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Nanoindenter를 이용한 박막 및 미소가공 제품 기계적 특성 평가
한준희(Jun Hee Hahn),이광렬(Kwang Ryeol Lee),김광석(Kwang Seok Kim),박준협(Jun Hyub Park) 대한기계학회 2002 대한기계학회 춘추학술대회 Vol.2002 No.3
Mechanical properties of thin films for the membrane of ink-jet printer head were tested with cantilever beam bending method using nanoindenter after fabricating in the form of micro cantilever beam(μ-CLB) and with continuous stiffness measurement(CSM) nanoindentation method. The films for membrane included multi-layered SiO₂/poly-Si/SiN/SiO₂ film, CVD diamond film, SiO₂ film and SiN film. The elastic moduli of SiO₂ film and SiN film measured with each method were compared. And the elastic modulus and hardness of 1MeV He? and 1MeV Cl? implanted polyimide were measured using CSM nanoindentation method. The results show that the modulus and strength of multi-layered film increase from 56.53 ㎬ and 1.834 ㎬ to 68.08 ㎬ and 2.495 ㎬, respectively as the width of CLB decreases from 58.5 m to 18.5 m. And the elastic moduli of SiO₂ and SiN films measured with cantilever beam bending method are 69 ㎬ and 215.45 ㎬, respectively and the elastic moduli of these films on silicon substrate measured with CSM(continuous stiffness measurement) method are 98.78 ㎬ and 219.38 ㎬, respectively. These results show that with μ-CLB bending technique, moduli can be measured to within 2%. 1MeV He? and 1MeV Cl? implantation increased the hardness of poly imide from 0.26 ㎬ to 1.8 ㎬ and 6.2 ㎬ and the modulus over 4 and 13 times respectively.
이온빔보조증착법으로 합성한 hexagonal BN막의 hexagonal ring의 배열과 결정성
박영준(Young-Joon Park),한준희(Jun-Hee Hahn),이정용(Jeong Yong Lee),백영준(Young-Joon Baik) 한국진공학회(ASCT) 1999 Applied Science and Convergence Technology Vol.8 No.1
이온빔보조증착법으로 h-BN을 증착하여 이온에너지 및 기판온도에 따른 hexagonal ring의 배열 및 결정성의 변화를 연구하였다. 보론은 전자빔으로 1.5 Å/sec의 속도로 증발시켰으며, 질소는 end-hall 형 이 온건으로 60, 80, 100eV의 에너지로 공급하였다. 기판의 온도는 상온 (no heating), 200, 400, 500, 800℃로 변화시켰다. 질소이온에너지가 증가할수록 hexagonal ring의 c-축은 기판에 평행하게 배열하여 100 eV의 질소이온 에너지에서 가장 좋은 배열을 나타내었다. 이는 이온에너지가 높을수록 합성 막에 큰 압축응력이 발생하기 때문으로 생각된다. 기판온도에 따라서는 온도가 증가함에 따라 배열이 증가하다가 약 400℃에서 최대가 되고 그 보다 높은 온도에서는 배열이 감소하였다. 그리고 결정도는 온도가 증가할수록 향상되었다. 이러한 경향들은 온도가 증가함에 따라 원자 이동도는 증가하고 응력발생은 어려워지는 경향으로부터 잘 설명된다. 또한 nano-indentor로 측정한 h-BN막의 경도는 c-축의 배열정도와 같은 경향을 보였다. 이온빔보조증착법은 hexagonal ring의 배열을 통한 h-BN막 성질의 최적화에 효과적인 방법으로 판단된다. We have studied the alignment and the lattice quality of hexagonal rings of h-BN films synthesized by ion beam assisted deposition (lBAD) method. Boron was e-beam evaporated at 1.5 Å/sec and nitrogen gas was ionized using end-hall type ion gun at 60, 80, and 100 eV, respectively. Substrate was either not heated or heated at 200, 400, 500, and 800℃, respectively. As nitrogen ion energy increases, c-axes of hexagonal rings tend to align parallel to the substrate, which is explained by larger compressive stress at higher ion energies. Alignment of c-axis increases with temperature and shows maximum around 400℃. The lattice quality of hexagonal rings improves with temperature. Such behaviors can be understood from two counter trends of increasing the atomic mobility and decreasing compressive stress with temperature. Hardness of h-BN films shows the same trend with the alignment of c-axis. Ion beam assisted deposition method seems to be effective for aligning hexagonal rings and optimizing h-BN properties.
전기 도금 법으로 제조된 Cu 박막 구조물의 탄성계수와 미세조직과의 연관성 연구
김영무(Youngmoo Kim),한준희(Jun-Hee Hahn),이창승(Chang Seung Lee),박준협(Jun-Hyub Park),홍순형(Soon Hyung Hong) 대한기계학회 2003 대한기계학회 춘추학술대회 Vol.2003 No.8
This paper reports on the manufacturing, surface morphology and Young's modulus of Cu thin films used as MEMS (micro-electro-mechanical systems) devices. Nanoindentation test and microcantilever bending test were performed to evaluate the mechanical properties, especially Young's modulus of these thin films. Cu thin film specimens were produced by MEMS fabrication techniques such as sputtering, electrochemical deposition, lithography and silicon bulk micromachining. Surface morphologies of specimens were measured by atomic force microscopy (AFM). Young's moduli of Cu electrodeposited films were decreased with increasing the thickness of specimens. From these results, it was shown that Young's modulus of Cu thin films had anisotropy with crystal orientations. Elastic moduli were varied with the thickness of thin film due to the texture of Cu thin films. Young's modulus of Cu thin films can be predicted by using two methods. One is to use the elastic modulus of single crystal and the information of distribution of crystal orientation, Voigt model. The other is to calculate it from load-deflection curves computed with ABAQUS. The theoretical estimation of elastic modulus using texture analysis showed good agreement with the results of nanoindentation test. But in computational modeling, Young's moduli were different from the results of bending test with isotropic and anisotropic Cu beams having (001) texture.
허용학(Yong-Hak Huh),김동일(Dong-Iel Kim),한준희(Jun-Hee Hahn),김광석(Gwang-Seok Kim),연순창(Soon-Chang Yeon),김용협(Yong-Hyub Kim) 대한기계학회 2004 대한기계학회 춘추학술대회 Vol.2004 No.4
Tensile properties of hard coating material, TiN, were evaluated using micro-tensile testing system. TiN has been known as a hard coating material commonly used today. Micro-tensile testing system consisted of a micro tensile loading system and a micro-ESPI(Electronic Speckle Pattern Interferometry) system. Micro-tensile loading system had a maximum load capacity of 500mN and a resolution of 4.5 ㎚ in stroke. TiN thin film 1㎛ thick was deposited on the Si wafer pre-deposited of Si₃N₄ film substrate by the closed field unbalanced magnetron sputtering (CFUBMS) process. Three kinds of micro-tensile specimen with the respective width of 50㎛, 100㎛ and 500㎛ were fabricated by MEMS process. The mechanical properties including tensile strength and elastic modulus were determined using the micro-tensile testing system and compared by those obtained by nano-indentation