http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
마이크로 박판 미세 패턴 성형공정의 성형성에 대한 해석적 연구
차성훈 ( Sung Hoon Cha ),신명수 ( Myung Soo Shin ),김종호 ( Jong Ho Kim ),이혜진 ( Hye Jin Lee ),김종봉 ( Jong Bong Kim ) 한국고무학회 2009 엘라스토머 및 콤포지트 Vol.44 No.4
롤-롤(Roll to roll) 성형은 공정이 비교적 간단하고 생산 효율이 높은 중요한 금속 성형 공정이다. 이러한 이유로 롤-롤 성형 공정은 최근에 솔라셀 집전판, 디스플레이 격벽구조, 그리고 회로기판 성형 등 넓은 범위에서의 활용이 검토되고 있다. 본 연구에서는 솔라셀 집전판에 수십만 개의 홈을 성형하는 공정에 대해 유한요소해석을 수행하였다. 수백만 개 홈에 대한 성형을 해석하는 것은 컴퓨터 용량과 시간의 문제로 불가능하기 때문에 공정 설계를 가능하게 하는 최소의 문제 영역을 해석 결과를 바탕으로 설정하였다. 그리고, 홈의 형상과 온도에 따른 해석을 수행하여 그 결과를 분석함으로서 공정 설계의 방향성을 제시하였다. Roll-to-roll forming process is one of important metal processing technology because the process is simple and economical. These days, with these merits, roll-to-roll forming process is tried to be employed in manufacturing the circuit board, barrier ribs and solar cell plate. The solar cell plate may have millions of patterns, and the analysis of forming considering all the patterns is impossible due to the computational costs. In this study, analyses are carried out for various numbers of patterns and the results are compared. It is shown that the analyses results with four row patterns and twelve row patterns are same. So, it is considered that the analysis can be carried out for only four rows of pattern for the design of incremental roll-to-roll forming process. Also formability is analysed for various number of mesh, protrusion shapes and forming temperature.
차성훈(S.-H. Cha),신명수(M.-S. Shin),김종호(J.-H. Kim),이혜진(H. J. Lee),김종봉(J.-B. Kim) 한국소성가공학회 2009 금형가공 심포지엄 Vol.2009 No.11
Roll-to-roll forming process is one of important metal processing technology because the process is simple and economical. These days, with these merits, roll-to-roll forming process is tried to be employed in manufacturing the circuit board, barrier ribs and solar cell plate. However, it is difficult to apply to the forming of micro scale or sub-micro scale pattern. In this study, the roll forming processing for the micro scale is designed and analyzed. The forming of micro pattern for photovoltaic plate of a solar cell by incremental roll forming process is analyzed. The solar cell plate may have millions of patterns, and the analysis of forming considering all the patterns is impossible due to the computational costs. In this study, analyses are carried out for various numbers of patterns and the results are compared. It is shown that the analyses results with four row patterns and twelve row patterns are same. So, it is considered that the analysis can be carried out for only four rows of pattern for the design of incremental roll-to-roll forming process. Also formability is analyzed for various protrusion shapes at various forming temperatures.
Analysis of a Micro Pattern Forming on the Thin Sheet Metal for Electronic Device
Sung-Hoon Cha,Jong-Bong Kim,Jong-Ho Kim,Hye-Jin Lee 한국소성가공학회 2010 기타자료 Vol.2010 No.6
Roll-to-roll forming process is one of important metal processing technology because the process is simple and economical. These days, roll-to-roll forming process is tried to be employed in manufacturing the circuit board, barrier ribs and electric device panel. However, it is difficult to apply the roll-to-roll forming into the forming of micro scale or sub-micro scale cavities. In this study, the roll-to-roll forming process for the forming of micro scale cavities is designed and analyzed. The electric device panel may have thousands of cavities in periodic arrays. In this case the analysis of forming considering all the cavities is impossible due to the computational costs. Therefore, analyses are carried out for various numbers of cavity arrays. Based on the analysis results, the optimum analysis conditions are found that guarantee the analysis results and computational efficiency. Then the cavity shape is designed in viewpoint of formability. The formability of the designed cavity is predicted in terms of filling ration and damage value. The optimum pitch distance and draft angle are decided considering the Cockcroft-Latham damage value and under-fill defects.