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A Range-Based Localization Algorithm for Wireless Sensor Networks
Zhang Yuan,Wu Wenwu,Chen Yuehui The Korea Institute of Information and Commucation 2005 Journal of communications and networks Vol.7 No.4
Sensor localization has become an essential requirement for realistic applications over wireless sensor networks (WSN). In this paper we propose an ad hoc localization algorithm that is infrastructure-free, anchor-free, and computationally efficient with reduced communication. A novel combination of distance and direction estimation technique is introduced to detect and estimate ranges between neighbors. Using this information we construct unidirectional coordinate systems to avoid the reflection ambiguity. We then compute node positions using a transformation matrix [T], which reduces the computational complexity of the localization algorithm while computing positions relative to the fixed coordinate system. Simulation results have shown that at a node degree of 9 we get $90\%$ localization with $20\%$ average localization error without using any error refining schemes.
Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil
Linping Yu,Long Chen,Qizhi Chen,Luli Feng,Ziyi Xu,Bo Nan,Xiyue Kang,Yuehui He 한국공업화학회 2021 Journal of Industrial and Engineering Chemistry Vol.103 No.-
Cost-effective ultrathin alloy foils (<20 lm) are highly expected with the development of electronicindustry and micro-system technology. In this paper, electrodeposition combined with vacuum sinteringis used to fabricate a Ni-Cu alloy foil with thickness of 12.0 (±0.2) lm. For the ultrathin Ni-Cu alloy foil, adensified structure without pores can be achieved by prolonging sintering duration at 900 ℃ for 3 h. Under the current density of 10 mA cm 2, 700 s is the optimal electrodeposition time to obtain the highesttensile strength (187 MPa) with the Ni content of 41.5 wt.% in the alloy foil. Compared with Cu foil, Ni-Cu alloy foil shows superior corrosion resistance in 3.5 wt.% NaCl solution and also HCl solutions (0.5 mol/L, 1.0 mol/L, 2.0 mol/L), respectively. The uniform composition and defect-free surface, excellent tensilestrength and corrosion resistance together exhibits the great application potential of the obtained Ni-Cualloy foil, which may provide an inspiration for future development of integrated electronic or medicaldevices.