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Chang-Jie Xu,Qizhi Chen,Jian Zhou,Yuanqiang Cai 대한토목학회 2015 KSCE Journal of Civil Engineering Vol.19 No.7
Based on the Biot’s theory of wave propagation in porous media, this paper studies the transient dynamic response of spherical cavity in viscoelastic and saturated soils. The analytical solution in transformed domain is obtained by the method of Laplace transformation, and numerical results are solved through inversed Laplace transformation. The displacements, stresses and pore water pressure developed in the viscoelastic soils are analyzed and compared with those from elastic model, and some new observations are discussed and interpreted from the perspective of material's properties. The findings resulting from the current study are helpful to analyzing the transient dynamic responses of underground structures in the engineering practice.
Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil
Linping Yu,Long Chen,Qizhi Chen,Luli Feng,Ziyi Xu,Bo Nan,Xiyue Kang,Yuehui He 한국공업화학회 2021 Journal of Industrial and Engineering Chemistry Vol.103 No.-
Cost-effective ultrathin alloy foils (<20 lm) are highly expected with the development of electronicindustry and micro-system technology. In this paper, electrodeposition combined with vacuum sinteringis used to fabricate a Ni-Cu alloy foil with thickness of 12.0 (±0.2) lm. For the ultrathin Ni-Cu alloy foil, adensified structure without pores can be achieved by prolonging sintering duration at 900 ℃ for 3 h. Under the current density of 10 mA cm 2, 700 s is the optimal electrodeposition time to obtain the highesttensile strength (187 MPa) with the Ni content of 41.5 wt.% in the alloy foil. Compared with Cu foil, Ni-Cu alloy foil shows superior corrosion resistance in 3.5 wt.% NaCl solution and also HCl solutions (0.5 mol/L, 1.0 mol/L, 2.0 mol/L), respectively. The uniform composition and defect-free surface, excellent tensilestrength and corrosion resistance together exhibits the great application potential of the obtained Ni-Cualloy foil, which may provide an inspiration for future development of integrated electronic or medicaldevices.