 상호작용에 따른 온도상승 유형을 확인하기 위해 EN 50206-1:2010에 따라 수행되어졌다. 또한, 본 논문에는 온도상승 평가시험을 위한 시험 조건과 시험 절차 등이 포함되었으며, 온도상승 평가시험에 사용된 전차선의 사양을 정리하였다. 이와 더불어 차량의 운행상태(정차 또는 동작)에 따라 팬터 그래프의 각 부위별 온도변화를 확인하여 팬터그래프의 전류집전 양에 따른 온도변화 유형에 대해 조사하였다. This paper deals with procedure of the Heating test of the HST"s Pantograph. The test have been performed according to the European standard EN 50206-1:2010 to submit producer requirement. This type of the pantograph is used for heavy traction vehicles like high speed train. In a contain of the paper is detailed described the process of the test and the conditions for right measurement. Finally is mentioned the evaluation of the test and the courses of temperature"s curve in part of pantograph head.
김경준(Kyoung-Joon Kim) 한국동력기계공학회 2021 동력시스템공학회지 Vol.25 No.3
Control modules should be reliable to sustain high precision semiconductor processing. High demand for those miniaturization and multifunctioning induces the increase of waste heat density so that effective thermal management of those is crucial. Two thermal packaging methods for the control module have been introduced, and then computational fluid dynamics (CFD) and thermal network models have been generated. The thermal performances of those with two packaging methods have been computationally analyzed. The CFD models have investigated parametric influences of incident air velocities, thermal interface materials, and via parameters on those thermal performances. The result reveals that the proposed thermal packaging method could drastically improve the thermal performance of the primary components by nearly up to 50%. It also finds that the influence of the number of vias is dominant compared with other via parameters on the thermal performance of the controller module.
김경준(Kyoung Joon Kim) 대한기계학회 2011 대한기계학회 춘추학술대회 Vol.2011 No.10
This paper reports the parametric behavior of the efficiency of the thermoelectric energy conversion associated with high power electronics. A fully-coupled thermoelectric model predicts the effect of the load resistance on the conversion efficiency for various waste heat rates of power electronics. The predicted results are verified with measurement, and the discrepancy between prediction and measurement is seen to be moderate. The study demonstrates the considerable effect of the load resistance on the conversion efficiency at high power electronics.