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Anti-frost coatings containing carbon nanotube composite with reliable thermal cyclic property
Sohn, Yoonchul,Kim, Dongouk,Lee, Sangeui,Yin, Mingming,Song, Jae Yong,Hwang, Wootaek,Park, Sunghoon,Kim, Hajin,Ko, Youngchul,Han, Intaek The Royal Society of Chemistry 2014 Journal of Materials Chemistry A Vol.2 No.29
<P>One of the most important applications for superhydrophobic coatings is anti-frosting for safety and energy conservation. Safety concerns are especially critical in cold-climate regions where the daily temperature fluctuation is large. However, superhydrophobic coatings have not been studied in terms of their thermomechanical reliability. In this study, wetting characteristics and stress relaxation behavior were quantitatively investigated with multi-walled carbon nanotube (MWNT)-silicone composite films under thermal cycling conditions. It is concluded that an open structure with numerous nanopores among the fillers, constituting air pockets described as the “Cassie structure,” is of great importance not only for developing a film's superhydrophobic nature but also for accommodation of thermal stress that results from a difference in coefficient of thermal expansion between the coating and the substrate. The amount of stress relaxation for a 30 vol% MWNT-silicone composite film with open structure reaches ∼80% of the value for its counterpart with a closed structure and no pores. A superhydrophobic MWNT-silicone composite film that can endure over 4000 thermal cycles (−30 °C to room temperature) is fabricated by controlling the composition and microstructure of the composite. In addition, the importance of the size and shape of the nanofillers in delaying nucleation and growth of frost on superhydrophobic coatings is also discussed.</P>
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재사용성 및 용이성을 위한 계층적 아바타 행위 스크립트 언어의 정의
김재경(Jaekyung Kim),최승혁(Seunghyuk Choi),손원성(Wonsung Sohn),임순범(Soonbum Lim),최윤철(Yoonchul Choy) 한국정보과학회 2006 정보과학회논문지 : 시스템 및 이론 Vol.33 No.8
아바타 스크립트 언어는 사이버 공간에서 아바타의 동작을 제어하기 위해서 사용되는 명령어들로 이루어져있다. 사용자가 아바타 동작 스크립트 언어를 쉽게 작성하기 위해서는 스크립트 언어의 행위 표현이 복잡한 하위수준 동작 표현 요소로부터 최대한 추상화되어야 한다. 또한 작성된 시나리오 스크립트가 다양한 구현환경에 적용 될 수 있는 표준적인 구조를 가지고 있어야 한다. 이를 위해 본 논문에서는 작업수준 행위, 상위수준 동작 및 기본 동작 스크립트 언어로 구성된 계층적 아바타 행위 표현 언어를 정의하였다. 각 계층의 언어는 사용자의 스크립트 작성을 위한 행위 요소와 아바타 동작 시퀀스 및 구현 환경의 기하 정보를 분리하여 표현한다. 제안 언어를 통하여 사용자는 추상화된 스크립트 작성이 가능하며 작성된 스크립트는 번역 과정을 거쳐 다양한 구현 환경에 적용이 가능하다. 구현 결과에서는 제안 기법을 적용한 시스템을 구축하여 사이버 교육 도메인 환경에서 아바타 스크립트 시나리오의 작성 과정 및 스크립트가 다양한 응용 프로그램에 유연하게 적용되는 것을 보여준다. An avatar script language consists of commands set which is used to control avatar behaviors in cyberspace. The script language should be abstract from complex low-level concepts, so that a user can write down a scenario script easily without concerning about physical motion parameters. Also, the script should be defined in a standard format and structure to allow reusing in various implementation tools. In this paper, a layered script language is proposed for avatar behavior representation and control, which consists of task-level behavior, high-level motion and primitive motion script language. The script language of each layer represents behavior elements for a scenario scripting interface, an avatar motion sequence, and geometric information of implementation environment, respectively. Therefore, a user can create a scenario script by abstract behavior interface and a script can be applied to various implementations by the proposed translating process. A presentation domain is chosen for applying the proposed script language and the implementation result shows that the script is flexibly applied in several applications.
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Ru Nanoparticle이 첨가된 Sn-58Bi 솔더의 기계적 신뢰성 및 계면반응에 관한 연구
김병우,최혁기,전혜원,이도영,손윤철,Kim, Byungwoo,Choi, Hyeokgi,Jeon, Hyewon,Lee, Doyeong,Sohn, Yoonchul 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.2
대표적인 저온솔더인 Sn-58Bi에 Ru nanoparticles을 첨가하여 Sn-58Bi-xRu 복합솔더를 제작하고 Cu/OSP 및 ENIG 표면처리된 PCB 기판과 반응시켜 계면반응 및 솔더조인트 신뢰성을 분석하였다. Cu/OSP와의 반응에서 형성된 Cu<sub>6</sub>Sn<sub>5</sub> IMC는 Ru 함량에 따른 두께 변화가 거의 없고 100hr aging 후에도 큰 변화없이 고속 전단시험시 솔더 내부로 연성파괴가 발생하였다. ENIG 와의 반응시에는 Ru 함량이 증가함에 따라서 Ni<sub>3</sub>Sn<sub>4</sub> IMC 두께가 감소하는 경향을 보였으며 일부 시편에서 ENIG 특유의 취성파괴 현상이 발견되었다. Ru 원소는 계면 부근에서 발견되지 않아서 계면반응에 크게 관여하지 않는 것으로 판단되며 주로 Bi phase와 함께 존재하는 것으로 분석되고 있는데 어떠한 형태로 두 원소가 공존하고 있는지에 대해서는 추가적인 연구가 필요하다. Sn-58Bi-xRu composite solders were prepared by adding Ru nanoparticles to Sn-58Bi, a typical low-temperature solder, and the interfacial reaction and solder joint reliability were analyzed by reacting with Cu/OSP and ENIG surface treated PCB boards. The Cu<sub>6</sub>Sn<sub>5</sub> IMC formed by the reaction with Cu/OSP had little change in thickness depending on the Ru content, and ductile fracture occurred inside the solder during the high-speed shear test without any significant change even after 100 hr aging. In reaction with ENIG, the Ni<sub>3</sub>Sn<sub>4</sub> IMC thickness tended to decrease as the Ru content increased, and ENIG-specific brittle fracture was found in some specimens. Since Ru element is not found near the interface, it is judged not to be significantly involved in the interfacial reaction, and it is analyzed that it mainly exists together with the Bi phase.
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Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Chu, Kunmo,Bae, Ki Deok,Song, Byong Gwon,Kim, Jaekwan,Park, Yong Young,Xianyu, Wenxu,Lee, Chang Seung,Sohn, Yoonchul Elsevier 2018 APPLIED SURFACE SCIENCE - Vol.453 No.-
<P><B>Abstract</B></P> <P>Thin-film encapsulation (TFE) is of great importance as a barrier film to protect organic devices and displays. A serious problem with the application of TFE is degradation of organic devices with penetration of oxygen and water vapor through pinholes having sub-micron size. Though many studies were tried to identify the pinholes, quantitative analysis of pinhole area has not been found yet. In this study, total pinhole area in TFE layer was quantitatively analyzed with the help of the Cu bumps electrodeposited on the pinholes. Empirical growth rate of the Cu bumps revealed that bump radius (r) and plating time (t) had a relationship of r<SUP>3</SUP> ∝ t. While size of the pinholes was deduced from starting point of Cu bump growth, number of the pinholes was extracted from size distribution of the Cu bumps. Unique feature of Cu bump morphology is also explained with a compositional analysis, demonstrating dissolution of Ni underlayer and its involvement in the formation of the Cu bumps.</P> <P><B>Highlights</B></P> <P> <UL> <LI> Quantitative analysis of the pinholes in SiON thin film encapsulation is provided. </LI> <LI> Kinetic growth rate of electrodeposited Cu bumps on the pinholes was established. </LI> <LI> Pinhole size was deduced from the kinetic growth curve of the Cu bumps. </LI> <LI> Dissolved Ni underlayer involved in the formation of the Cu bumps. </LI> </UL> </P> <P><B>Graphical abstract</B></P> <P>[DISPLAY OMISSION]</P>
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