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Kevin Ray Ayag,Gustavo Panama,Shrabani Paul,김홍두 대한화학회 2017 Bulletin of the Korean Chemical Society Vol.38 No.2
Previous studies successfully produced conductive thin films from organo-metallic-compounds-based inks. Some inks like those made from copper salt and amines, however, tend to move during thermal annealing and, thus, affect the conductive pattern on the substrate. In this study, conductive inks were synthesized by forming complexes of copper with amines and/or blended amines. To build-up an organo-metallic framework and preserve the pattern throughout the annealing period, diamine was added to the complex in different proportions. The prepared inks were coated on glass substrate and were annealed on a hot plate at 170°C under the gaseous mixture of formic acid and alcohol for 5 min. The metallic film was observed to retain the original pattern of the ink during and after annealing. Adhesion on the substrate was also improved. Inks with blended amines produced films with lower resistivities. The lowest electrical resistivity recorded was 4.99 μΩ cm, three times that of bulk copper.
Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics
Hwang, Jaeeun,Kim, Sinhee,Ayag, Kevin Ray,Kim, Hongdoo Korean Chemical Society 2014 Bulletin of the Korean Chemical Society Vol.35 No.1
Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at $110^{\circ}C$ to $150^{\circ}C$ to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of $1.88{\mu}{\Omega}{\cdot}cm$ of copper film was obtained at $150^{\circ}C$ in gaseous formic acid condition. The long-term resistivity shows to increase from $1.88{\mu}{\Omega}{\cdot}cm$ to $2.61{\mu}{\Omega}{\cdot}cm$ after one month.
Solution-route low-temperature fabrication of thin-film p-n junctions
Panamá,, Gustavo,Ayag, Kevin,Kim, Hongdoo IOP 2016 Semiconductor science and technology Vol.31 No.11
<P>In this work, p-n junctions were fabricated at low temperature by means of UV-assisted thermal annealing. At 200 °C, remarkable rectifying and optical properties were observed due to the conversion of the sol–gel precursors to oxide films, which was aided by UV exposure. The resulting p-NiO/n-ZnO structures are featured as the thinnest ever reported (≈55 nm) based on a solution process with a large forward electrical current 10<SUP> <I>−</I>2</SUP> –10<SUP> <I>−</I>1</SUP> A cm<SUP>−2</SUP> and the lowest leakage current (1 <I>μ</I>A cm<SUP>−2</SUP>). UV light and precursor solution engineering contributed to form metal-oxide bonding at relatively low temperature in ambient conditions. The heterojunctions fabricated by the proper combination of these alternatives and simple processes were evaluated using UV-vis and FT-IR spectroscopy, FE-SEM, AFM, XRD, XPS, and <I>I–V</I> curves.</P>
Mohammad Shamim Reza,Kevin Ray Ayag,유미경,김갑진,김홍두 한국섬유공학회 2019 Fibers and polymers Vol.20 No.2
Electrospun Spandex nanofiber webs having very high amount of nano-sized open cell can be used as a piezocapacitive sensor for monitoring both static and dynamic pressures due to excellent electrospinnability and very good elastic properties. Compared to our previously reported SBS and TPU electrospun nanoweb, Spandex showed relatively linearincrease of capacitance with applied pressure and restored its initial thickness when the pressure was released due to the improved resilience and elasticity. Moreover, small amount of ionic liquid (IL) was added in Spandex dope solution to increase the sensitivity of sensor to pressure, which induced very large amount of capacitance change with pressure, as well as reducing the capacitance-pressure hysteresis. In this work, hysteresis of the sensor was assessed through measuring the capacitance values during 20 cyclic loading and unloading and was improved significantly from 7.5 % to 1.8 %. Creep andstress relaxation behaviors were also tested through measuring capacitance under the constant loading and loading under the constant capacitance as a function of time respectively, using a dynamic pressure tester and an LCR meter. The results are reported in detail.
Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics
황재은,Sinhee Kim,Kevin Ray Ayag,HongDooKim 대한화학회 2014 Bulletin of the Korean Chemical Society Vol.35 No.1
Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at 110 o C to 150 o C to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of 1.88 ㏁·cm of copper film was obtained at 150℃ in gaseous formic acid condition. The long-term resistivity shows to increase from 1.88 ㏁·cm to 2.61㏁·cm after one month.