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내열성 폴리이미드 박막의 Curing 온도에 따른 Residual Stress 거동
정현수,박성국,임창호,황재욱,조영일,한학수 ( H . S . Chung,S . G . Park,C . H . Lim,J . W . Hwang,Y . I . Joe,H . S . Han ) 한국공업화학회 1997 응용화학 Vol.1 No.1
The object of this study is to demonstrate that residual stress behaviors in poly(4,4`-oxydiphenylene pyromellitimide) (PMDA-ODA) films which depend on the degree of chain rigidity, thickness change during the curing process and the degree of imidization according to the polyimide morphology transition and solvent evaporation. The comparison of the residual stress in PMDA-ODA thin film formed from different precursor (amic acid and amic ester type) indicates that the residual stress of a polyimide thin film is primarily dependent on the polymer chain rigidity due to thermal expansion properties. And the higher curing temperature of polyimide thin films shows the higher residual stress in tension on the Si wafer substrate.