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하상백(S. B. Ha),최성주(S. J. Choi),안대균(D. K. Ahn),김인수(I. S. Kim),최영휴(Y. H. Choi) 한국정밀공학회 2006 한국정밀공학회 학술발표대회 논문집 Vol.2006 No.5월
In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become diffcult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table for fixing a semiconductor wafer rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.