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초소형 마이크로 스프링의 기계적 특성에 관한 해석 및 실험
추성일(Sung-il Chu),김진혁(Jin-hyuk Kim),문성욱(Sung-wook Moon) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6
Recently, because of development of semiconductor technology, number of pads at unit area is increasing and pad array have become irregular 2-dimensional. Therefore, we have developed micro-spring for application of vertical type MEMS probe tip with small area(about 100㎛²). Main process of fabrication is wafer bonding, Si etching by DRIE and elector-plating, and material of the electro-plated micro-spring is Ni-Co alloy. For the design optimization, we designed various models and measured successfully produced micro-springs in micro compression & tensile tester. Structure analysis of the micro-spring was accomplished with FEM(Finite Element Method) and compared with measurement value. In this study, we verified potentiality for application of the vertical type probe tip with small area, showing displacement of 10~40㎛ at contact force of 1~8g<SUB>f</SUB>.
이승훈(SeungHun LEE),추성일(Sung il Chu),김진혁(Jin Hyuk Kim),서호원(Ho Won Seo),한동철(Dong-Chul HAN),문성욱(Sung Moon) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.5
The Probe Card is a test component which is to classify the good semiconductor chips before the packaging. The yield of semiconductor product can be better from analysis of probe test information. Recently the technology of the probe card needs narrow width and large amount of probe tip. In this research, the probe tip based on the MEMS(micro electro mechanical system) technology was designed and fabricated to improve the reliability of the test and to meet 2-dimensional Array of tip. The mechanical and electrical properties of proposed tip were evaluated and it has over 100,000 of repetition times in the condition of 5gf, 20um Over Drive.